Patents for C09G 1 - Polishing compositions (7,846)
03/2006
03/02/2006US20060042501 Polishing liquid
03/01/2006EP1525280B1 Aqueous resin dispersion for floors, and floor polish using same
03/01/2006CN1742066A Method of polishing a silicon-containing dielectric
03/01/2006CN1742065A Selective barrier metal polishing solution
02/2006
02/28/2006US7005384 Chemical mechanical polishing method, and washing/rinsing method associated therewith
02/28/2006US7005382 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing process, production process of semiconductor device and material for preparing an aqueous dispersion for chemical mechanical polishing
02/28/2006US7005085 Composite oxide; fine particle size; generating aerosols, heating to remove liquid, coating surfaces
02/28/2006US7004994 Method for making a film from silver-containing particles
02/28/2006US7004819 CMP systems and methods utilizing amine-containing polymers
02/23/2006US20060039846 Ceria composition and process for preparing same
02/23/2006US20060037251 abrasives; for wirings of semiconductor devices
02/23/2006DE102005027212A1 Spülzusammensetzung und Verfahren zum Spülen und Herstellen von Siliziumwafern Rinsing composition and methods for rinsing and preparing silicon wafers
02/22/2006EP1628334A1 Polishing liquid for cmp process and polishing method
02/22/2006EP1626838A1 Exposing substance, exposing method, and exposing device
02/22/2006EP1343852B1 System for covering floors
02/22/2006CN1739192A Methods for planarization of group VIII metal-containing surfaces using complexing agents
02/22/2006CN1738928A Compositions for copper, tantalum and tantalum nitride chemical mechanical method complanation
02/22/2006CN1737071A Polishing slurry, method of producing same, and method of polishing substrate
02/22/2006CN1243370C Slurry composition for use in chemical mechanical polishing of metal wiring
02/22/2006CN1243071C Metal grinding liquid material, metal grinding liquid, its producing method and grinding method using it
02/21/2006US7001463 Polish compositions
02/21/2006US7001253 an abrasive, a carrier, and either boric acid, or a conjugate base in a non-buffered aqueous solution; abrasive can be fixed on a pad or suspended in solution; high speed polishing, planarization efficiency, uniformity
02/16/2006WO2006016030A1 Mechanochemical polishing composition, preparing and using method
02/16/2006US20060034745 Ceria composition and process for preparing same
02/15/2006CN1735671A Passivative chemical mechanical polishing composition for copper film planarization
02/15/2006CN1735670A Composition and method used for chemical mechanical planarization of metals
02/15/2006CN1735669A Self-shining aerosol-type shoe polish composition
02/15/2006CN1733856A Slurry, chemical mechanical polishing method using the slurry, and method of forming metal wiring using the slurry
02/15/2006CN1241993C Photoprotectant for wood olein floor and furniture and its preparing process
02/14/2006US6998066 and a chelating agent forming a chemical mechanical polishing emulsion; chemical stability, improved selectivity, corrosion inhibition, broad pH operating range
02/09/2006US20060030243 Polishing composition
02/09/2006US20060029832 High surface quality GaN wafer and method of fabricating same
02/09/2006US20060027534 Chemical mechanical machining for polishing surfaces such as semiconductors and oxidizers and/or abrasives
02/08/2006EP1622742A2 Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same
02/08/2006EP1622741A1 Dispersion for chemical-mechanical polishing
02/08/2006CN1240798C Use of polishing composition and method for polishing storage hard disc
02/08/2006CN1240797C Polishing agent and method for producing planar layers
02/07/2006US6995090 Polishing slurry for use in CMP of SiC series compound, polishing method, and method of manufacturing semiconductor device
02/07/2006US6994802 includes phosphors having a small particle size, narrow particle size distribution, spherical morphology and good crystallinity; utilized in cathode ray tube (CRT) screens for televisions and similar devices
02/07/2006US6993934 Dental glass powders
02/07/2006CA2497731C Magnetorheological polishing devices and methods
02/07/2006CA2234761C Deterministic magnetorheological finishing
02/02/2006WO2005068572A3 Chemical-mechanical polishing of metals in an oxidized form
02/02/2006US20060025505 Polish having improved abrasion resistance
02/02/2006US20060024967 Polishing composition for noble metals
02/01/2006EP1621595A1 Method of manufacturing polishing slurry for use in precise polishing process
02/01/2006EP1620518A2 Coated metal oxide particles for cmp
02/01/2006EP1620517A2 Slurry compositions for use in a chemical-mechanical planarization process having non-spherical abrasive particles
