C09G 1 - Polishing compositions

Patents for C09G 1 - Polishing compositions (7,846)
12/2007
12/05/2007	CN100352881C Methods for machining ceramics
12/05/2007	CN100352874C Apparatus and method for replacing a media content item
12/04/2007	US7303993 Semiconductor wafer polished with oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, copolymer blends, water
12/04/2007	US7303601 Slurries comprising mixtures of silica sol, hydrogen peroxide, 1-hydroxyethylidene-1,1-diphosphonic acid and water, used for planarization of nickel phosphide plated substrates; high density magnetic recording media; disk drives
12/04/2007	US7303600 Applying a paste of perlite ore grains, applying an abrasive force to the paste, fracturing the ore to yield a final polishing composition
11/2007
11/29/2007	US20070275867 Water-Based Silicone Dispersion Containing Low Level of Silicone Oils
11/29/2007	US20070275260 Palladium-containing particles, method and apparatus of manufacturing palladium-containing devices made therefrom
11/28/2007	CN101077961A Polishing fluid for smoothing treatment of refined surface and use method thereof
11/28/2007	CN100351308C Aqueous compositions with polyvalent metal ions and dispersed polymers
11/28/2007	CN100351179C Preparation of monodisperse spherical cerium oxide and its application in high precision polishing
11/27/2007	US7300976 For treating hard substrates; provide desirable repellency, antisoiling and anti-staining properties to the substrates
11/27/2007	US7300877 Method of manufacturing a semiconductor device
11/27/2007	US7300874 Chemical mechanical polishing compositions and methods relating thereto
11/27/2007	US7300603 Aqueous solution mixture of oxidizer and abrasive; using polymaleic acid; acidity pH
11/27/2007	US7300602 Selective barrier metal polishing solution
11/27/2007	US7300601 Passivative chemical mechanical polishing composition for copper film planarization
11/27/2007	US7300480 Comprises oxidizer (hydrogen peroxide), inhibitor of nonferrous metal, abrasive, complexing agent, imine derivatives (acetamidine hydrochloride), hydrazine derivatives (carbohydrazide), and water; for use with polyurethane polishing pads; for semiconductor substrates
11/27/2007	US7300478 Polyacrylic acid, high purity cerium oxide and optionally rare earth oxides aqueous dispersion containing polysaccharide to retard hard settling; polishing glass and ceramics
11/22/2007	US20070269987 Polishing Liquid for Cmp Process and Polishing Method
11/22/2007	US20070266641 Method of polishing a tungsten-containing substrate
11/22/2007	US20070266640 Includes aqueous dispersion solution of fumed silica; efficiently polishing semiconductor device such as wafer at high polishing speed without causing flaw
11/21/2007	EP1856229A2 Polishing slurries and methods for chemical mechanical polishing
11/21/2007	EP1097177B1 Continuous bulk polymerization and esterification process and compositions including the polymeric product
11/21/2007	CN101076575A 抛光溶液 Polishing solution
11/21/2007	CN101075472A System and method for using chemical and mechanical polishing technology to generating micro grain on sliding device substrate
11/21/2007	CN101074346A Mixed dry-cleaning agent for automobile
11/21/2007	CN101073878A Method for polishing chemical machinery
11/21/2007	CN100350009C Biliquid foam furniture polish
11/21/2007	CN100350008C 抛光组合物 The polishing composition
11/20/2007	US7297669 Copper chemical mechanical polishing solutions using sulfonated amphiprotic agents
11/15/2007	WO2007128037A1 Safety coatings
11/15/2007	WO2007111855A3 Halide anions for metal removal rate control
11/15/2007	CA2651692A1 Safety coatings
11/14/2007	CN101070453A Slurry and method for chemical mechanical polishing
11/08/2007	WO2007126773A2 Liquid polishing composition and kit
11/08/2007	US20070257388 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/08/2007	US20070256517 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
11/08/2007	US20070256368 Polishing composition and polising method using the same
11/08/2007	CA2647936A1 Liquid polishing composition and kit
11/07/2007	EP1852481A1 Silane containing polishing composition for CMP
11/07/2007	EP1852480A1 Method of processing a surface of group III nitride crystal and group III nitride crystal substrate
11/07/2007	EP1773959B1 Method of polishing a tungsten-containing substrate
11/07/2007	CN101067070A Floor protecting and polishing composition and its prepn
11/07/2007	CN101066583A Method of processing a surface of group III nitride crystal and group III nitride crystal substrate
11/07/2007	CN100347827C Polishing method and grinding fluid
11/07/2007	CN100347227C Composite for grinding
11/06/2007	US7291188 Stable polishing performance for a long time and capable of improving the polishing rate without employing a dressing treatment
10/2007
10/31/2007	CN101065458A Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
