Patents for C09G 1 - Polishing compositions (7,846)
02/2007
02/08/2007WO2006121600B1 Process and composition for conductive material removal by electrochemical mechanical polishing
02/08/2007US20070029285 Polishing method
02/08/2007DE202006016891U1 Liquid shoe gloss agent comprises polyoxyethylene tridecylether, ethyl alcohol, water, hexanol-3-cis and gamma-undecalactone
02/08/2007DE102006015139A1 Silicone-free and wax-free polishing agent, useful for clear lacquering of automobile car bodies, comprises mineral oil, water and aluminum oxide
02/08/2007DE102005036602A1 Polyammonium-Polysiloxancopolymere Polyammonium polysiloxane
02/07/2007CN1298508C Lapping method
02/06/2007US7172663 Applying paste to substrate including particles dispersed in carrier liquid; vapor deposition; oxidation resistance; vaporization of aerosol drops; electronics, capacitors; noncracking, quality
02/01/2007WO2007013947A1 Composite materials
02/01/2007WO2007013582A1 Strippable floor coating and method of forming the coating
02/01/2007WO2006078074A3 Polishing composition and polishing method
02/01/2007WO2006065347A3 Polishing solutions
02/01/2007US20070023731 using an aqueous slurry comprising dissolved ammonium dimolybdate and ammonium octamolybdate in water and an oxidizing agent; apply aqueous slurry between the copper and a polishing pad; apply a low pressure with high polish rates on the surface of semiconductor wafer
02/01/2007CA2600479A1 Composite materials
01/2007
01/31/2007EP1747849A1 Composition for polishing
01/31/2007EP1490897B1 Tantalum barrier removal solution
01/31/2007CN1906262A Chemical-mechanical polishing of metals in an oxidized form
01/31/2007CN1906261A Finishing compositions with reduced volatile organic compounds
01/31/2007CN1906260A Polishing system comprising a highly branched polymer
01/31/2007CN1903962A Preparation method of super fine precision polishing powder using ceriumdioxide as main body and polishing powder
01/30/2007US7169322 Aqueous dispersion, process for its production and use
01/25/2007WO2007009366A1 Chemical and mechanical polishing composition and its uses
01/25/2007WO2007009365A1 Chemical mechanical polishing liquid
01/25/2007WO2006076392A3 Polishing slurries and methods for chemical mechanical polishing
01/24/2007CN1902353A Stabilized body care products, household products, textiles and fabrics
01/24/2007CN1902292A 抛光组合物和抛光方法 Polishing composition and polishing method
01/24/2007CN1902291A 抛光组合物和抛光方法 Polishing composition and polishing method
01/24/2007CN1900192A Polishing composition and polishing method
01/24/2007CN1296454C Method for producing particles for use in chemical-mechanical polishing slurries and particles produced by the method
01/23/2007US7166017 Slurry for CMP, polishing method and method of manufacturing semiconductor device
01/23/2007CA2196073C Water based paint protectant
01/18/2007WO2007008389A2 Use of color changing indicators in consumer products
01/18/2007DE10323743B4 Freilegemasse, Freilegeverfahren und Freilegevorrichtung Uncovering compound, uncovering process and uncovering apparatus
01/17/2007CN1295762C Process for grinding metal layer
01/17/2007CN1295758C CMP sizing material, polishing method and method for manufacturing semiconductor device
01/17/2007CN1295293C Grinding liquid compsns
01/17/2007CN1295292C Metal oxide powder for high precision polishing and method of preparation thereof
01/17/2007CN1295291C Polishing slurry comprising silica-coated ceria
01/16/2007US7163644 For planarizing the surface of a substrate, storage stability
01/16/2007US7163448 Chemical/mechanical polishing method for STI
01/11/2007US20070007248 Compositions and methods for chemical mechanical polishing silica and silicon nitride
01/11/2007US20070006894 Contacting the substrate with a process solution of surfactants; reducing the number of defects in the manufacture of semiconductor devices; reducting dynamic surface tension while minimizing foaming
01/10/2007CN1891777A Polishing liquid
01/10/2007CN1294225C Grinding liquid composition
01/09/2007US7161247 Polishing composition for noble metals
01/09/2007US7160807 CMP of noble metals
01/09/2007US7160432 Method and composition for polishing a substrate
01/04/2007WO2007002915A2 Slurry for chemical mechanical polishing of aluminum
01/04/2007WO2006121600A3 Process and composition for conductive material removal by electrochemical mechanical polishing
01/04/2007US20070004846 System for coating floors
01/04/2007US20070004323 Polishing composition and polishing method
