Patents for C09G 1 - Polishing compositions (7,846)
04/2007
04/19/2007WO2007042681A2 Abrasive aqueous suspension based on cerium and silica dioxide particles for polishing surfaces of materials
04/19/2007WO2006134462A3 Slurry composition for color filter polishing
04/18/2007EP1773959A1 Method of polishing a tungsten-containing substrate
04/18/2007EP1226220B1 Polishing system and method of its use
04/18/2007CN1311009C Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
04/17/2007US7204936 Containing roll-off reducing agent , used in polishing the substrate for precision parts
04/17/2007US7204865 Polishing composition
04/17/2007CA2195551C Automotive protectant for use with cleaning compositions
04/12/2007WO2007041199A2 Polishing slurries and methods for utilizing same
04/12/2007WO2007041004A2 Composition and method for planarizing surfaces
04/12/2007WO2007040956A1 Composition and method for enhancing pot life of hydrogen peroxide-containing cmp slurries
04/12/2007US20070082833 Low cost and low dishing slurry for polysilicon cmp
04/12/2007US20070082456 Polishing composition and polishing method
04/12/2007US20070079446 Stabilized body care products, household products, textiles and fabrics
04/12/2007CA2624246A1 Polishing slurries and methods for utilizing same
04/11/2007EP1772503A2 Polishing slurry, method of treating surface of GaxIn1-xAsyP1-y crystal and GaxIn1-xAsyP1-y crystal substrate
04/11/2007CN1946878A Water-based metal treatment composition
04/11/2007CN1944559A Alkaline silicon wafer polishing liquid
04/11/2007CN1944496A Polishing slurry, method of producing same, and method of polishing substrate
04/11/2007CN1309794C Preservative agent for shining leather and stone
04/10/2007US7201784 Surfactant slurry additives to improve erosion, dishing, and defects during chemical mechanical polishing of copper damascene with low k dielectrics
04/10/2007US7201637 Simultaneous planarization of pole piece and coil materials for write head applications
04/05/2007WO2007038399A2 Metal cations for initiating chemical mechanical polishing
04/05/2007WO2007038077A2 Compositions and methods for tantalum cmp
04/05/2007US20070077868 Cerium-based abrasive, abrasive slurry, and production of cerium-based abrasive
04/04/2007EP1770768A2 Polishing method, polishing composition and polishing composition kit
04/04/2007EP1770136A2 Polishing composition and polishing method
04/04/2007EP1631416A4 Improved chemical mechanical polishing compositions for copper and associated materials and method of using same
04/04/2007CN1943018A Polishing slurry
04/04/2007CN1939995A Aqueous polishing liquid and chemical mechanical polishing method
04/04/2007CN1939994A 抛光组合物和抛光方法 Polishing composition and polishing method
04/04/2007CN1939993A 抛光液体 Polishing liquid
04/04/2007CN1939992A Polishing slurry, method of treating surface of gaxin1-xasyp1-y crystal and gaxin1-xasyp1-y crystal substrate
04/04/2007CN1939991A Polishing composition and polishing method
04/04/2007CN1939990A Production of high-cerium rare-earth polishing powder
04/04/2007CN1939663A Polishing method, polishing composition and polishing composition kit
04/03/2007US7199056 Low cost and low dishing slurry for polysilicon CMP
04/03/2007US7198729 Slurry capable of reducing scratches on a region to be polished during Chemical Mechanical Polishing
03/2007
03/28/2007EP1767602A2 Metal-polishing liquid and chemical-mechanical polishing method
03/28/2007EP1765947A1 Floor finish with lightening agent
03/28/2007CN1938394A Chemical mechanical polishing slurry composition for shallow trench isolation process of semiconductor
03/28/2007CN1938393A Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer
03/28/2007CN1938392A Chemical-mechanical polishing composition and method for using the same
03/28/2007CN1307279C Method for manufacturing substrate
03/28/2007CN1307275C Tungsten polishing solution
03/27/2007US7196010 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
03/27/2007US7195544 CMP porous pad with component-filled pores
03/22/2007US20070066066 Polishing method for glass substrate, and glass substrate
03/21/2007CN1934208A Cmp porous pad with component-filled pores
03/21/2007CN1931521A Slant grinding and polishing process of wafer
03/21/2007CN1306562C Polishing compound, method for production thereof, and polishing method
03/21/2007CN1305985C Slurry for CMP, and method of manufacturing semiconductor device