10/31/2007	CN101065457A Chemical mechanical polishing method and polishing composition
10/31/2007	CN100346451C Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device
10/30/2007	US7288509 Compatibilization of esters with latices
10/30/2007	US7288212 Comprises acrylic acid-maleic acid copolymer and sodium hydroxide; for chemical mechanical polishing of semiconductors
10/30/2007	US7288021 Chemical-mechanical polishing of metals in an oxidized form
10/30/2007	CA2344660C Chilled temperature polishing method for soft acrylic articles
10/24/2007	CN101058713A Polishing slurry and polishing method
10/18/2007	WO2007038399A3 Metal cations for initiating chemical mechanical polishing
10/18/2007	US20070240366 Composition for Polishing
10/17/2007	CN101054499A H62 brass polishing liquid and its preparing process
10/17/2007	CN101054498A Compositions for chemical mechanical polishing silicon dioxide and silcon nitride
10/17/2007	CN100343362C Polishing fluid for metal and polishing Method
10/11/2007	WO2007114814A1 Polymeric inhibitors for enhanced planarization
10/11/2007	US20070238838 containing polyalpha olefin ( polydecene-1) and 0.1 to 5% hyperbranched polyalpha-olefin, polydimethylsiloxane silicone fluid; volatile cyclic silicone (cyclopentasiloxane, decamethyl), amino-functional silicone( aminopropyl/trimethoxysilane), benzotriazoles UV absorber; polishing automobile surfaces
10/10/2007	EP1841832A1 Abrasive composition
10/10/2007	EP1841831A2 Polishing composition and polishing method
10/10/2007	CN101052691A Aqueous slurry containing metallate-modified silica particles
10/10/2007	CN101050401A Caring agent of covered membrane for environmental protective car wash without water
10/10/2007	CN101050340A Environmental protection type aqueous brightening agent for tyre
10/10/2007	CN101050339A Diamond polishing paste in high purity, and preparation method
10/10/2007	CN101050338A Polishing fluid of Nano silicon dioxide grinding material in use for processing microcrystalline glass, and preparation method
10/10/2007	CN101049681A Method for controlling scoring abrasive surface of silicon chip
10/10/2007	CN100341966C Polishing composition for semiconductor wafers
10/09/2007	US7279425 Polishing method
10/09/2007	US7279119 Silica and silica-based slurry
10/09/2007	US7278904 Method of abrading a workpiece
10/04/2007	WO2007111855A2 Halide anions for metal removal rate control
10/04/2007	WO2007111813A2 Iodate-containing chemical-mechanical polishing compositions and methods
10/04/2007	US20070232197 Polishing slurry and polishing method
10/03/2007	EP1838795A2 Engineered non-polymeric organic particles for chemical mechanical planarization
10/03/2007	CN101045855A Polishing fluid and polishing method
10/03/2007	CN101045794A 聚酰亚胺抛光薄膜及其制备方法 Polyimide film and preparation method of polishing
10/03/2007	CN100341122C Methods for polishing and/or cleaning copper interconnects and/or film and compositions therefor
10/03/2007	CN100340624C Hydrophilizing agent composition and process for formation of hydrophilic protective films
10/02/2007	US7276180 Chemical mechanical polishing composition and process
09/2007
09/27/2007	WO2007108926A2 Composition and method to polish silicon nitride
09/27/2007	WO2007108925A2 Oxidation-stabilized cmp compositions and methods
09/27/2007	WO2007070713A9 Interior protectant/cleaner composition
09/27/2007	US20070224101 Semiconductor Polishing Composition
09/27/2007	US20070221089 Carnauba wax micro emulsion, silicone oil blend of liquid dimethylpolysiloxane, alkyl quaternary ammonium montmorillonite, isoparaffinic solvent, aluminum oxide average particle size of 20 micrometers or less, water
09/27/2007	US20070220813 Aqueous abrasive solution of polishing particles and a dispersant and containing a meth)acrylic acid polymer, a 1,3,5- or 1,2,4-triazine derivative to reduce speed of polishing of nitride film and an amine, preferably a tetramethylammonium salt, to increase speed of silicon oxide film removal
09/26/2007	EP1837903A2 Metal polishing slurry
09/26/2007	EP1836268A2 Colloidal silica based chemical mechanical polishing slurry
09/26/2007	CN101044600A Cmp composition comprising surfactant
09/26/2007	CN101044221A Leveling agent for floor polish and aqueous floor polish composition
09/26/2007	CN101044220A Metal ion-containing cmp composition and method for using the same
09/26/2007	CN100339954C CMP abrasive and substrate polishing method
09/26/2007	CN100339450C Noble metal preparations and lustring preparations for direct and indirect screen printing
09/26/2007	CN100339420C Compositions and methods for chemical mechanical polishing silica and silicon nitride
09/20/2007	WO2007104089A1 Composition
09/20/2007	US20070218811 Cmp polishing slurry and method of polishing substrate
09/20/2007	US20070218693 High selectivity slurry compositions for chemical mechanical polishing

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