Patents for C09G 1 - Polishing compositions (7,846)
11/2008
11/18/2008US7452819 Chemical mechanical polishing method of organic film and method of manufacturing semiconductor device
11/18/2008US7452815 Methods of forming integrated circuit devices having polished tungsten metal layers therein
11/18/2008US7452426 Process solutions containing surfactants used as post-chemical mechanical planarization treatment
11/13/2008US20080277378 Method for Chemical-Mechanical Planarization of Copper
11/12/2008CN101302405A Alkaline barrier polishing slurry
11/12/2008CN101302404A Preparation of nano-cerium oxide composite abrasive grain polishing solution
11/12/2008CN101302403A Polishing solution for ultra-precise low-damage polish of large size diamond wafer and preparation thereof
11/12/2008CN100432178C Method and apparatus for chemically, mechanically, and/or electrolytically removing material from microelectronic substrates
11/12/2008CN100432174C Barrier polishing fluid
11/06/2008US20080274620 Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same
11/06/2008DE102007021002A1 Dispergierbare Nanopartikel Dispersible nanoparticles
10/2008
10/30/2008WO2007070713A3 Interior protectant/cleaner composition
10/30/2008US20080263965 Semiconductor Polishing Composition
10/29/2008EP1984467A2 Barrier slurry compositions and barrier cmp methods
10/29/2008CN101297009A Composition and method for planarizing surfaces
10/28/2008US7442645 Method of polishing a silicon-containing dielectric
10/23/2008US20080261401 Chemical-Mechanical Polishing of Sic Surfaces Using Hydrogen Peroxide or Ozonated Water Solutions in Combination with Colloidal Abrasive
10/16/2008WO2008122204A1 Chemical mechanical polishing liquid for polycrystalline silicon
10/16/2008US20080254629 Composition and method used for chemical mechanical planarization of metals
10/15/2008CN101284972A Multifunctional care agent and method for making same
10/15/2008CN101284971A Dry-clean nursing liquid for car-washing and preparing process thereof
10/15/2008CN101284952A Abrasive grain CeO2 for chemical and mechanical buffing and method for preparing same
10/15/2008CN101284749A Multifunctional biomembrane
10/15/2008CN100425667C Polishing liquid and method for polishing ó -ó÷ compound semiconductor wafer
10/15/2008CN100425666C Boron-containing polishing system and method
10/15/2008CN100425395C Method for preparing anode copper ball and apparatus thereof
10/09/2008US20080248727 Polishing Slurry
10/08/2008CN101280158A Chemico-mechanical polishing slurry for polysilicon
10/07/2008US7431758 Heating a cerium carbonate hydrate while supplying a humidified gas to obtain cerium oxide powder having narrow particle diameter distribution;in the productivity and a reduction in the cost of a polishing; abrasive for final finish of silica substrate
10/07/2008CA2447132C Polymeric surfactants derived from cyclic monomers having pendant fluorinated carbon groups
10/01/2008EP1360256B1 Methods for pre-treating shoes
10/01/2008CN101275057A Metal-polishing liquid and polishing method
09/2008
09/30/2008US7429367 Chemical mechanical polishing; heat treatment
09/30/2008US7429338 chemical mechanical polishing a semiconductor with an abrasive having a MIXTURE on the surface, CONTAINING STABILIZER, CATALYST, OXIDIZER
09/25/2008US20080233836 Polishing composition and polishing method
09/25/2008US20080233422 Coated nickel-containing powders
09/24/2008EP1485440B1 Free radical-forming activator attached to solid and used to enhance cmp formulations
09/24/2008CN101273105A Polishing slurries and methods for utilizing same
09/23/2008US7427567 Two slurries of silica particles, an oxidizing agent, a corrosion inhibitor, and a cleaning agent with differing removal rates on copper, the barrier and dielectric material
09/23/2008US7427361 Chemical mechanical polishing slurry for semiconductors
09/23/2008US7427305 Free radical-forming activator attached to solid and used to enhance CMP formulations
09/23/2008CA2509873C Aqueous compositions with polyvalent metal ions and dispersed polymers
09/18/2008WO2007126773A3 Liquid polishing composition and kit
09/18/2008CA2684233A1 High strength ceramic elements and methods for making and using the same
09/12/2008WO2008109270A1 Abrasive formulation containing organic polymer particles
09/11/2008US20080219130 Methods and Apparatus for Formatting and Tracking Information for Three-Dimensional Storage Medium
09/10/2008EP1967555A1 Non-toxic anti-fouling comprising a solid and a liquid hydrocarbon mixture
09/10/2008EP1965930A2 Method and system for using a two-phases substrate cleaning compound
09/10/2008CN101263209A Abrasive-free polishing system
09/10/2008CN101263208A Conductive hydrocarbon fluid
09/10/2008CN101260279A Low viscosity stability non-water-base magnetic rheology polishing liquid and preparation method thereof
09/10/2008CN100417495C Method for preparing ultrafine micro-powdered polishing film
