| Patents for C09G 1 - Polishing compositions (7,846) |
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| 10/10/2006 | US7118686 Slurry for use in polishing semiconductor device conductive structures that include copper and tungsten and polishing methods |
| 10/10/2006 | US7118685 for polishing a surface comprising an insulating layer and a metal layer; comprising a compound having six or more carbon atoms and a structure in which each of two or more adjacent carbon atoms has a hydroxyl group in a molecule, and water |
| 10/04/2006 | CN1842897A Polishing composition and polishing method using same |
| 10/04/2006 | CN1842577A Polishing composition and method for polishing a conductive material |
| 10/04/2006 | CN1277655C Making process of vibration polishing and grinding block |
| 09/28/2006 | WO2006086265A3 Method and composition for polishing a substrate |
| 09/28/2006 | US20060216939 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same |
| 09/27/2006 | EP1705701A2 Chemical and mechanical polishing method and polishing liquid used therefor |
| 09/27/2006 | CN1837320A Polishing composition and polishing method |
| 09/27/2006 | CN1837319A Polishing composition and polishing method |
| 09/27/2006 | CN1276959C Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 09/26/2006 | US7112123 Chemical-mechanical polishing (CMP) slurry containing clay and CeO2 abrasive particles and method of planarizing surfaces |
| 09/21/2006 | WO2006074248A3 Engineered non-polymeric organic particles for chemical mechanical planarization |
| 09/21/2006 | US20060207635 Barrier polishing fluid |
| 09/21/2006 | US20060207188 Ceria abrasive for cmp |
| 09/21/2006 | DE102005011785A1 Langzeitstabile kosmetische Emulsionen Long-term stable cosmetic emulsions |
| 09/20/2006 | EP1702965A2 Metal chemical mechanical polishing solution and polishing method |
| 09/20/2006 | EP1702015A1 Polishing system comprising a highly branched polymer |
| 09/20/2006 | EP1309648B1 Mono- or poly-quaternary polysiloxanes |
| 09/20/2006 | CN1836315A Abrasive compound for semiconductor planarization |
| 09/20/2006 | CN1276475C Method for producing semiconductor device and used slurry |
| 09/20/2006 | CN1276051C Aqueous dispersion for chemical/mechanical polishing |
| 09/20/2006 | CN1276044C Multifunction fouling removal brighting emulsion |
| 09/19/2006 | US7108586 Method of chemical mechanical polishing using abrasive particles of alkaline earth metal salts |
| 09/19/2006 | US7108579 Method and device for polishing |
| 09/14/2006 | WO2006049892A3 Metal ion-containing cmp composition and method for using the same |
| 09/14/2006 | WO2005099388A3 Chemical-mechanical polishing of sic surfaces using hydrogen peroixde or ozonated water solutions in combination with colloidal abrasive |
| 09/14/2006 | US20060201913 Methods and compositions for removing Group VIII metal-containing materials from surfaces |
| 09/14/2006 | US20060201647 Pyrogenic silicon dioxide powder and dispersion thereof |
| 09/14/2006 | US20060201378 Multi-formulated composition and method for pretreatment, resurfacing, and restoration of plastic material |
| 09/13/2006 | EP1700893A1 Chemical mechanical polishing aqueous dispersion, chemical mechanical polishing method, and kit for preparing chemical mechanical polishing aqueous dispersion |
| 09/12/2006 | US7104869 Barrier removal at low polish pressure |
| 09/07/2006 | US20060197055 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
| 09/07/2006 | US20060197054 CMP abrasive, liquid additive for CMP abrasive and method for polishing substrate |
| 09/07/2006 | US20060196848 Use of a chemical-mechanical polishing system comprising an inorganic abrasive, a polishing additive such as aniline, and a liquid carrier, pH of 4 to 6; polishing silicon dioxide; Shallow Trench Isolation (STI); does not contain significant amounts of crosslinked polymer abrasives |
| 09/06/2006 | EP1697476A2 Silica-free surface abrasion compositions and their uses |
| 09/06/2006 | EP1697084A1 Method of abrading a workpiece |
| 09/06/2006 | CN1829773A Wood product and method therefor |
| 09/06/2006 | CN1827721A Process for preparing high-performance rare-earth precise polishing materials |
| 09/06/2006 | CN1273267C Catalytic reactive pad for metal CMP |
| 09/05/2006 | US7101801 Method of manufacturing semiconductor device using chemical mechanical polishing |
| 09/05/2006 | US7101800 Chemical-mechanical polishing slurry and method |
| 09/05/2006 | US7101517 Processing solution preparation and supply method and apparatus |
| 08/31/2006 | WO2006071475A3 Wafer planarization composition and method of use |
| 08/31/2006 | WO2006053096A3 High selectivity slurry compositions for chemical mechanical polishing |
| 08/31/2006 | WO2006052433A3 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
| 08/31/2006 | WO2006044417B1 Cmp composition with a polymer additive for polishing noble metals |
| 08/30/2006 | EP1696011A1 Chemical mechanical polishing method |
| 08/30/2006 | EP1200532B1 Cmp composition containing silane modified abrasive particles |
| 08/30/2006 | EP1064338B1 Chemical mechanical polishing slurry useful for copper substrates |
| 08/30/2006 | CN1826684A Method for polishing wafer |
| 08/30/2006 | CN1826397A Ceria abrasive for cmp |
| 08/30/2006 | CN1824462A Chemical mechanical polishing method |
| 08/29/2006 | US7098287 Mixing a liquid room temperature curable modified silicone resin, a fluorosilane compound and a reaction catalyst immediately before use |
