Patents for C09G 1 - Polishing compositions (7,846) |
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02/08/2007 | WO2006121600B1 Process and composition for conductive material removal by electrochemical mechanical polishing |
02/08/2007 | US20070029285 Polishing method |
02/08/2007 | DE202006016891U1 Liquid shoe gloss agent comprises polyoxyethylene tridecylether, ethyl alcohol, water, hexanol-3-cis and gamma-undecalactone |
02/08/2007 | DE102006015139A1 Silicone-free and wax-free polishing agent, useful for clear lacquering of automobile car bodies, comprises mineral oil, water and aluminum oxide |
02/08/2007 | DE102005036602A1 Polyammonium-Polysiloxancopolymere Polyammonium polysiloxane |
02/07/2007 | CN1298508C Lapping method |
02/06/2007 | US7172663 Applying paste to substrate including particles dispersed in carrier liquid; vapor deposition; oxidation resistance; vaporization of aerosol drops; electronics, capacitors; noncracking, quality |
02/01/2007 | WO2007013947A1 Composite materials |
02/01/2007 | WO2007013582A1 Strippable floor coating and method of forming the coating |
02/01/2007 | WO2006078074A3 Polishing composition and polishing method |
02/01/2007 | WO2006065347A3 Polishing solutions |
02/01/2007 | US20070023731 using an aqueous slurry comprising dissolved ammonium dimolybdate and ammonium octamolybdate in water and an oxidizing agent; apply aqueous slurry between the copper and a polishing pad; apply a low pressure with high polish rates on the surface of semiconductor wafer |
02/01/2007 | CA2600479A1 Composite materials |
01/31/2007 | EP1747849A1 Composition for polishing |
01/31/2007 | EP1490897B1 Tantalum barrier removal solution |
01/31/2007 | CN1906262A Chemical-mechanical polishing of metals in an oxidized form |
01/31/2007 | CN1906261A Finishing compositions with reduced volatile organic compounds |
01/31/2007 | CN1906260A Polishing system comprising a highly branched polymer |
01/31/2007 | CN1903962A Preparation method of super fine precision polishing powder using ceriumdioxide as main body and polishing powder |
01/30/2007 | US7169322 Aqueous dispersion, process for its production and use |
01/25/2007 | WO2007009366A1 Chemical and mechanical polishing composition and its uses |
01/25/2007 | WO2007009365A1 Chemical mechanical polishing liquid |
01/25/2007 | WO2006076392A3 Polishing slurries and methods for chemical mechanical polishing |
01/24/2007 | CN1902353A Stabilized body care products, household products, textiles and fabrics |
01/24/2007 | CN1902292A 抛光组合物和抛光方法 Polishing composition and polishing method |
01/24/2007 | CN1902291A 抛光组合物和抛光方法 Polishing composition and polishing method |
01/24/2007 | CN1900192A Polishing composition and polishing method |
01/24/2007 | CN1296454C Method for producing particles for use in chemical-mechanical polishing slurries and particles produced by the method |
01/23/2007 | US7166017 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
01/23/2007 | CA2196073C Water based paint protectant |
01/18/2007 | WO2007008389A2 Use of color changing indicators in consumer products |
01/18/2007 | DE10323743B4 Freilegemasse, Freilegeverfahren und Freilegevorrichtung Uncovering compound, uncovering process and uncovering apparatus |
01/17/2007 | CN1295762C Process for grinding metal layer |
01/17/2007 | CN1295758C CMP sizing material, polishing method and method for manufacturing semiconductor device |
01/17/2007 | CN1295293C Grinding liquid compsns |
01/17/2007 | CN1295292C Metal oxide powder for high precision polishing and method of preparation thereof |
01/17/2007 | CN1295291C Polishing slurry comprising silica-coated ceria |
01/16/2007 | US7163644 For planarizing the surface of a substrate, storage stability |
01/16/2007 | US7163448 Chemical/mechanical polishing method for STI |
01/11/2007 | US20070007248 Compositions and methods for chemical mechanical polishing silica and silicon nitride |
01/11/2007 | US20070006894 Contacting the substrate with a process solution of surfactants; reducing the number of defects in the manufacture of semiconductor devices; reducting dynamic surface tension while minimizing foaming |
01/10/2007 | CN1891777A Polishing liquid |
01/10/2007 | CN1294225C Grinding liquid composition |
01/09/2007 | US7161247 Polishing composition for noble metals |
01/09/2007 | US7160807 CMP of noble metals |
01/09/2007 | US7160432 Method and composition for polishing a substrate |
01/04/2007 | WO2007002915A2 Slurry for chemical mechanical polishing of aluminum |
01/04/2007 | WO2006121600A3 Process and composition for conductive material removal by electrochemical mechanical polishing |
01/04/2007 | US20070004846 System for coating floors |
