| Patents for C09G 1 - Polishing compositions (7,846) |
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| 07/22/2009 | CN100516159C 抛光组合物及抛光方法 Polishing composition and polishing method |
| 07/22/2009 | CN100516158C Chemical polishing agent special for polishing brick |
| 07/22/2009 | CN100516157C Aqueous dispersion body for chemical mechanical grinding |
| 07/21/2009 | US7563716 Polishing method |
| 07/16/2009 | WO2009042073A3 Polishing composition and method utilizing abrasive particles treated with an aminosilane |
| 07/15/2009 | EP1246856B1 Fluorochemical sulfonamide surfactants |
| 07/15/2009 | CN101481586A Nonaqueous non-abrasive polishing solution for soft, crisp and deliquescent crystal |
| 07/15/2009 | CN100513077C Planarization system and method using a carbonate containing fluid |
| 07/09/2009 | US20090176685 consists of monomeric chelating agent selected from multifunctional aromatic acid or anhydride, multi-functional aliphatic acid or anhydride, aromatic or aliphatic amino acids, aromatic or aliphatic di or tri-amines and an acidic film forming polymeric chelating agent which forms ring with metal |
| 07/08/2009 | EP1606218B1 Pyrogenic silicon dioxide powder and dispersion thereof |
| 07/08/2009 | CN101475778A Polishing composite for gallium arsenide wafer and preparation thereof |
| 07/08/2009 | CN101475777A High precision rare earth polishing powder and preparation thereof |
| 07/08/2009 | CN100509980C Composition and method for copper chemical mechanical planarization |
| 07/08/2009 | CN100509927C Grinding liquid composition |
| 07/01/2009 | EP2075824A1 Polishing composition |
| 07/01/2009 | EP1350827B1 Abrasive, abrasive slurry, and method for manufacturing abrasive |
| 07/01/2009 | CN101469253A Grinding composition |
| 07/01/2009 | CN101469252A Polishing composition |
| 07/01/2009 | CN101469251A Sapphire substrate polishing solution and method for producing the same |
| 07/01/2009 | CN100506936C High precision polishing liquid, preparation method and use thereof |
| 06/30/2009 | US7553433 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase small particles for use in manufacturing electrically-conductive metallic films for electronic products; powder coatings for thick films |
| 06/30/2009 | US7553430 using an aqueous slurry comprising dissolved ammonium dimolybdate and ammonium octamolybdate in water and an oxidizing agent; apply aqueous slurry between the copper and a polishing pad; apply a low pressure with high polish rates on the surface of semiconductor wafer |
| 06/30/2009 | US7553345 Polishing composition |
| 06/25/2009 | WO2009077412A2 Aqueous slurry comprising inorganic oxygen-containing particulates |
| 06/25/2009 | US20090162308 Use of 2,4'-dimethylpropiophenone as a fragrance substance |
| 06/25/2009 | DE102007062572A1 Ceroxid und kolloidales Siliciumdioxid enthaltende Dispersion Cerium oxide and colloidal silica dispersion containing |
| 06/25/2009 | DE102007062571A1 Ceroxid und Schichtsilikat enthaltende Dispersion Cerium oxide and silicate layer containing dispersion |
| 06/24/2009 | CN101463230A Polishing composite for hard disk substrate |
| 06/24/2009 | CN101463229A Grinding agent for dental ceramic material |
| 06/24/2009 | CN101463228A Stainless steel surface treating agent |
| 06/24/2009 | CN101463227A Chemico-mechanical polishing solution for barrier layer |
| 06/24/2009 | CN101463226A Chemico-mechanical polishing solution |
| 06/24/2009 | CN101463225A Chemico-mechanical polishing solution for barrier layer |
| 06/24/2009 | CN100505172C Polishing composition and its stock solution, and polishing method using same |
| 06/24/2009 | CN100503167C Composition for polishing |
| 06/23/2009 | US7550388 Polishing composition and polishing method |
| 06/23/2009 | US7550020 comprising cerium oxide abrasives, and cationic homo- or copolymer containing monomers of aminoalkyl group-containing (meth)acrylic ester or amide, aminoalkoxyalkyl group-containing (meth)acrylic ester; scratch resist; semiconductor production |
| 06/18/2009 | US20090156008 Polishing Composition and Polishing Method Using The Same |
| 06/18/2009 | US20090156007 Polishing slurry and polishing method |
| 06/18/2009 | US20090152240 Chemical-mechanical polishing composition and method for using the same |
| 06/17/2009 | EP2071615A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 06/17/2009 | EP2069451A1 Gallium and chromium ions for oxide removal rate enhancement |
| 06/17/2009 | CN101457127A Chemico-mechanical polishing liquid |
| 06/17/2009 | CN101457126A Chemico-mechanical polishing liquid |
| 06/17/2009 | CN101457125A Chemico-mechanical polishing liquid |
| 06/17/2009 | CN101457124A Chemico-mechanical polishing liquid |
| 06/17/2009 | CN101457123A Chemico-mechanical polishing liquid for copper process |
| 06/17/2009 | CN101457122A Chemico-mechanical polishing liquid for copper process |
| 06/16/2009 | US7547671 Water-soluble inorganic acid salt, an organic acid or organic acid salt, anionic or nonionic surfactant, a hydrophilic oxygen-containing hydrocarbon solvent, and water; fluoracarbon resin and a polishing material ( diamond, garnet, corundum, silica, sic, alundum); weatherproofing |