| 08/29/2006 | US7097686 Generating an aerosol including a liquid comprising a nickel precursor and a reducing agent and moving the droplets through a heating zone by means of a carrier gas to form nickel particles having small particle size, narrow size distribution, spherical morphology and high crystallinity; pyrometallurgy |
| 08/29/2006 | US7097677 Polishing slurry |
| 08/29/2006 | US7097541 CMP method for noble metals |
| 08/24/2006 | US20060186373 Polishing medium for chemical-mechanical polishing, and polishing method |
| 08/24/2006 | US20060186372 For planarizing the surface of a substrate, storage stability |
| 08/22/2006 | US7094743 Composition, wipe and method for cleaning, protecting and imparting gloss to a substrate |
| 08/17/2006 | WO2006086265A2 Method and composition for polishing a substrate |
| 08/17/2006 | US20060183334 Methods for planarization of group VIII metal-containing surfaces using oxidizing gases |
| 08/17/2006 | US20060180788 an aqueous fluid comprising an oxidizer that produces oxygen-containing free radicals when contacted with an activator comprising oxides of iron or copper coated with tin, and abrasive particles comprising alumina or alumina-coated silica, used for chemical mechanical polishing (cmp) |
| 08/17/2006 | US20060180787 Cerium oxide abrasive and method of polishing substrates |
| 08/17/2006 | DE19950049B4 Verfahren zur Herstellung sphärischer Wachsteilchen, welche in einem flüssigen, vorwiegend aus Wasser bestehenden Medium dispergiert und stabilisiert vorliegen, sowie zur Verwendung solcher sphärischen Wachsteilchen in dem wäßrigen Medium A process for the preparation of spherical wax particles, which are dispersed in a liquid consisting mainly of water medium and are present in stabilized, and for the use of such spherical wax particles in the aqueous medium |
| 08/17/2006 | DE102005007036A1 Verfahren zur Herstellung von kugelförmigen Mischoxid-Pulvern mittels Sprühpyrolyse in einem Heißwandreaktor A process for the production of spherical oxide powders by means of spray pyrolysis in a hot-wall reactor |
| 08/16/2006 | EP1691401A2 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive |
| 08/16/2006 | CN1817997A Nanometer silicon nitride polishing composition and production thereof |
| 08/16/2006 | CN1817996A Dry cleaner for car body and production thereof |
| 08/16/2006 | CN1269926C Polishing composition and polishing method |
| 08/15/2006 | US7091164 Shallow channel isolation; mixture of aqueous solutions and abrasive |
| 08/15/2006 | US7090821 Metal oxide powder for high precision polishing and method of preparation thereof |
| 08/15/2006 | US7090786 abraisive ceria particles; 2-bromo-2-nitro-1,3-propanediol, 2-bromo-2-nitro-1, 3-butanediol, 2,2-dibromo-2-nitroethanol, or 2,2-dibromo-3-nitrilopropionamide; polypotassium or ammonium acrylate, ammonium citrate or ammonium dodecylbenzenesulfonate; storage stability; effective in neutral pH ranges |
| 08/15/2006 | US7090564 Polishing solution and method of polishing nonferrous metal materials |
| 08/10/2006 | WO2006044417A3 Cmp composition with a polymer additive for polishing noble metals |
| 08/10/2006 | US20060175295 Abrasive partilcle for chemical mechanical polishing |
| 08/09/2006 | EP1688394A2 Method for making metal oxides |
| 08/09/2006 | EP1687387A1 Polishing composition comprising phosphate esters and polishing method |
| 08/08/2006 | US7087710 Block polymers; coating with reduced foaming |
| 08/08/2006 | US7087530 Aqueous dispersion for chemical mechanical polishing |
| 08/08/2006 | US7087529 Chemical-mechanical polishing (CMP) slurry and method of planarizing surfaces |
| 08/08/2006 | US7087198 Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
| 08/08/2006 | US7087188 Abrasives for chemical mechanical polishing |
| 08/08/2006 | US7087187 Meta oxide coated carbon black for CMP |
| 08/08/2006 | US7086935 chemical mechanical polishing system of a nonferrous metal oxidizer, a metal inhibitor, a water soluble modified cellulose, a non-saccaride water soluble polymer, a phosphorus compound, a water miscible organic solvent, and water; patterned semiconductor wafers; nonabrasive |
| 08/03/2006 | WO2006081470A1 Method and composition for polishing a substrate |
| 08/03/2006 | WO2006081446A1 Method and composition for polishing a substrate |
| 08/02/2006 | EP1685202A1 Chemical-mechanical polishing composition and method for using the same |
| 08/02/2006 | CN1813038A Cmp of noble metals |
| 08/01/2006 | US7083747 Ultrasonic aerosol generators; transducers; fluid flow; supplying carrier gas; pyrolysis |
| 07/27/2006 | WO2006078074A2 Polishing composition and polishing method |
| 07/27/2006 | US20060163531 slurries containing hydrogen peroxide as an oxidizer and glycine as a corrosion inhibitor, used for planishing semiconductors |
| 07/27/2006 | DE102005058692A1 Polierzusammensetzungen zur Verminderung der Erosion in Halbleiterwafern Polishing compositions for reducing erosion in semiconductor wafers |
| 07/26/2006 | EP1683821A1 Composite particles and production process thereof, aqueous dispersion composition for chemical polishing, and process for manufacture of semiconductor device |
| 07/26/2006 | EP1682625A1 Polishing composition and polishing method |
| 07/26/2006 | EP1534795B1 Method for chemical mechanical polishing (cmp) of low-k dielectric materials |
| 07/26/2006 | CN1809620A Coated metal oxide particles for CMP |
| 07/26/2006 | CN1266243C Abrasive composition and abrasive process using such compositions. |
| 07/20/2006 | WO2006076449A1 Abrasive composition |
| 07/20/2006 | WO2006076392A2 Polishing slurries and methods for chemical mechanical polishing |