Patents for C09G 1 - Polishing compositions (7,846) |
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11/18/2008 | US7452819 Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device |
11/18/2008 | US7452815 Methods of forming integrated circuit devices having polished tungsten metal layers therein |
11/18/2008 | US7452426 Process solutions containing surfactants used as post-chemical mechanical planarization treatment |
11/13/2008 | US20080277378 Method for Chemical-Mechanical Planarization of Copper |
11/12/2008 | CN101302405A Alkaline barrier polishing slurry |
11/12/2008 | CN101302404A Preparation of nano-cerium oxide composite abrasive grain polishing solution |
11/12/2008 | CN101302403A Polishing solution for ultra-precise low-damage polish of large size diamond wafer and preparation thereof |
11/12/2008 | CN100432178C Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates |
11/12/2008 | CN100432174C Barrier polishing fluid |
11/06/2008 | US20080274620 Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same |
11/06/2008 | DE102007021002A1 Dispergierbare Nanopartikel Dispersible nanoparticles |
10/30/2008 | WO2007070713A3 Interior protectant/cleaner composition |
10/30/2008 | US20080263965 Semiconductor Polishing Composition |
10/29/2008 | EP1984467A2 Barrier slurry compositions and barrier cmp methods |
10/29/2008 | CN101297009A Composition and method for planarizing surfaces |
10/28/2008 | US7442645 Method of polishing a silicon-containing dielectric |
10/23/2008 | US20080261401 Chemical-Mechanical Polishing of Sic Surfaces Using Hydrogen Peroxide or Ozonated Water Solutions in Combination with Colloidal Abrasive |
10/16/2008 | WO2008122204A1 Chemical mechanical polishing liquid for polycrystalline silicon |
10/16/2008 | US20080254629 Composition and method used for chemical mechanical planarization of metals |
10/15/2008 | CN101284972A Multifunctional care agent and method for making same |
10/15/2008 | CN101284971A Dry-clean nursing liquid for car-washing and preparing process thereof |
10/15/2008 | CN101284952A Abrasive grain CeO2 for chemical and mechanical buffing and method for preparing same |
10/15/2008 | CN101284749A Multifunctional biomembrane |
10/15/2008 | CN100425667C Polishing liquid and method for polishing ó -ó÷ compound semiconductor wafer |
10/15/2008 | CN100425666C Boron-containing polishing system and method |
10/15/2008 | CN100425395C Method for preparing anode copper ball and apparatus thereof |
10/09/2008 | US20080248727 Polishing Slurry |
10/08/2008 | CN101280158A Chemico-mechanical polishing slurry for polysilicon |
10/07/2008 | US7431758 Heating a cerium carbonate hydrate while supplying a humidified gas to obtain cerium oxide powder having narrow particle diameter distribution;in the productivity and a reduction in the cost of a polishing; abrasive for final finish of silica substrate |
10/07/2008 | CA2447132C Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups |
10/01/2008 | EP1360256B1 Methods for pre-treating shoes |
10/01/2008 | CN101275057A Metal-polishing liquid and polishing method |
09/30/2008 | US7429367 Chemical mechanical polishing; heat treatment |
09/30/2008 | US7429338 chemical mechanical polishing a semiconductor with an abrasive having a MIXTURE on the surface, CONTAINING STABILIZER, CATALYST, OXIDIZER |
09/25/2008 | US20080233836 Polishing composition and polishing method |
09/25/2008 | US20080233422 Coated nickel-containing powders |
09/24/2008 | EP1485440B1 Free radical-forming activator attached to solid and used to enhance cmp formulations |
09/24/2008 | CN101273105A Polishing slurries and methods for utilizing same |
09/23/2008 | US7427567 Two slurries of silica particles, an oxidizing agent, a corrosion inhibitor, and a cleaning agent with differing removal rates on copper, the barrier and dielectric material |
09/23/2008 | US7427361 Chemical mechanical polishing slurry for semiconductors |
09/23/2008 | US7427305 Free radical-forming activator attached to solid and used to enhance CMP formulations |
09/23/2008 | CA2509873C Aqueous compositions with polyvalent metal ions and dispersed polymers |
09/18/2008 | WO2007126773A3 Liquid polishing composition and kit |
09/18/2008 | CA2684233A1 High strength ceramic elements and methods for making and using the same |
09/12/2008 | WO2008109270A1 Abrasive formulation containing organic polymer particles |
09/11/2008 | US20080219130 Methods and Apparatus for Formatting and Tracking Information for Three-Dimensional Storage Medium |
09/10/2008 | EP1967555A1 Non-toxic anti-fouling comprising a solid and a liquid hydrocarbon mixture |
09/10/2008 | EP1965930A2 Method and system for using a two-phases substrate cleaning compound |
09/10/2008 | CN101263209A Abrasive-free polishing system |
09/10/2008 | CN101263208A Conductive hydrocarbon fluid |
09/10/2008 | CN101260279A Low viscosity stability non-water-base magnetic rheology polishing liquid and preparation method thereof |
09/10/2008 | CN100417495C Method for preparing ultrafine micro-powdered polishing film |