09/04/2008US20080214093 cerium oxide particles, a dispersing agent (lauryl betaine), a water-soluble polymer containing N-mono-substituted product and an N,N-di-substituted product of any one selected from acrylamide, methacrylamide and alpha -substituted product; polishing a silicon dioxide film
09/04/2008US20080214000 Polishing composition and polishing method using the same
09/04/2008US20080210665 Polishing composition and polishing method
09/03/2008EP1965417A1 Polishing composition, polishing method, and method for forming copper wiring for semiconductor integrated circuit
09/03/2008CN101255316A Polishing liquid
09/03/2008CN101255286A Abrasive particles, slurry for polishing and method of manufacturing the same
09/03/2008CN100416753C Method of manufacturing semiconductor device
09/02/2008US7419911 high polishing efficiency, uniformity, and removal rate, and leaves a high quality polish with minimal surface defects; uses an oxidizer, preferably a per-type oxidizer such as a peroxide, periodic acid, and peracetic acid; abrasives
09/02/2008US7419910 Slurry for CMP, polishing method and method of manufacturing semiconductor device
08/2008
08/28/2008WO2008101562A1 Dispersion comprising cerium oxide and sheet silicate
08/28/2008WO2008101553A1 Dispersion comprising cerium oxide and colloidal silicon dioxide
08/28/2008WO2007078975A3 Method and system for using a two-phases substrate cleaning compound
08/28/2008US20080207091 Slurry Composition For Color Filter Polishing
08/27/2008EP1962334A1 Aqueous dispersion for chemical mechanical polishing, chemical mechanical polishing method, and kit for preparing aqueous dispersion for chemical mechanical polishing
08/27/2008CN101250380A Water-based magneto-rheological polishing liquid for optical processing and preparation method thereof
08/27/2008CN101249625A Laser glass mechanical chemical polishing method
08/26/2008US7417099 Fluorochemical sulfonamide surfactants
08/26/2008US7416680 a mixture of carrier fluids, colloidal particles, etchants and surfactants comprising sodium octyl sulfate, used for cleaning or polishing glass or ceramic disks used in data storage devices
08/21/2008WO2004101222A3 Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same
08/21/2008DE102007008279A1 Ceroxid und Schichtsilikat enthaltende Dispersion Cerium oxide and silicate layer containing dispersion
08/21/2008DE102007008232A1 Dispersion enthaltend Ceroxid und kolloidales Siliciumdioxid Dispersion containing ceria and colloidal silica
08/20/2008EP1218464B1 Chemical mechanical polishing systems and methods for their use
08/20/2008CN101246312A Recycling of large-size photomask substrate
08/20/2008CN101245225A Multicolor composite shoe cream and manufacture method thereof
08/20/2008CN101244524A Surface finish method for magnesium alloy parts
08/20/2008CN100413033C Polishing cloth and method of manufacturing semiconductor device
08/20/2008CN100412153C Process for reducing dishing and erosion during chemical mechanical planarization
08/20/2008CN100412152C CMP systems and methods utilizing amine-containing polymers
08/19/2008US7413989 Method of manufacturing semiconductor device
08/19/2008US7413832 Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask
08/14/2008WO2008075212A3 Polish and polishing mitts
08/14/2008WO2008075212A2 Polish and polishing mitts
08/14/2008WO2008043703A3 Liquid suspension and powder of cerium oxide particles, methods for making the same and uses thereof in polishing
08/14/2008DE102008004441A1 Mechano-chemisches Polierverfahren für GaAs-Wafer Mechano-chemical polishing process for GaAs wafers
08/13/2008EP1956642A1 Polishing agent for silicon oxide, liquid additive, and method of polishing
08/13/2008EP1954776A2 Abrasive aqueous suspension based on cerium and silica dioxide particles for polishing surfaces of materials
08/13/2008CN101240147A Compositions for chemical mechanical planarization of copper
08/13/2008CN101240146A Metal-polishing composition and chemical mechanical polishing method by using the same
08/13/2008CN101239450A Chemical mechanical polishing method for GaAs wafer
08/13/2008CN100411110C Slurry composition for chemical-mechanical polishing capable of compensating nanotopography effect and method for planarizing surface of semiconductor device using same
08/12/2008US7410409 Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound
08/12/2008CA2280865C Aerosol method and apparatus, particulate products, and electronic devices made therefrom
08/07/2008WO2008094702A1 Method of polishing a tungsten-containing substrate
08/07/2008WO2008092853A1 Method for coating surfaces and aqueous formulations suited therefor
08/07/2008DE102007005291A1 Aqueous dispersion useful for chemical-mechanical polishing of conductive metal films contains an abrasive in the form of fumed alumina
08/06/2008EP1505639B1 Polishing fluid and polishing method
08/06/2008CN101235255A Polishing liquid for chemo-mechanical polishing semiconductor wafer
08/06/2008CN101235254A Dispersion for chemical machinery mechanical polishing
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