01/04/2007 | US20070004323 Polishing composition and polishing method |
01/04/2007 | US20070004322 Polishing composition and polishing method |
01/04/2007 | DE102006015389A1 Area-wise deburring and/or rounding of work pieces with a high pressure liquid jet having a dissolved abrasive additive |
01/03/2007 | EP1739146A2 CMP composition containing silane modified abrasive particles |
01/03/2007 | EP1737793A1 Composition for chemo-mechanical polishing (cmp) |
01/03/2007 | CN1887997A Polishing liquid with nanometer SiO2 abrasive for SiO2 medium in multilayer wiring of VLSI |
01/03/2007 | CN1293158C Furniture polish composition |
01/02/2007 | US7156888 Cerium-based abrasive material and method for preparation thereof |
12/28/2006 | US20060289826 Hazardous substance decomposer and process for producing the same |
12/28/2006 | US20060289034 Compositions containing free radical quenchers |
12/28/2006 | DE102005027603A1 Bodenpflegemittel Floor Care Products |
12/27/2006 | EP1735826A2 Chemical-mechanical polishing of sic surfaces using hydrogen peroixde or ozonated water solutions in combination with colloidal abrasive |
12/27/2006 | EP1735394A2 Polishing composition |
12/27/2006 | EP1432645B1 Divalent metal oxide doped aluminium oxide, produced by flame hydrolysis and aqueous dispersions thereof |
12/27/2006 | CN1886232A Method of abrading a workpiece |
12/27/2006 | CN1884410A Polishing liquid for chemomechanical polishing of monocrystalline magnesium oxide substrate |
12/27/2006 | CN1292460C Slurry for CMP, polishing method and method of manufacturing semiconductor device |
12/27/2006 | CN1292034C Polishing composition containing conducting polymer |
12/27/2006 | CN1292033C Methanol-containing silica-based CMP compositions |
12/26/2006 | US7153369 Method of chemical mechanical polishing |
12/26/2006 | US7153335 Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole |
12/21/2006 | WO2006135688A2 Polar surface preparation of nitride substrates |
12/21/2006 | WO2006028759A3 Aqueous slurry containing metallate-modified silica particles |
12/21/2006 | US20060283094 Polishing compound |
12/21/2006 | US20060283092 Abrasive compounds for semiconductor planarization |
12/20/2006 | EP1734091A1 Composition for floor conditioning |
12/20/2006 | EP1732999A2 Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer |
12/20/2006 | CN1881540A A silica and a silica-based slurry |
12/20/2006 | CN1291459C Chemical mechanical polishing method and related washing/flushing method |
12/20/2006 | CN1290961C Aqueous dispersion body for chemically mechanical polishing and semiconductor device production method |
12/14/2006 | WO2006132905A2 Polishing composition and method for defect improvement by reduced particle stiction on copper surface |
12/13/2006 | EP1730325A1 Water-based metal treatment composition |
12/13/2006 | EP1730246A2 Chemical-mechanical polishing composition and method for using the same |
12/13/2006 | EP1230312B1 Polish composition and method of use |
12/13/2006 | CN1290162C Polishing compound and method for polishing substrate |
12/13/2006 | CN1289627C Silica and silica-based slurry |
12/13/2006 | CN1289620C Paste used for polishing copper base metal |
12/13/2006 | CN1289619C Silica-based slurry |
12/12/2006 | US7148189 Halides and salts on silica, alumina, titania and polishing films for integrated circuits |
12/12/2006 | US7148147 Composition for polishing substrates for semiconductors or abrasives and reduction agents or oxidizers |
12/12/2006 | US7147682 Slurries comprising mixtures of silica sol, hydrogen peroxide, 1-hydroxyethylidene-1,1-diphosphonic acid and water, used for planarization of nickel phosphide plated substrates; high density magnetic recording media; disk drives |
12/07/2006 | WO2006128432A2 Method for immobilisation of contaminants on surfaces |
12/07/2006 | DE102005034508A1 Verfahren zur Immobilisierung von Kontaminaten auf Oberflächen A process for the immobilization of contaminants on surfaces |
12/06/2006 | EP1133792A4 Chemical mechanical polishing of feram capacitors |
12/06/2006 | CN1872930A Grinding fluid for silicon chip |
12/06/2006 | CN1872683A Method for stabilizing Nano silica sol dedicated for super large scale integration |
12/06/2006 | CN1872682A Method for purifying Nano silica sol dedicated for super large scale integration |
12/06/2006 | CN1288722C Chemical and mechanical polishing size and chemical and mechanical polishing method using said size |
12/05/2006 | US7144815 Chemical mechanical polishing slurry |
12/05/2006 | US7144814 Abrasive composition for the integrated circuits electronics industry |
12/05/2006 | US7144301 Method and system for planarizing integrated circuit material |