01/04/2007US20070004322 Polishing composition and polishing method
01/04/2007DE102006015389A1 Area-wise deburring and/or rounding of work pieces with a high pressure liquid jet having a dissolved abrasive additive
01/03/2007EP1739146A2 CMP composition containing silane modified abrasive particles
01/03/2007EP1737793A1 Composition for chemo-mechanical polishing (cmp)
01/03/2007CN1887997A Polishing liquid with nanometer SiO2 abrasive for SiO2 medium in multilayer wiring of VLSI
01/03/2007CN1293158C Furniture polish composition
01/02/2007US7156888 Cerium-based abrasive material and method for preparation thereof
12/2006
12/28/2006US20060289826 Hazardous substance decomposer and process for producing the same
12/28/2006US20060289034 Compositions containing free radical quenchers
12/28/2006DE102005027603A1 Bodenpflegemittel Floor Care Products
12/27/2006EP1735826A2 Chemical-mechanical polishing of sic surfaces using hydrogen peroixde or ozonated water solutions in combination with colloidal abrasive
12/27/2006EP1735394A2 Polishing composition
12/27/2006EP1432645B1 Divalent metal oxide doped aluminium oxide, produced by flame hydrolysis and aqueous dispersions thereof
12/27/2006CN1886232A Method of abrading a workpiece
12/27/2006CN1884410A Polishing liquid for chemomechanical polishing of monocrystalline magnesium oxide substrate
12/27/2006CN1292460C Slurry for CMP, polishing method and method of manufacturing semiconductor device
12/27/2006CN1292034C Polishing composition containing conducting polymer
12/27/2006CN1292033C Methanol-containing silica-based CMP compositions
12/26/2006US7153369 Method of chemical mechanical polishing
12/26/2006US7153335 Tunable composition and method for chemical-mechanical planarization with aspartic acid/tolyltriazole
12/21/2006WO2006135688A2 Polar surface preparation of nitride substrates
12/21/2006WO2006028759A3 Aqueous slurry containing metallate-modified silica particles
12/21/2006US20060283094 Polishing compound
12/21/2006US20060283092 Abrasive compounds for semiconductor planarization
12/20/2006EP1734091A1 Composition for floor conditioning
12/20/2006EP1732999A2 Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer
12/20/2006CN1881540A A silica and a silica-based slurry
12/20/2006CN1291459C Chemical mechanical polishing method and related washing/flushing method
12/20/2006CN1290961C Aqueous dispersion body for chemically mechanical polishing and semiconductor device production method
12/14/2006WO2006132905A2 Polishing composition and method for defect improvement by reduced particle stiction on copper surface
12/13/2006EP1730325A1 Water-based metal treatment composition
12/13/2006EP1730246A2 Chemical-mechanical polishing composition and method for using the same
12/13/2006EP1230312B1 Polish composition and method of use
12/13/2006CN1290162C Polishing compound and method for polishing substrate
12/13/2006CN1289627C Silica and silica-based slurry
12/13/2006CN1289620C Paste used for polishing copper base metal
12/13/2006CN1289619C Silica-based slurry
12/12/2006US7148189 Halides and salts on silica, alumina, titania and polishing films for integrated circuits
12/12/2006US7148147 Composition for polishing substrates for semiconductors or abrasives and reduction agents or oxidizers
12/12/2006US7147682 Slurries comprising mixtures of silica sol, hydrogen peroxide, 1-hydroxyethylidene-1,1-diphosphonic acid and water, used for planarization of nickel phosphide plated substrates; high density magnetic recording media; disk drives
12/07/2006WO2006128432A2 Method for immobilisation of contaminants on surfaces
12/07/2006DE102005034508A1 Verfahren zur Immobilisierung von Kontaminaten auf Oberflächen A process for the immobilization of contaminants on surfaces
12/06/2006EP1133792A4 Chemical mechanical polishing of feram capacitors
12/06/2006CN1872930A Grinding fluid for silicon chip
12/06/2006CN1872683A Method for stabilizing Nano silica sol dedicated for super large scale integration
12/06/2006CN1872682A Method for purifying Nano silica sol dedicated for super large scale integration
12/06/2006CN1288722C Chemical and mechanical polishing size and chemical and mechanical polishing method using said size
12/05/2006US7144815 Chemical mechanical polishing slurry
12/05/2006US7144814 Abrasive composition for the integrated circuits electronics industry
12/05/2006US7144301 Method and system for planarizing integrated circuit material
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