| 06/11/2009 | WO2009071351A1 A method for chemically-mechanically polishing patterned surfaces composed of metallic and nonmetallic patterned regions |
| 06/11/2009 | WO2009070969A1 A chemical-mechanical polishing liquid for polysilicon |
| 06/11/2009 | WO2009070968A1 A chemical-mechanical polishing liquid |
| 06/11/2009 | WO2009070967A1 A chemical-mechanical polishing liquid |
| 06/10/2009 | EP1622742A4 Chemical mechanical polishing compositions for step-ii copper liner and other associated materials and method of using same |
| 06/10/2009 | EP1444308A4 Cerium-based polish and cerium-based polish slurry |
| 06/10/2009 | CN101451049A Chemico-mechanical polishing liquid |
| 06/10/2009 | CN101451048A Chemico-mechanical polishing liquid |
| 06/10/2009 | CN101451047A Chemico-mechanical polishing liquid |
| 06/10/2009 | CN101451046A Polishing composite for silicon wafer polishing |
| 06/10/2009 | CN101451045A Process for preparing chemico-mechanical polishing liquid |
| 06/10/2009 | CN101451044A Chemico-mechanical polishing liquid |
| 06/10/2009 | CN100497510C H62 brass polishing liquid and its preparing process |
| 06/10/2009 | CN100497509C 抛光组合物和抛光方法 Polishing composition and polishing method |
| 06/10/2009 | CN100497508C Production of high-cerium rare-earth polishing powder |
| 06/04/2009 | WO2008052423A8 A chemical-mechanical polishing liquid for polishing polysilicon |
| 06/03/2009 | EP2064354A1 Leather care products containing acetals as the organic solvents |
| 06/03/2009 | EP1709129B1 Finishing compositions with reduced volatile organic compound content |
| 05/28/2009 | WO2009066141A1 An agent for the treatment of top-coat paint films to impart stain resistance and a method for the treatment of top-coat paint films to impart stain-resistance |
| 05/28/2009 | US20090137122 Method of passivating chemical mechanical polishing compositions for copper film planarization processes |
| 05/28/2009 | US20090133336 Polishing slurry, method of producing same, and method of polishing substrate |
| 05/28/2009 | DE102007057352A1 Passivierendes Gleitschleifen, insbesondere für Aluminium, Magnesium und Zink Passivation end vibratory finishing, especially for aluminum, magnesium and zinc |
| 05/27/2009 | EP2063461A1 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 05/27/2009 | EP2061853A1 Concentrated abrasive slurry compositions, methods of production, and methods of use thereof |
| 05/27/2009 | CN101440259A Metal polishing solution and polishing method |
| 05/27/2009 | CN101440258A Chemico-mechanical polishing solution for polysilicon |
| 05/27/2009 | CN101439500A Blasting method and blasting machine |
| 05/27/2009 | CN100491074C Method for controlling roughness of silicon crystal substrate material surface |
| 05/27/2009 | CN100491073C Method for controlling planeness during chemically mechanical polishing for ULSI multiple-layered copper wiring |
| 05/27/2009 | CN100491072C Method for controlling disc-like pit during chemically mechanical polishing for ULSI multiple-layered copper wiring |
| 05/26/2009 | CA2519420C Nanoporous ultrafine alpha-alumina powders and freeze drying process of preparing the same |
| 05/22/2009 | WO2009064010A1 Polishing composition comprising a n-substituted imidazole and a method for polishing a copper film |
| 05/22/2009 | WO2009046311A3 Composite slurries of nano silicon carbide and alumina |
| 05/21/2009 | US20090130849 Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use |
| 05/21/2009 | US20090130454 Strippable Floor Coating and Method of Forming the Coating |
| 05/20/2009 | EP2061070A1 Polishing agent for semiconductor integrated circuit device, polishing method, and method for manufacturing semiconductor integrated circuit device |
| 05/20/2009 | EP0939431B1 Cerium oxide abrasive and method of abrading substrates |
| 05/20/2009 | CN101437912A Oxidation-stabilized cmp compositions and methods |
| 05/20/2009 | CN100490082C Slurry composition for secondary polishing of silicon wafer |
| 05/19/2009 | US7534409 Pyrogenic silicon dioxide powder and dispersion thereof |
| 05/19/2009 | US7534277 Slurry composition for secondary polishing of silicon wafer |
| 05/13/2009 | EP1558689B1 Biliquid foam furniture polish |
| 05/13/2009 | EP1448736B1 Boron-containing polishing system and method |
| 05/13/2009 | CN100486765C Grinding polishing method based on magnetic rheology effect and its polishing device |
| 05/12/2009 | US7531108 Fine particle sizes; narrow particle size distribution; display devices and lighting elements; printed on explosives or ammunitions; currency; printed on confidential documentation |
| 05/07/2009 | WO2009058463A1 Composition, method and process for polishing a wafer |
| 05/07/2009 | WO2009058274A1 Chemical mechanical polishing and wafer cleaning composition comprising amidoxime compounds and associated method for use |
| 05/07/2009 | WO2009056491A1 Cmp slurry composition and process for planarizing copper containing surfaces provided with a diffusion barrier layer |
| 05/07/2009 | US20090117829 Polishing slurry for metal, and polishing method |
| 05/07/2009 | US20090114117 Leveling agent and water-based floor-polishing composition comprising the leveling agent |
| 05/07/2009 | DE102007027988B4 Verfahren zur Behandlung von Magnesiaestrichen A method for the treatment of magnesia |