Patents for C09G 1 - Polishing compositions (7,846)
09/2007
09/20/2007US20070214728 Method of polishing a tungsten-containing substrate
09/19/2007EP1833937A2 Polishing solutions
09/19/2007CN101040021A Cmp composition with a polymer additive for polishing noble metals
09/19/2007CN101037586A Polishing fluid and method of polishing
09/19/2007CN101037585A Polishing fluid and polishing method
09/19/2007CN101037571A Low-luster polishing agent combination and preparation method thereof
09/19/2007CN100338741C Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
09/19/2007CN100338163C Aerosol biliquid foam
09/19/2007CN100337925C Crytalline ceric oxide sol and making method thereof
09/18/2007US7271088 Slurry composition with high planarity and CMP process of dielectric film using the same
09/18/2007US7270762 Polishing compositions for noble metals
09/13/2007DE102007008997A1 Zusammensetzungen zum chemisch-mechanischen Polieren von Siliziumdioxid und Siliziumnitrid Compositions for chemical mechanical polishing of silicon dioxide and silicon nitride,
09/13/2007DE102007005919A1 Polierzusammensetzung und Polierverfahren Polishing composition and polishing method
09/12/2007EP1833085A1 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
09/12/2007EP1833084A2 Cerium oxide abrasive and method of polishing substrates
09/12/2007EP1831321A2 Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
09/12/2007CN101033374A High-purity nano diamond polishing liquid and preparing method thereof
09/12/2007CN100336877C Aqueous paint compositions and floor polishing compositions
09/11/2007US7267784 Safe for nickel phosphide, glass and/or ceramic materials; polishing efficiency, uniformity, removal rate; minimizing defects; includes purified sodium containing clays
09/11/2007US7267702 Abrasive with an average particle size of 1 to 30 nm and water and having a packing ratio of from 79 to 90% by weight; suitable for precision parts including such as magnetic recording media, photomask substrates, optical disks, lenses, mirrors, and prisms, and semiconductor substrates
09/06/2007US20070204724 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
09/05/2007EP1829093A2 Cmp composition comprising surfactant
09/05/2007EP1828333A1 Polishing composition and polishing method
09/05/2007CN101029208A 抛光剂 Polishes
09/05/2007CN100336188C Method for copper CMP using polymeric complexing agents
09/05/2007CN100336179C Polishing fluid and polishing method
09/05/2007CN100335581C Sulphurs phase-change material chemically machinery polished non-abrasive polishing liquid and its use
09/05/2007CN100335580C Polishing system with stopping compound and method of its use
09/05/2007CN100335512C Reaction product between copolymer aqueous emblsion and multivalent metallic compound and polishing compsn. contg. such reaction product
09/04/2007US7264787 polycrystalline nanostructure ceria particles, used as abrasives for the polishing semiconductor substrates
09/04/2007US7264742 Method of planarizing a surface
08/2007
08/30/2007WO2007097977A1 Low foaming pvoh aerosol spray coatings
08/30/2007DE19824046B4 Verfahren zur Planarisierung von Halbleiterwafern Method for planarization of semiconductor wafers
08/30/2007DE102006008689A1 Poliermittel Polish
08/29/2007EP1826254A2 Polishing agent based on gluconic acid
08/29/2007EP1299490B1 Silane containing polishing composition for cmp
08/29/2007CN101024801A Water-free dry washing agent for automobile
08/23/2007US20070196975 Metal-Polishing Liquid And Polishing Method Using The Same
08/22/2007CN101023145A Tire coating agent
08/21/2007US7258706 Controlling fineness particle size of metal compound
08/21/2007CA2336447C Continuous bulk polymerization and esterification process and compositions including the polymeric product
08/16/2007US20070190906 Polishing medium for chemical-mechanical polishing, and polishing method
08/16/2007US20070186486 Polishing composition and rinse composition
08/16/2007US20070186485 Polishing composition and rinse composition
08/15/2007CN1332005C Synthesis of poly-alpha olefin and use thereof.
