Patents for C09G 1 - Polishing compositions (7,846)
07/2007
07/12/2007US20070158309 Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using the same
07/12/2007US20070157524 Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer
07/11/2007EP1732999B1 Dispersion for the chemical-mechanical polishing of metal surfaces containing metal oxide particles and a cationic polymer
07/11/2007CN1326212C Process for chemical-mechanical polishing of metal substrates
07/11/2007CN1326199C Polishing composition including inhibitor of tungsten etching
07/11/2007CN1325591C Anionic abrasive particles treated with positively charged polyelectrolytes for cmp
07/10/2007US7241725 comprising imine compounds and hydrazine compounds; for polishing tantalum-containing barrier; abrasive free
07/10/2007US7241325 Polishing compound
07/05/2007US20070155178 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same
07/04/2007EP1803787A1 Leveling agent for floor polish and aqueous floor polish composition
07/04/2007CN1993437A Polishing composition for noble metals
07/04/2007CN1992179A Method for forming microelectronics structure
07/03/2007US7238618 System for the preferential removal of silicon oxide
06/2007
06/28/2007WO2007041199A3 Polishing slurries and methods for utilizing same
06/27/2007EP1799785A2 Cmp composition with a polymer additive for polishing noble metals
06/27/2007CN1323124C Cerium oxide abrasive material and grinding method of base plate
06/21/2007WO2007070716A2 Cleaning and polishing wax composition
06/21/2007WO2007070714A2 Spray wax composition
06/21/2007WO2007070713A2 Interior protectant/cleaner composition
06/21/2007WO2007041004A3 Composition and method for planarizing surfaces
06/21/2007US20070138438 Fine particle sizes; narrow particle size distribution; display devices and lighting elements; printed on explosives or ammunitions; currency; printed on confidential documentation
06/21/2007CA2632361A1 Spray wax composition
06/21/2007CA2622256A1 Interior protectant/cleaner composition
06/21/2007CA2597985A1 Cleaning and polishing wax composition
06/20/2007EP1797152A1 Polishing composition for noble metals
06/20/2007EP1797151A1 Cmp composition for improved oxide removal rate
06/20/2007CN1982401A Cmp abrasive and method for polishing substrate
06/20/2007CN1982393A Composition for polishing semiconductor layers
06/20/2007CN1322555C Method of fabricating semiconductor device
06/20/2007CN1321884C Cerium phosphate and/or lanthenum sol, preparation method and use for polishing
06/20/2007CN1321733C Viscosity modification of petroleum distillates
06/19/2007US7232529 Oxidizing agent; water; a protective film-forming agent; and a water-soluble polymer, especially alginic acid, pectic acid, agar, curdlan, pullulan, polyvinyl pyrrolidone or polyacrolein; useful in forming wirings of semiconductors
06/19/2007US7232514 Minimizing damage to the surface to remove conductive materials by an electrochemical polishing technique using an acid-based electrolyte, chelating agent, corrosion inhibitor, acid salt; buffer, oxidizer and solvents; semiconductors
06/14/2007WO2007067294A2 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
06/14/2007WO2007047547A3 Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material
06/14/2007US20070135655 Use of fluorinated additives in the etching or polishing of integrated circuits
06/14/2007US20070130839 Roll-off reducing agent
06/13/2007EP1796152A1 Cmp polishing agent and method for polishing substrate
06/13/2007CN1978570A Portable efficient brightening protecting agent
06/13/2007CN1978482A Aqueous resins
06/13/2007CN1321441C Aqueous dispersion for chemical - mechanical grinding and chemical-mechanical grinding method thereof
06/12/2007US7229572 Photoluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
06/12/2007US7229570 To polish and remove a barrier metal film
06/12/2007US7229565 Chemically assisted surface finishing process
06/12/2007US7229535 Hydrogen bubble reduction on the cathode using double-cell designs
06/12/2007US7229486 Shoe and leather care product
06/07/2007WO2007028898B1 Mechanochemical polishing composition, method for preparing and using same
06/07/2007WO2007021716A3 Abrasive-free polishing system
06/07/2007WO2007002915A3 Slurry for chemical mechanical polishing of aluminum
06/07/2007US20070128872 Polishing composition and polishing method
06/06/2007EP1793016A1 Polishing and deburring composition for workpieces of carbon steel and method of chemical polishing and deburring
06/06/2007EP1560890B1 Cmp method utilizing amphiphilic non-ionic surfactants
06/06/2007CN1974129A Polishing method
06/06/2007CN1320610C CMP polishing pad including solid catalyst
06/06/2007CN1320078C Polishing composition