02/01/2006EP1601734A4 Self-shining aerosol-type shoe polish composition
02/01/2006EP1242557B8 Method of polishing or planarizing a substrate
02/01/2006CN1727421A Maintaining agent for automobiles
02/01/2006CN1240112C Slurry for mechanical polishing (CMP) of metals and use thereof
02/01/2006CN1239647C Double-component paint composition and preparation method
01/2006
01/31/2006US6992125 Wax formulations and their use for maintaining and preserving surfaces
01/31/2006US6992051 paint sealant, clear coat cleaner, fast acting paint restorer, polymer paint sealant, velocity glaze; single application; high gloss finish on hard surfaces without extensive polishing; automobiles, glass, plastics, tile, floor coverings
01/26/2006WO2006009641A1 Method of polishing a tungsten-containing substrate
01/26/2006WO2006009640A1 Cmp composition for improved oxide removal rate
01/26/2006WO2005033234A3 Novel slurry for chemical mechanical polishing of metals
01/25/2006EP1618163A1 Methods for machining ceramics
01/25/2006EP1570015A4 Passivative chemical mechanical polishing composition for copper film planarization
01/25/2006CN1726266A Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
01/25/2006CN1726265A Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
01/25/2006CN1238560C Solution used for platinum chemical mechanical polishing
01/25/2006CN1238455C Slurry for chemical mechanical polishing
01/25/2006CN1238454C Two component protective lustering agent for coated surface
01/24/2006CA2382724C Nanometer-sized silica-coated alpha-alumina abrasives in chemical mechanical planarization
01/19/2006US20060014657 Etching; corrosion resistance
01/19/2006DE19836831B4 Poliermittel zum Polieren von Halbleiterscheiben Polishing agents for polishing semiconductor wafers
01/18/2006EP1616927A1 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
01/18/2006EP1616926A1 Slurry composition and method for chemical polishing of copper integrated with tungsten based barrier metals
01/18/2006EP1616896A1 Compositions and articles comprising hydrocarbon-terminated polyether-polyamide block copolymers
01/18/2006EP1615975A1 Shoe and leather care product
01/18/2006CN1723007A Aerosol delivery systems
01/18/2006CN1721473A Aqueous compositions with polyvalent metal ions and dispersed polymers
01/18/2006CN1721052A Waterpower liquid
01/18/2006CN1236845C Bis (perfluoroalkanesulfonyl)imides and their salts as surfactants/additives for applications having extreme environments and methods thereof
01/17/2006US6986798 Cerium-based abrasive, production process thereof
01/12/2006WO2006004258A1 Chemical mechanical polishing slurry composition for shallow trench isolation process of semiconductor
01/12/2006WO2005097930A3 Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer
01/12/2006US20060006142 Method for polishing organic film on semiconductor substrate by use of resin particles, and slurry
01/11/2006CN1720305A Biliquid foam furniture polish
01/11/2006CN1720304A Wipes impregnated with biliquid foam treating liquids
01/11/2006CN1720303A Aerosol biliquid foam
01/10/2006US6984588 Compositions for oxide CMP
01/05/2006WO2006001945A1 Fluorochemical oligomeric polish composition
01/05/2006WO2006001558A1 High selectivity cmp slurry composition for sti process in semiconductor manufacture
01/05/2006US20060000808 Polishing solution of metal and chemical mechanical polishing method
01/05/2006DE102005007368A1 Schmierend wirkende Polymer-Wasser-Mischung Lubricating acting polymer-water mixture
01/05/2006CA2578351A1 Surface-treatment agent
01/04/2006EP1612249A1 Polishing solution of metal and chemical mechanical polishing method
01/04/2006EP1611054A1 Process for the production of metal oxide and metalloid oxide dispersions
01/04/2006EP1590421A4 Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents
01/04/2006CN1715358A Polishing composition
01/04/2006CN1234798C Composition for grinding and manufacturing method of storage hard disk using said composition
12/2005
12/29/2005WO2005123969A1 Polish composition for leather or synthetic leather
12/29/2005WO2005123888A1 Matrix liquid for producing a chip removal suspension, and used as a lubricating or machining liquid
12/29/2005WO2005123864A1 Flowable polishing compound paste, method for production thereof and use thereof
12/29/2005WO2005123858A1 CHEMICAL-MECHANICAL POLISHING (CMP) SLURRY CONTAINING CLAY AND CeO2 ABRASIVE PARTICLES AND METHOD OF PLANARIZING SURFACES
12/29/2005WO2005123857A1 Polishing method for glass substrate, and glass substrate
12/29/2005WO2005100496A3 Chemical-mechanical polishing composition and method for using the same
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