Patents for C09G 1 - Polishing compositions (7,846)
07/2006
07/20/2006US20060160475 Chemical mechanical polishing compositions for metal and associated materials and method of using same
07/20/2006US20060157671 Slurry for use in metal-chemical mechanical polishing and preparation method thereof
07/20/2006CA2594786A1 Abrasive composition
07/19/2006EP1680541A2 Stabilized body care products, household products, textiles and fabrics
07/19/2006CN1806318A Multi-step chemical mechanical polishing of a gate area in a finfet
07/19/2006CN1804131A Method for making iron pan cleaning sand of attapulgite
07/19/2006CN1803964A Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using same
07/19/2006CN1265440C Polishing method
07/18/2006US7077975 Using mixture of mineral acids
07/18/2006US7077882 Gold powders, methods for producing powders and devices fabricated from same
07/18/2006US7077880 Mixture containing stabilizer, catalyst, oxidizer; immobilization
07/18/2006US7077727 Process for chemical-mechanical polishing of metal substrates
07/18/2006CA2302663C Floor polish vehicle compositions employing sulfate- and sulfonate-containing copolymers
07/13/2006WO2006074248A2 Engineered non-polymeric organic particles for chemical mechanical planarization
07/13/2006US20060151854 Polishing composition and rinsing composition
07/13/2006US20060150860 Alkali-resistant cocoon-shaped colloidal silica particle and process for producing the same
07/13/2006US20060150526 Heating a cerium carbonate hydrate while supplying a humidified gas to obtain cerium oxide powder having narrow particle diameter distribution;in the productivity and a reduction in the cost of a polishing; abrasive for final finish of silica substrate
07/13/2006DE102005058271A1 Selektive Aufschlämmung zum chemisch-mechanischen Polieren Selective slurry for chemical mechanical polishing,
07/12/2006EP1678269A1 Chemical-mechanical polishing (cmp) slurry and method of planarizing surfaces
07/12/2006CN1800284A Polishing compositions for reducing erosion in semiconductor wafers
07/12/2006CN1263679C Aluminum oxide produced by flame hydrolysis and doped with divalent metal oxides and aqueous dispersions thereof
07/11/2006US7074262 Silicone compositions for use in tire dressing and methods of making
07/06/2006WO2006071475A2 Wafer planarization composition and method of use
07/06/2006US20060148667 Cmp polishing compound and polishing method
07/06/2006US20060144825 Dual reduced agents for barrier removal in chemical mechanical polishing
07/06/2006US20060144824 Method of polishing a silicon-containing dielectric
07/06/2006US20060143993 Slurry compositions for use in chemical mechanical polishing and method of manufacturing semiconductor device using the same
07/06/2006DE112004001568T5 Polierzusammensetzung und Polierverfahren unter Verwendung derselben Polishing composition and polishing method using the same
07/05/2006EP1675924A1 Chemical-mechanical polishing (cmp) slurry and method of planarizing computer memory disk surfaces
07/05/2006CN1263099C Chemically machinery polishing serum
07/05/2006CN1262630C Brightener automatic tableware cleaner
07/04/2006US7071108 Chemical mechanical polishing slurry containing abrasive particles exhibiting photocatalytic function
07/04/2006US7071105 Method of polishing a silicon-containing dielectric
07/04/2006US7070485 Polishing composition
06/2006
06/29/2006WO2006068328A1 Polishing composition and polishing method
06/29/2006WO2005056709A3 Silica-free surface abrasion compositions and their uses
06/29/2006DE102004060543A1 New aminosiloxane compounds useful in detergent formulation for treating hard surfaces such as glass-, ceramic-, metal-, polymer coated-, varnished- or plastic-surfaces (e.g. dishes, windows and tiles)
06/28/2006EP1673416A2 Slurry for chemical mechanical polishing of metals comprising periodic acid
06/28/2006CN1795543A Abrasive and method of polishing
06/28/2006CN1795357A Method and apparatus for combining food particles and ice cream
06/28/2006CN1793274A Selective slurry for chemical mechanical polishing
06/28/2006CN1261596C Leather protecting agent
06/28/2006CN1261554C Leather cleaning cream
06/28/2006CN1261520C Grinding composition and its grinding method
06/28/2006CN1261511C Chemical mechanical polishing compositions and method relating thereto
06/27/2006US7067573 oil-in-water emulsion of a water-repelling and film-forming acrylic resin, a silicone fluid, a finely divided titanium dioxide abrasive, a hydrocarbon solvent, an alkanol solvent, an acrylic polymer, and water; nonporous surfaces: automotive paint surfaces, Plexiglas, fiberglass, glass, enamel, tiles
06/27/2006US7067070 Electroluminescent phosphor powders, methods for making phosphor powders, and devices incorporating same
