C09G 1 - Polishing compositions

Patents for C09G 1 - Polishing compositions (7,846)
11/2006
11/30/2006	WO2006125371A1 Polishing slurry
11/29/2006	CN1869286A Polishing agent
11/29/2006	CN1869086A Copolymers, method for the production thereof, and use thereof as binders
11/29/2006	CN1286939C Abrasive liquid composition
11/23/2006	WO2006124172A1 Method chemical-mechanical polishing and planarizing corundum, gaas, gap and gaas/gap alloy surfaces
11/23/2006	WO2006122492A1 Polishing slurry
11/23/2006	WO2006122491A1 Polishing slurry
11/23/2006	US20060264052 Method of forming a platinum pattern
11/23/2006	US20060261041 Method for manufacturing metal line contact plug of semiconductor device
11/23/2006	US20060261040 Methods for planarization of group VIII metal-containing surfaces using oxidizing agents
11/22/2006	EP1724317A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion
11/22/2006	CN1865374A Chemical machine polishing liquor for KTP crystal
11/22/2006	CN1864926A Method for controlling roughness of silicon crystal substrate material surface
11/22/2006	CN1864925A Method for controlling roughness in ULSI multi-layer copper metallization chemico-mechanical polishing
11/22/2006	CN1864924A Method for controlling roughness of computer hard disk substrate
11/22/2006	CN1285687C Surface treatment composition and its use
11/22/2006	CN1285686C 抛光组合物 The polishing composition
11/21/2006	US7138073 Slurry for chemical mechanical polishing for copper and method of manufacturing semiconductor device using the slurry
11/16/2006	WO2006121600A2 Process and composition for conductive material removal by electrochemical mechanical polishing
11/16/2006	WO2006119709A1 Composition for removing photoresist layer and method for using it
11/16/2006	WO2005076801A3 Polishing composition
11/16/2006	US20060258267 Polishing composition and polishing method using same
11/16/2006	US20060257659 Small particle size, narrow particle size distribution, spherical morphology and good crystallinity; for making electroluminescent display devices
11/16/2006	US20060255015 Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization
11/15/2006	EP1205965B1 Use of cmp abrasive
11/15/2006	CN1863883A Slurries and methods for chemical-mechanical planarization of copper
11/15/2006	CN1861726A Aluminium wiring polishing fluid for super large scale integrated circuit
11/15/2006	CN1861725A Chemical polishing agent special for polishing brick
11/15/2006	CN1861724A Nano SiO2 grinding material polishing fluid for electronic glass
11/15/2006	CN1861723A Silicon mono crystal substrate material polishing fluid and preparation process thereof
11/15/2006	CN1861321A Method for controlling planeness during chemically mechanical polishing for ULSI multiple-layered copper wiring
11/15/2006	CN1861320A Method for controlling disc-like pit during chemically mechanical polishing for ULSI multiple-layered copper wiring
11/15/2006	CN1861319A Method for controlling polishing speed of computer hard disc substrate
11/15/2006	CN1284838C CMP formulations for the use on nickel-phosphorus alloys
11/09/2006	US20060252268 Useful in chemical-mechanical polishing or chemical mechanical procedures; oxidizes copper and a material of the barrier layer at substantially the same rates
11/09/2006	US20060249482 Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using same
11/09/2006	US20060249252 Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods
11/08/2006	EP1421610B1 Slurry composition for use in chemical mechanical polishing of metal wiring
11/08/2006	EP1299489B1 Cmp polishing composition for metal
11/08/2006	CN1860592A Polishing composition and polishing method
11/08/2006	CN1860198A Non-polymeric organic particles for chemical mechanical planarization
11/08/2006	CN1858137A Sapphire lining material polishing liquid and its preparing method
11/08/2006	CN1858136A Chemical and mechanical polishing liquid for semiconductor indium antimonide
11/08/2006	CN1858135A Elastic polishing particles
11/08/2006	CN1858134A Chemical and mechanical water-free polishing liquid for lithium-cessium borate crystal and leveling method
11/08/2006	CN1858133A Polishing liquid for chemical and mechanical polsihing of computer hard disc base sheet
11/08/2006	CN1858132A Polishing liquid for grinding and polishing micro crystal glass
11/08/2006	CN1858131A Polishing liquid for grinding and polishing lithium niobate optical wafer
11/08/2006	CN1858130A Polishing liquid for tungsten plug in large scale integrated circuit multilayer wiring
11/08/2006	CN1857865A Control method for surface roughness of saphire substrate material
11/08/2006	CN1857864A Control method for high eliminating rate of saphire substrate material
11/08/2006	CN1283729C Perlite tailing composition and its preparing process and application
11/07/2006	US7132367 Polishing method
11/07/2006	US7132058 Tungsten polishing solution
11/07/2006	CA2200936C Lustering and protecting agent for rubber, vinyl, and the like
11/02/2006	WO2006114416A1 Self-stabilizing cmp composition for metal layers