09/04/2008 | US20080214093 cerium oxide particles, a dispersing agent (lauryl betaine), a water-soluble polymer containing N-mono-substituted product and an N,N-di-substituted product of any one selected from acrylamide, methacrylamide and alpha -substituted product; polishing a silicon dioxide film |
09/04/2008 | US20080214000 Polishing composition and polishing method using the same |
09/04/2008 | US20080210665 Polishing composition and polishing method |
09/03/2008 | EP1965417A1 Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit |
09/03/2008 | CN101255316A Polishing liquid |
09/03/2008 | CN101255286A Abrasive particles, slurry for polishing and method of manufacturing the same |
09/03/2008 | CN100416753C Method of manufacturing semiconductor device |
09/02/2008 | US7419911 high polishing efficiency, uniformity, and removal rate, and leaves a high quality polish with minimal surface defects; uses an oxidizer, preferably a per-type oxidizer such as a peroxide, periodic acid, and peracetic acid; abrasives |
09/02/2008 | US7419910 Slurry for CMP, polishing method and method of manufacturing semiconductor device |
08/28/2008 | WO2008101562A1 Dispersion comprising cerium oxide and sheet silicate |
08/28/2008 | WO2008101553A1 Dispersion comprising cerium oxide and colloidal silicon dioxide |
08/28/2008 | WO2007078975A3 Method and system for using a two-phases substrate cleaning compound |
08/28/2008 | US20080207091 Slurry Composition For Color Filter Polishing |
08/27/2008 | EP1962334A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing |
08/27/2008 | CN101250380A Water-based magneto-rheological polishing liquid for optical processing and preparation method thereof |
08/27/2008 | CN101249625A Laser glass mechanical chemical polishing method |
08/26/2008 | US7417099 Fluorochemical sulfonamide surfactants |
08/26/2008 | US7416680 a mixture of carrier fluids, colloidal particles, etchants and surfactants comprising sodium octyl sulfate, used for cleaning or polishing glass or ceramic disks used in data storage devices |
08/21/2008 | WO2004101222A3 Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same |
08/21/2008 | DE102007008279A1 Ceroxid und Schichtsilikat enthaltende Dispersion Cerium oxide and silicate layer containing dispersion |
08/21/2008 | DE102007008232A1 Dispersion enthaltend Ceroxid und kolloidales Siliciumdioxid Dispersion containing ceria and colloidal silica |
08/20/2008 | EP1218464B1 Chemical mechanical polishing systems and methods for their use |
08/20/2008 | CN101246312A Recycling of large-size photomask substrate |
08/20/2008 | CN101245225A Multicolor composite shoe cream and manufacture method thereof |
08/20/2008 | CN101244524A Surface finish method for magnesium alloy parts |
08/20/2008 | CN100413033C Polishing cloth and method of manufacturing semiconductor device |
08/20/2008 | CN100412153C Process for reducing dishing and erosion during chemical mechanical planarization |
08/20/2008 | CN100412152C CMP systems and methods utilizing amine-containing polymers |
08/19/2008 | US7413989 Method of manufacturing semiconductor device |
08/19/2008 | US7413832 Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask |
08/14/2008 | WO2008075212A3 Polish and polishing mitts |
08/14/2008 | WO2008075212A2 Polish and polishing mitts |
08/14/2008 | WO2008043703A3 Liquid suspension and powder of cerium oxide particles, methods for making the same and uses thereof in polishing |
08/14/2008 | DE102008004441A1 Mechano-chemisches Polierverfahren für GaAs-Wafer Mechano-chemical polishing process for GaAs wafers |
08/13/2008 | EP1956642A1 Polishing agent for silicon oxide, liquid additive, and method of polishing |
08/13/2008 | EP1954776A2 Abrasive aqueous suspension based on cerium and silica dioxide particles for polishing surfaces of materials |
08/13/2008 | CN101240147A Compositions for chemical mechanical planarization of copper |
08/13/2008 | CN101240146A Metal-polishing composition and chemical mechanical polishing method by using the same |
08/13/2008 | CN101239450A Chemical mechanical polishing method for GaAs wafer |
08/13/2008 | CN100411110C Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using same |
08/12/2008 | US7410409 Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound |
08/12/2008 | CA2280865C Aerosol method and apparatus, particulate products, and electronic devices made therefrom |
08/07/2008 | WO2008094702A1 Method of polishing a tungsten-containing substrate |
08/07/2008 | WO2008092853A1 Method for coating surfaces and aqueous formulations suited therefor |
08/07/2008 | DE102007005291A1 Aqueous dispersion useful for chemical-mechanical polishing of conductive metal films contains an abrasive in the form of fumed alumina |
08/06/2008 | EP1505639B1 Polishing fluid and polishing method |
08/06/2008 | CN101235255A Polishing liquid for chemo-mechanical polishing semiconductor wafer |
08/06/2008 | CN101235254A Dispersion for chemical machinery mechanical polishing |