08/15/2007CN1331971C Leather dry cleaning finishing cream
08/15/2007CN101016573A Leather nursing liquid for eliminating formaldehyde pollution and peculiar smell, and preparing method thereof
08/15/2007CN101016440A Multi-component barrier polishing solution
08/15/2007CN101016439A Chemical mechanical polishing pulp for sapphire substrate underlay
08/15/2007CN101016438A Alkaline computer hard disk polishing liquid and producing method thereof
08/14/2007US7255810 Polymer with a degree of branching of at least 50% and a polishing pad and/or an abrasive, for use in chemical-mechanical polishing
08/14/2007US7255809 Hard magentic disks; abrasion using diamond particles in aqueous solution
08/09/2007WO2007087831A1 'universal' barrier cmp slurry for use with low dielectric constant interlayer dielectrics
08/09/2007WO2006132905A3 Polishing composition and method for defect improvement by reduced particle stiction on copper surface
08/09/2007US20070181852 Passivative chemical mechanical polishing composition for copper film planarization
08/09/2007US20070180778 CMP Porous Pad with Component-Filled Pores
08/09/2007DE102007004881A1 Mehrkomponenten-Barrierepolierlösung Multi-barrier polishing solution
08/08/2007EP1274772B1 Hydrophobizing microemulsions
08/08/2007CN1330733C Abrasive slurry having high dispersion stability and manufacturing method for a substrate
08/08/2007CN1330571C Pyrogenic silicon dioxide powder and dispersion thereof
08/08/2007CN101012357A Compositions and methods for chemical mechanical polishing interlevel dielectric layers
08/08/2007CN101012356A Polishing liquid for barrier layer
08/08/2007CN101012313A Polishing composition
08/07/2007US7253111 Barrier polishing solution
08/07/2007US7252782 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method
08/07/2007US7252695 aqueous acid suspension of individualized colloidal silica particles not linked to each other by siloxane bonds, and a surfactant; for mechanical chemical polishing
08/02/2007WO2007070716A9 Cleaning and polishing wax composition
08/02/2007US20070176140 Polishing composition and polishing method
08/02/2007DE102007004120A1 Aqueous composition for polishing silicon dioxide and boron-phosphate-silicate glass on semiconductor wafers, contains polyacrylic acid, abrasive and polyvinyl-pyrrolidone
08/01/2007EP1813658A2 Polishing liquid for barrier layer
08/01/2007EP1813657A2 Metal-polishing liquid and chemical-mechanical polishing method using the same
08/01/2007EP1813656A2 Metal-polishing liquid and chemical mechanical polishing method using the same
08/01/2007EP1813641A1 A method for improving mechanical properties of polymer particles and its applications
08/01/2007EP1812523A2 Metal ion-containing cmp composition and method for using the same
08/01/2007EP1478012B1 Polishing method and polishing fluid
08/01/2007CN1329467C Passivative chemical mechanical polishing composition for copper film planarization
08/01/2007CN101007862A Non-melting reaction products having a high glass transition temperature and low solution viscosity
07/2007
07/31/2007US7250369 Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the same
07/26/2007WO2007030724A3 Conductive hydrocarbon fluid
07/26/2007US20070169421 CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive
07/25/2007EP1811005A1 Polishing system and method of its use
07/25/2007CN1328163C High concentration silica slurry
07/25/2007CN101003609A Resins for universal use
07/25/2007CN101003608A Resins containing ionic liquids
07/24/2007US7247567 Method of polishing a tungsten-containing substrate
07/24/2007US7247566 CMP method for copper, tungsten, titanium, polysilicon, and other substrates using organosulfonic acids as oxidizers
07/24/2007US7247256 Treating an aluminum film with a slurry of a polishing agent, an oxidant, a pH control additive, and an oxide film removal retarder; a first CMP which removes a part of the aluminum film; stopping the first CMP when a predetermined thickness of the aluminum, a second CMP with a defect prevention agent
07/24/2007US7247179 Abrasive, hybrid organic/inorganic particles and alkyne having at least one hydroxyl substituent; preventing dishing and defects to dielectric during removal of such as tungsten
07/24/2007US7247082 Polishing composition
07/19/2007US20070167116 Polishing composition
07/19/2007US20070167017 a mixture of oxidizers, oxidized-metal etchants, protective film-forming agents and diluents, used for polishing semiconductors
07/19/2007US20070167015 Polishing method
07/19/2007US20070166221 Nanocarbon fulerenes (ncf), method for producing ncf and use of ncf in the form of nanocarbons
07/19/2007US20070166216 Cerium salt, producing method thereof, cerium oxide and cerium based polishing slurry
07/19/2007US20070163677 Copper cmp slurry composition
07/19/2007US20070163464 Spray wax composition
07/19/2007US20070163463 Interior protectant/cleaner composition
07/18/2007CN1326962C 抛光组合物 The polishing composition
07/18/2007CN100999648A Alcohol soluble paper printing polishing oil
07/18/2007CN100999061A Grinding polishing method based on magnetic rheology effect and its polishing device
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