06/22/2006WO2006065347A2 Polishing solutions
06/22/2006WO2006065274A2 Colloidal silica based chemical mechanical polishing slurry
06/22/2006DE102005051820A1 Polierzusammensetzung Polishing composition
06/15/2006US20060124597 Polishing medium for chemical-mechanical polishing, and method of polishing substrate member
06/15/2006US20060124594 Chemical mechanical polishing (CMP) slurries and CMP methods using and making the same
06/15/2006US20060124593 Colloidal silica based chemical mechanical polishing slurry
06/15/2006US20060124592 Chemical mechanical polish slurry
06/15/2006US20060124591 Cerium oxide, acetylene compound, and water; flattening dielectrics; semiconductors
06/15/2006US20060124026 Polishing solutions
06/15/2006US20060123709 Abrasive enhancing composition
06/14/2006EP1670047A1 Polishing composition and polishing method
06/14/2006CN1788070A Polishing fluid for metal and polishing Method
06/14/2006CN1788061A Polishing composition and polishing method
06/14/2006CN1787966A Silica and silica-based slurry
06/14/2006CN1787895A Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
06/13/2006US7060621 Slurry for CMP, polishing method and method of manufacturing semiconductor device
06/13/2006US7059941 Using amine; polishing ratio of dielectric to stopper film; removing sedimentation from silicon
06/08/2006WO2006058504A1 Chemical mechanical polishing method and polishing composition
06/08/2006US20060122313 Waterborne hydrophobic barrier coatings
06/08/2006US20060120930 Method for setting firing temperature of cerium carbonate, method for producing cerium oxide abrasives and cerium oxide abrasives obtained by the method
06/08/2006US20060118524 Cerium oxide abrasive and method of polishing substrates
06/08/2006US20060117666 Polishing composition
06/07/2006EP1664644A1 Method and apparatus for combining food particles and ice cream
06/07/2006CN1784771A Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using same
06/07/2006CN1782006A Abrasive-free chemical mechanical polishing compositions and methods relating thereto
06/07/2006CN1782005A Slurry,chemical mechanical polishing method and method of forming a surface of a capacitor using the slurry
06/06/2006US7056829 Polishing composition for semiconductor wafers
06/01/2006WO2006057479A1 Slurry for use in metal-chemical mechanical polishing and preparation method thereof
05/2006
05/31/2006EP1661961A2 Metal polishing composition and method of polishing using the same
05/31/2006EP1660606A1 Abrasive particles for chemical mechanical polishing
05/31/2006CN1780716A Dispersion for chemical-mechanical polishing
05/30/2006US7052995 Process of manufacturing semiconductor device including chemical-mechanical polishing
05/30/2006US7052625 Chemical mechanical polishing; microelectronics; semiconductors; eliminating short circuiting
05/30/2006US7052620 Polishing slurry for aluminum-based metal, and method of manufacturing semiconductor device
05/30/2006US7052522 Polishing composition and polishing method using the same
05/26/2006WO2006053772A1 Method and composition for cleaning plastic surfaces containing halogenated polymers
05/25/2006US20060107867 Polishes (such as floor waxes, furniture waxes, or automobile waxes, among others), coatings (such as textile lubricants or controlled release agents, among others), or inks
05/25/2006US20060107866 Olefin waxes having improved hardness or viscosity
05/24/2006CN1777662A Methods for machining ceramics
05/23/2006US7049237 Methods for planarization of Group VIII metal-containing surfaces using oxidizing gases
05/18/2006WO2006053096A2 High selectivity slurry compositions for chemical mechanical polishing
05/18/2006WO2006053001A2 Polymer and water repellent compositions for wood product dimensional stability
05/18/2006WO2006052434A1 Cmp composition containing surface-modified abrasive particles
05/18/2006WO2006052433A2 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
05/18/2006WO2005056662A3 Cleaning and polishing wax composition
05/18/2006WO2005012451A3 Slurries and methods for chemical-mechanical planarization of copper
05/18/2006US20060104881 Process for the produciton of metal oxide and metalloid oxide dispersions
05/17/2006EP1597328B1 Modular barrier removal polishing slurry
05/17/2006EP0985007B1 Oxygen-containing phosphor powders, methods for making phosphor powders and devices incorporating same
05/17/2006CN1256765C Method for forming copper interconnection wire
05/16/2006US7045001 Multi-component kit and method for pretreatment, resurfacing, and restoration of plastic material
05/16/2006US7044836 Coated metal oxide particles for CMP
05/11/2006WO2006049912A2 Cmp composition comprising surfactant
1 ... 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 ... 79