03/21/2007CN1305984C Method for chemical mechanical polishing (cmp) of low-k dielectric materials
03/20/2007US7192461 High concentration silica slurry
03/20/2007US7192335 Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
03/15/2007WO2007030724A2 Conductive hydrocarbon fluid
03/15/2007WO2007028898A1 Mechanochemical polishing composition, method for preparing and using same
03/15/2007WO2006135688A3 Polar surface preparation of nitride substrates
03/15/2007US20070056465 Rapid generation of nanoparticles from bulk solids at room temperature
03/15/2007DE102006041805A1 Polymere Polieraufschlämmung zur Barriereentfernung Polymers polishing slurry for barrier removal
03/14/2007CN1928044A Highly effective brightening decontaminant for vehicle
03/14/2007CN1927975A Polishing slurry capable of removing polymer barrier layer
03/14/2007CN1927436A Dispersion method for diamond nano powder
03/13/2007US7189684 Polishing composition and method for forming wiring structure using the same
03/08/2007US20070051918 aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, and a surfactant; for mechanical chemical polishing
03/08/2007US20070051638 Electropolishing liquid, electropolishing method, and method for fabricating semiconductor device
03/08/2007US20070051274 Hydrophilic treatment composition, and hydrophilic protective film-forming method
03/08/2007DE102006033919A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
03/07/2007EP1760127A2 Polishing method
03/07/2007EP1760099A2 Polishing composition and polishing method
03/07/2007EP1759023A1 Polish composition for leather or synthetic leather
03/07/2007EP1758962A1 Polishing method for glass substrate, and glass substrate
03/07/2007EP1618163B1 Method for machining ceramics and single crystals
03/07/2007CN1926211A Silica-free surface abrasion compositions and their uses
03/07/2007CN1923935A 抛光组合物及抛光方法 Polishing composition and polishing method
03/07/2007CN1303655C Polishing method for base copper-layer
03/07/2007CN1303174C Use of silicone surfactant in polishing compositions
03/06/2007US7186654 Chemical mechanical polishing slurry and method of manufacturing semiconductor device by using the same
03/06/2007US7186653 Polishing slurries and methods for chemical mechanical polishing
03/01/2007US20070045233 Polishing liquid composition
02/2007
02/28/2007EP1757665A1 Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices
02/28/2007EP1756253A1 Matrix liquid for producing a chip removal suspension, and used as a lubricating or machining liquid
02/28/2007CN1919950A High precision polishing liquid, preparation method and use thereof
02/28/2007CN1919949A High precision composite polishing liquid, preparation method and use thereof
02/27/2007US7183212 Polishing method, metallization fabrication method, method for manufacturing semiconductor device and semiconductor device
02/27/2007US7183211 Process for chemical mechanical polishing of semiconductor substrate and aqueous dispersion for chemical mechanical polishing
02/27/2007US7182882 Method of improving chemical mechanical polish endpoint signals by use of chemical additives
02/27/2007US7182798 Abrasive silica or alumina core and shell of functionalized, crosslinked polydivinylbenzene or polyhydroxyethyl(meth)acrylate with polydivinylbenzene; polymeric shell physisorbed to and encapsulating the particle core; semiconductors
02/22/2007WO2007021716A2 Abrasive-free polishing system
02/22/2007US20070043230 Polishing slurries and methods for chemical mechanical polishing
02/22/2007US20070043124 Dispersion for chemical-mechanical polishing
02/22/2007US20070039926 Abrasive-free polishing system
02/21/2007CN1301305C Polishing agent composition for wooden floor and furnitures maintenance
02/15/2007WO2007016725A1 Semi drying semi solidifying timber protection and preserving wax oil with lanolin (sheep wool grease)
02/14/2007EP1751243A1 Cmp porous pad with component-filled pores
02/14/2007EP1556455B1 Polishing composition containing conducting polymer
02/14/2007CN1300828C Chemical mechanical polishing method for semiconductor substrate and water-dispersion solution for chemical mechanical polishing
02/14/2007CN1300271C Nano polishing liquid for sulfuric compound phase changing material chemical mechanical polishing and its use
02/14/2007CN1299878C Apparatus for preparing grinding liquid
02/13/2007US7175680 Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
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