| Patents for C09G 1 - Polishing compositions (7,846) |
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| 08/06/2008 | CN101235253A 抛光组合物和抛光方法 Polishing composition and polishing method |
| 08/06/2008 | CN100409412C Abrasive compound for semiconductor planarization and manufacturing method thereof |
| 08/06/2008 | CN100408648C Selective barrier metal polishing solution |
| 08/05/2008 | US7407601 aqueous solution for polishing; for semiconductor wafers |
| 08/05/2008 | CA2407800C Polishing composition |
| 07/31/2008 | WO2007143210A3 Wax composition for application to wetted surfaces |
| 07/30/2008 | EP1950263A2 Polishing composition and polishing method |
| 07/30/2008 | CN101233199A Strippable floor coating and method for forming the coating |
| 07/30/2008 | CN101230239A Highly-effective high accuracy sapphire polishing liquid and preparation method thereof |
| 07/30/2008 | CN101230238A Metal-polishing liquid and polishing method therewith |
| 07/24/2008 | WO2008087898A1 Wiping-up type gloss agent and method of imparting gloss to article surface |
| 07/24/2008 | US20080176982 slurries comprising cerium oxide particles, a water soluble polymer selected from acrylic polymers, polyvinyl acetate, polyvinyl imidazole and polyvinyl pyrrolidone, and an acetylenic organic compound such as ethoxylated tetramethyl-5-decyne-4,7-diol; polishes for dielectrics; semiconductors |
| 07/23/2008 | CN101225283A Infinite soluble pnenolic aldehyde modified rosin resin and production method thereof |
| 07/23/2008 | CN101225282A Low-dielectric material lapping liquid |
| 07/23/2008 | CN101225281A Polishing film and method for making same |
| 07/23/2008 | CN100404634C 抛光液组合物 A polishing solution composition |
| 07/16/2008 | EP1943320A1 Method for testing a slurry used to form a semiconductor device |
| 07/16/2008 | CN101220245A Agent for cleaning, lustering and protecting surface easy to eliminate and method for producing the same |
| 07/16/2008 | CN101220244A High surface quality GaN wafer and method of fabricating same |
| 07/16/2008 | CN100403497C Methods for planarization of group VIII metal-containing surfaces using complexing agents |
| 07/10/2008 | WO2008080958A2 Composition for polishing surface made of silicon dioxide |
| 07/10/2008 | DE10392703B4 Metal oxide powder useful for high-precision polishing of a semiconductor device, substrate for organoluminescence, mechanical and optical elements, comprising aggregates formed by cohesion of primary particles |
| 07/09/2008 | EP1942178A1 Mixtures of 3-(4-Methyl-cyclohex-3-enyl)-butyraldehyde and 2,6-Dimethyl-7-octen-2-ol |
| 07/09/2008 | CN101215447A Composition for polishing |
| 07/09/2008 | CN101215446A Method for preparing high-cerium nano-stage rare earth polishing powder from rare earth ore concentrate |
| 07/09/2008 | CN100401459C Chemical-mechanical polishing slurry and method |
| 07/08/2008 | US7396891 Two-component coating composition and method of preparation |
| 07/03/2008 | WO2008080096A2 Compositions and methods for the selective removal of silicon nitride |
| 07/03/2008 | US20080160881 Polishing composition |
| 07/03/2008 | DE102006061891A1 Composition for polishing surfaces, especially of semiconductors, comprises a lanthanide oxide abrasive, a polymeric dispersant, a polysaccharide gelling agent and water |
| 07/03/2008 | DE10048477B4 Verfahren zum chemisch-mechanischen Polieren von Schichten aus Metallen der Platingruppe A method for chemical mechanical polishing of layers of metals of the platinum group |
| 07/02/2008 | EP1939260A2 Three-phase liquid polishing and cleaning composition |
| 07/01/2008 | US7393401 Spray wax composition |
| 06/26/2008 | DE102007059608A1 Rutheniumbarriere-Polieraufschlämmung Rutheniumbarriere-polishing |
| 06/25/2008 | EP1936674A2 Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing |
| 06/25/2008 | EP1936673A1 Polishing solution for cmp and method of polishing |
| 06/25/2008 | EP1935954A1 Compositions for chemical mechanical planarization of copper |
| 06/25/2008 | EP1934300A2 Abrasive particulate material, and method of planarizing a workpiece using the abrasive particulate material |
| 06/25/2008 | CN101208399A Slurry for chemical mechanical polishing of aluminum |
| 06/25/2008 | CN101208398A Colorful spectral filter grinding fluid composition |
| 06/25/2008 | CN101205442A Ruthenium-barrier layer polishing slurry |
| 06/25/2008 | CN100396750C Cerium-based abrasive material and method for preparation thereof |
| 06/25/2008 | CN100396749C Chemical machine flating method, use of alumina slurry, and abradant for customing and machining |
| 06/24/2008 | US7390744 Method and composition for polishing a substrate |
| 06/24/2008 | US7390423 applying slurries comprising carrier fluids, particles, etchants and surfactants, to the surfaces of glass, ceramic, metal or alloy substrates use in data storage, then rubbing with pads |
| 06/19/2008 | WO2008072207A1 Improved electrolyte formulation for electrochemical mechanical planarization |
| 06/19/2008 | US20080146122 Polishing compositions and use thereof |
| 06/19/2008 | DE10022649B4 Polierflüssigkeit und Verfahren zur Strukturierung von Metalloxiden Polishing liquid and method for patterning metal oxides |
| 06/18/2008 | CN101200619A Bearing inner sleeve polishing oil additive facilitating cleaning |