06/05/2007US7226547 Electroluminescent phosphor powders, methods for making phosphor powders and devices incorporating same
06/05/2007US7226502 having high softening points which approximate or exceed natural wax which includes hydrosilating a C30+ alpha olefin wax with a siloxane hydride in the presence of a catalyst
05/2007
05/31/2007WO2007042681A3 Abrasive aqueous suspension based on cerium and silica dioxide particles for polishing surfaces of materials
05/31/2007WO2007038077A3 Compositions and methods for tantalum cmp
05/31/2007US20070122549 forming a solar cell conductive feature using monodisperse silver or silver alloy fine particles coated with a ceramic or metal; silver particles made in an aerosol stream and coated by vapor deposition
05/31/2007US20070120090 System for the Preferential Removal of Silicon Oxide
05/30/2007CN1970665A Polishing liquid and method for polishing óÄ-ó÷ compound semiconductor wafer
05/30/2007CN1319132C Tantalum barrier removal solution
05/30/2007CN1318529C Novel slurry for chemical mechanical polishing of metals
05/29/2007US7223722 Imparting or maintaining a glossy or shiny finish on a hard surface. The composition comprises a base polish component or components, and at least one poly(oxyalkylene) ammonium cationic surfactant. A method of imparting a gossy finish to
05/29/2007US7223297 Slurrying an atomized mixture of a matrix polymer with embedded abraisive particles for a chemical mechanical polishing system
05/29/2007US7223156 Method chemical-mechanical polishing and planarizing corundum, GaAs, GaP and GaAs/GaP alloy surfaces
05/23/2007CN1969024A Method of polishing a tungsten-containing substrate
05/23/2007CN1966594A Polishing composition for metal cmp
05/23/2007CN1966548A Polishing medium for chemical-mechanical polishing, and method of polishing substrate member
05/23/2007CN1317742C Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers
05/22/2007US7220676 Carboxylic acids having either hydroxyl or mercapto groups, monocarboxylic acids, dicarboxylic acids and salts thereof, an abrasive and water; reducing edge rounding (roll-off) of hard discs to increase recording capacity; polishing
05/18/2007WO2007056002A1 Free radical-forming activator attached to solid and used to enhance cmp formulations
05/16/2007EP1785228A1 Apparatus and method for polishing work using electrolytic reduced water
05/16/2007CN1965043A Floor finish with lightening agent
05/15/2007US7217777 Polymmonium-polysiloxane compounds, methods for the production and use thereof
05/10/2007WO2007008389A3 Use of color changing indicators in consumer products
05/10/2007US20070105376 Copper-based metal polishing solution and method for manufacturing semiconductor device
05/10/2007US20070104605 Silver-containing particles, method and apparatus of manufacture, silver-containing devices made therefrom
05/10/2007CA2852198A1 Aerosol propellants comprising unsaturated fluorocarbons
05/09/2007EP1781747A1 Fluorochemical oligomeric polish composition
05/09/2007EP1570512A4 Slurry composition for secondary polishing of silicon wafer
05/09/2007CN1961055A Electrochemical-mechanical polishing composition and method for using the same
05/08/2007US7214623 Planarization system and method using a carbonate containing fluid
05/03/2007WO2007048441A1 Method for testing a slurry used to form a semiconductor device
05/03/2007WO2007048316A1 A chemical mechanical polishing paste for tantalum barrier layer
05/03/2007WO2007048315A1 A chemical mechanical polishing paste for tantalum barrier layer
05/03/2007WO2007048314A1 A chemical mechanical polishing paste for copper
05/03/2007WO2007048313A1 A chemical mechanical polishing paste for barrier layer
05/03/2007US20070100107 High softening temperature synthetic alkylsilicone wax
05/03/2007US20070094936 Abrasive slurry having high dispersion stability and manufacturing method for a substrate
05/02/2007EP1778809A1 CHEMICAL-MECHANICAL POLISHING (CMP) SLURRY CONTAINING CLAY AND CeO2 ABRASIVE PARTICLES AND METHOD OF PLANARIZING SURFACES
05/02/2007CN1955239A Chemical mechanical polishing material of copper
05/01/2007US7211122 Polishing composition and rinse composition
05/01/2007US7211121 Polishing composition
04/2007
04/26/2007WO2007047547A2 Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material
04/26/2007WO2006128432A3 Method for immobilisation of contaminants on surfaces
04/25/2007CN1953842A Composition for polishing
04/24/2007US7208049 Process solutions containing surfactants used as post-chemical mechanical planarization treatment
04/24/2007CA2433596C Compositions for pre-treating shoes and methods and articles employing same
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