11/02/2006	US20060246724 Method for polishing wafer
11/02/2006	US20060246723 Slurry composition for chemical mechanical polishing, method for planarization of surface of semiconductor element using the same, and method for controlling selection ratio of slurry composition
11/02/2006	US20060245995 adjusting the pH of a silica dispersion comprising colloidal silica obtained from silicates, having an average particle size of primary particles 10-14 nm, re-adjusting the pH of the silica dispersion obtained in the first step to a range of from 1 to 6; for NiP plated Al alloy; free of nanoscratches
11/02/2006	US20060242912 Slurry composition for secondary polishing of silicon wafer
11/02/2006	EP1717286A1 Method of surface treatment of group III nitride crystal film, group III nitride crystal substrate, group III nitride crystal substrate with epitaxial layer, and semiconductor device
11/02/2006	EP1717285A1 Self stabilizing CMP composition for metal layers
11/02/2006	EP1717280A1 Compatibilization of esters with latices
11/01/2006	CN1854225A Cmp slurry for metal film, polishing method and method for manufacturing semiconductor
11/01/2006	CN1282678C Emulsoid for water base floor polishing agent
11/01/2006	CN1282663C Latex used for phospho lipid modified floor polishing agent
10/2006
10/31/2006	US7129197 Synthesis of poly-alpha olefin and use thereof
10/31/2006	US7128852 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase particles for use in manufacturing electrically-conductive metallic films for electronic products
10/31/2006	US7128825 Method and composition for polishing a substrate
10/26/2006	WO2006111084A1 Polishing slurry, its use and using method
10/26/2006	WO2006111083A1 Polishing slurry and its use
10/26/2006	WO2006049912A3 Cmp composition comprising surfactant
10/26/2006	US20060241006 Contains abrasive grains such as magnesium oxide (MnO, MnO2, Mn2O3, Mn3O4), with hydrogen peroxide as solvent, washing with hydrofluoric acid solution, spin drying
10/26/2006	US20060240748 Method of manufacturing abrasive composition
10/26/2006	US20060240672 Polishing liquid composition
10/25/2006	CN1850916A Method for preparing alumina/monox composite mill grain
10/25/2006	CN1282226C Cerium oxide abrasive and method of abrading substrates
10/25/2006	CN1281698C Multipurpose automobile cleaning and coating high brightness protective agent
10/24/2006	US7125802 CMP process leaving no residual oxide layer or slurry particles
10/24/2006	US7125776 Multi-step chemical mechanical polishing of a gate area in a FinFET
10/19/2006	WO2006108743A1 Aqueous cerium oxide dispersion
10/19/2006	US20060231795 Securing a document by applying a phosphor powder containing particles that are spherical and have an average particle size of 0.31 to not greater than 10 mu m.; up-converter particles; emits at least two different wavelengths
10/19/2006	DE102006013728A1 Verfahren zum Herstellen einer Polierslurry mit hoher Dispersionsstabilität A method of manufacturing a polishing slurry with high dispersion stability
10/18/2006	CN1849379A Abrasive partilcle for chemical mechanical polishing
10/18/2006	CN1849378A Chemical-mechanical polishing composition and method for using the same
10/18/2006	CN1849264A Cerium salt, process for producing the same, cerium oxide, and cerium-based abrasive material
10/18/2006	CN1280368C Composition for decontaminating and glazing automobile housing and method for preparing same
10/17/2006	US7122581 Preparing sol comprising an aqueous phase, particles of a phosphate of rare earth consisting of cerium and lanthanum, an acid other than phosphoric acid, in particular, acetic acid, formic acid, citric acid and propionic acid, a cerium salt which is soluble in water; for polishing disks or dielectrics
10/17/2006	US7122475 Methods for using bi-modal abrasive slurries for mechanical and chemical-mechanical planarization of microelectronic-device substrate assemblies
10/12/2006	WO2006065274A3 Colloidal silica based chemical mechanical polishing slurry
10/12/2006	US20060229001 Exposing substance, exposing method, and exposing device
10/12/2006	US20060226125 Chemical-mechanical polishing (CMP) slurry and method of planarizing computer memory disk surfaces
10/11/2006	EP1709130A2 Chemical-mechanical polishing of metals in an oxidized form
10/11/2006	EP1709129A1 Finishing compositions with reduced volatile organic compounds
10/11/2006	EP1709128A2 Floor finish composition, laminates, and methodes for treating floors
10/11/2006	EP1626838B1 Exposing substance, exposing method, and exposing device
10/11/2006	CN1843703A Method for preparing tyre body of abrasive head of polishing machine adapted to wear-resistant ceramic brick
10/11/2006	CN1843701A Method for preparing ultrafine micro-powdered polishing film
10/11/2006	CN1279133C Grinding oil used for storage hard disk magnetic head superfine grinding
10/10/2006	US7118785 Mixture of polymer-wax mixture containign aziridine and flattening compound with polymer-wax mixture without aziridine; discoloratrion inhibition

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