| 06/17/2008 | US7387970 Method of using an aqueous solution and composition thereof |
| 06/12/2008 | WO2008069781A1 Planarization composition for metal surfaces comprising an alumina hydrate abrasive |
| 06/12/2008 | WO2008067731A1 The application of non-ionic polymers in production of polishing liquid of self-etch-stop of polysilicon and usage of the same |
| 06/11/2008 | EP1930938A1 Polishing agent, method for polishing surface to be polished, and method for manufacturing semiconductor integrated circuit device |
| 06/11/2008 | EP1929071A1 Composition and method for enhancing pot life of hydrogen peroxide-containing cmp slurries |
| 06/11/2008 | EP1928966A2 Polishing slurries and methods for utilizing same |
| 06/11/2008 | EP1928965A2 Compositions and methods for tantalum cmp |
| 06/11/2008 | EP1928964A2 Composition and method for planarizing surfaces |
| 06/11/2008 | CN101198442A Composite materials |
| 06/11/2008 | CN101197268A Method for eliminating leftover after chemical mechanical grinding |
| 06/11/2008 | CN101195729A Application of non-ionic polyalcohol in producing and using self-stopping polysilicon polishing solution |
| 06/11/2008 | CN100394555C Polishing method using polishing pad and polishing liquid, and polishing liquid |
| 06/11/2008 | CN100393833C Polishing composition |
| 06/11/2008 | CN100393832C Composition for polishing metal, polishing method for metal layer, and production method for wafer |
| 06/10/2008 | US7384871 Chemical mechanical polishing compositions and methods relating thereto |
| 06/10/2008 | US7384534 Amines, amides, carboxylate, dicarboxylate or tri-carboxylate groups containing chelating agents, a substituted or unsubstituted benzotriazole or a polymeric corrosion resistance agent, sodium hydroxide or ammonium hydroxide as pH adjuster, a solvent |
| 06/10/2008 | US7384447 Coated nickel-containing powders, methods and apparatus for producing such powders and devices fabricated from same |
| 06/05/2008 | US20080132156 Polishing composition and polishing method |
| 06/05/2008 | US20080127856 Paste wax composition |
| 06/04/2008 | CN101191036A Slurry composition for chemical mechanical polishing and precursor composition thereof |
| 06/04/2008 | CN100392820C Method for polishing wafer |
| 06/04/2008 | CN100392035C 抛光组合物 The polishing composition |
| 06/03/2008 | US7381648 Chemical mechanical polishing slurry useful for copper substrates |
| 06/03/2008 | US7381647 Methods and systems for planarizing microelectronic devices with Ge-Se-Ag layers |
| 06/03/2008 | US7381250 Microemulsion of a cationic carnauba wax, zinc oxide with an average particle size of 60 nanometers, silicone quat [1,3-bis3-((3-alkyltrimethylammonium)2-hydroxypropoxy)propyl)tetramethyldisiloxane diacetate], and water; dries quickly and leaves no oily residue; leather or vinyl surfaces |
| 06/03/2008 | US7381249 Wax composition for application to wet surfaces |
| 06/03/2008 | US7381231 Finishing compositions with reduced volatile organic compounds |
| 05/29/2008 | WO2001074959A8 Method for polishing a memory or rigid disk with an amino acid-containing composition |
| 05/29/2008 | US20080124913 Slurry compositions and CMP methods using the same |
| 05/29/2008 | US20080121840 mixing oxidizers, oxidized-metal etchants, protective film-forming agents and diluents, used for polishing semiconductors |
| 05/28/2008 | EP1925649A2 Polishing composition and polishing process |
| 05/28/2008 | EP1925648A2 Polishing composition and polishing process |
| 05/28/2008 | EP1925647A2 Polishing composition and polishing method |
| 05/28/2008 | EP1924666A2 Abrasive-free polishing system |
| 05/28/2008 | CN101188197A Step chemical mechanical polishing method |
| 05/28/2008 | CN101186784A 抛光组合物 The polishing composition |
| 05/28/2008 | CN101186783A Method for producing polishing powder from kaolin |
| 05/28/2008 | CN100390245C 抛光组合物 The polishing composition |
| 05/27/2008 | US7378382 Aqueous dispersions of silicone fluids for cleaning, preserving, protecting, and otherwise treating a variety of surfaces, including household surfaces, such as floors, counter tops, furniture, walls, and automotive surfaces, like tires, rubber, vinyl, upholstery, fabric, plastic and general elastomers |
| 05/27/2008 | US7378381 Floor coating composition and floor coating composition additive |
| 05/27/2008 | US7378349 Chemical mechanical polishing aqueous dispersion and chemical mechanical polishing method |
| 05/27/2008 | US7378348 Polishing compound for insulating film for semiconductor integrated circuit and method for producing semiconductor integrated circuit |
| 05/22/2008 | WO2008058894A1 Pyrogenic silica produced in a production facility with high capacity |
| 05/22/2008 | US20080119052 Selective barrier metal polishing method |
| 05/21/2008 | EP1922376A2 Conductive hydrocarbon fluid |
| 05/21/2008 | DE202008003439U1 Dispersion/Suspension zum chemisch-mechanischen Polieren von Halbleiterscheiben Dispersion / suspension for chemical mechanical polishing of semiconductor wafers |
| 05/21/2008 | CN101184817A Polymer restrainer for improving flatness |
| 05/21/2008 | CN101182402A Aqueous antibiotic floor wax |
| 05/21/2008 | CN100389228C Polishing agent |
| 05/21/2008 | CN100389161C 抛光组合物 The polishing composition |
| 05/20/2008 | US7374787 Stabilized, aqueous silicon dioxide dispersion |