Patents for C09G 1 - Polishing compositions (7,846)
07/2010
07/07/2010CN101768412A CMP slurry composition for barrier polishing for manufacturing copper interconnects, polishing method using the composition, and semiconductor device manufactured by the method
07/07/2010CN101767295A Chemical mechanical polishing composition and methods relating thereto
06/2010
06/30/2010CN101765647A Compositions and methods for chemical-mechanical polishing of phase change materials
06/30/2010CN101760181A Solidified glass decontamination intensifying anti-fogging frost-prevention antistatic agent
06/30/2010CN101760139A Furniture glossing care aerosol wax with antimicrobial function and preparation method thereof
06/30/2010CN101760138A Polishing solution for chemically mechanical polishing single-crystal magnesium oxide substrate
06/30/2010CN101760137A Polymeric barrier removal polishing slurry
06/30/2010CN101760128A Organic intensifying paint and preparation method thereof
06/29/2010US7744666 abrasives; for wirings of semiconductor devices
06/29/2010CA2387498C Zwitterionic siloxane polymers and ionically cross-linked polymers formed therefrom
06/24/2010WO2010070354A1 Treating, moving and removing particles in fluid-carrying apparatus
06/24/2010WO2010069149A1 Chemical-mechanical polishing liquid
06/23/2010EP2199353A1 Polymeric barrier removal polishing slurry
06/23/2010EP2197968A1 Furniture polish compositions substantially free of organic solvents
06/23/2010CN101747844A Chemically mechanical polishing solution and application thereof
06/23/2010CN101747843A Chemical-mechanical polishing solution
06/23/2010CN101747842A Chemical-mechanical polishing solution
06/23/2010CN101747841A Chemical-mechanical polishing solution
06/23/2010CN101747840A Chemical-mechanical polishing solution
06/17/2010US20100151196 Shaped abrasive particles with a sloping sidewall
06/16/2010EP2196509A1 Chemical Mechanical Polishing Composition for polishing substrates containing a low-k dielectric material and Methods Relating Thereto
06/16/2010CN1927975B Polishing slurry capable of removing polymer barrier layer
06/16/2010CN1860198B Non-polymeric organic particles for chemical mechanical polishing
06/16/2010CN1766028B 抛光组合物 The polishing composition
06/16/2010CN1746253B Polishing composition and polishing method using the same
06/16/2010CN1693411B Polishing composition and polishing method
06/16/2010CN101736344A Chemical mechanical polishing composition and methods relating thereto
06/16/2010CN101736098A Chinese herbal medicament type care product and production process thereof
06/16/2010CN101735881A All-synthetic grinding fluid
06/16/2010CN101735768A Method for preparing rare earth polishing powder
06/16/2010CN101735732A Liquid maintenance and beautification oil for leather shoes and leather
06/16/2010CN101735731A Nano-ceramic self-cleaning type leather shoe brightener
06/16/2010CN101735730A Composition and method for chemical mechanical polishing
06/15/2010US7736405 Chemical mechanical polishing compositions for copper and associated materials and method of using same
06/10/2010WO2010063165A1 Chmical-mechanical polishing liquid
06/09/2010EP2194570A1 Materials for polishing liquid for metal, polishing liquid for metal, mehtod for preparation thereof and polishing method using the same
06/09/2010CN101724348A Vehicle polishing wax
06/09/2010CN101724347A Chemical mechanical polishing solution
06/09/2010CN101724346A Chemical mechanical polishing solution
06/09/2010CN101724345A Metal surface polishing paste
06/09/2010CN101724344A Polishing liquid of silicon carbide substrate
06/09/2010CN101722462A Method for polishing both sides of a semiconductor wafer
06/09/2010CN101197268B Method for eliminating leftover after chemical mechanical grinding
06/08/2010US7732393 Oxidation-stabilized CMP compositions and methods
06/08/2010US7732101 polishing the surfaces of substrates using abrasive grains comprising silica sol and applying pressure to suppress surface projections; phase shifting masks used for producing semiconductors
06/03/2010US20100135858 Ink Composition and Oxygen Indicator
06/02/2010EP2190947A1 Copper cmp composition containing ionic polyelectrolyte and method
06/02/2010DE102008059044A1 Verfahren zum Polieren einer Halbleiterscheibe mit einer verspannt-relaxierten Si1-xGex-Schicht A method of polishing a semiconductor wafer with a strained-relaxed Si1-xGex layer
06/02/2010CN101200619B Bearing inner sleeve polishing oil additive convenient for cleaning
06/02/2010CN101177591B Metal polish and method for preparing the same
06/01/2010US7727630 nickel powder batches include particles having a small particle size, narrow size distribution and a spherical morphology, encapulated by a metal oxide selected from ZrO2, SiO2, b2O3, TiO2, Cu2O, CuO, Bi2o3, V2O5 and Al2O3
05/2010
05/26/2010CN1829773B Wood product and method therefor
05/26/2010CN1750239B Ceria-based polish processes, and ceria-based slurries
05/26/2010CN101712848A Metal vibration polishing solution and preparation method thereof
05/26/2010CN101037585B Polishing fluid and polishing method
05/19/2010EP2186121A2 Compositions and methods for modifying a surface suited for semiconductor fabrication
05/19/2010CN101113305B Nonferrous metal material surface cleaning rubbing paste and method for making same
05/18/2010US7718535 Slurry compositions and CMP methods using the same
05/14/2010WO2009133282A3 Liquid perfumed patina for covering surfaces such as wall surfaces
05/12/2010EP2184330A1 Chemical mechanical polishing composition and methods relating thereto
05/12/2010EP2183333A2 Compositions and methods for chemical-mechanical polishing of phase change materials
05/12/2010CN1961055B Electrochemical-mechanical polishing composition and method for using the same
05/12/2010CN1806318B Multi-step chemical mechanical polishing of a gate area in a finfet
05/12/2010CN1723007B Aerosol delivery systems
05/12/2010CN1715358B Polishing composition
05/12/2010CN101705055A Environment-friendly antibiosis glazing agent and preparation method thereof
05/12/2010CN101705054A Preparation method of grinding system
05/05/2010CN1646650B Free radical-forming activator attached to solid and used to enhance CMP formulations
05/04/2010US7708788 Cerium oxide abrasive and method of polishing substrates
04/2010
04/29/2010DE112004001041B4 Verfahren zur Herstellung eines Halbleiterbauelements umfassend ein chemisch-mechanisches Mehrschrittpolierverfahren für einen Gatebereich in einem FINFET A process for producing a semiconductor device comprising a chemical mechanical polishing method for a multi-step gate region in a FinFET
04/28/2010EP2178994A1 Polish product free of volatile components
04/28/2010CN1771192B Process for the production of metal oxide and metalloid oxide dispersions
04/21/2010CN101696345A Aluminum doped cerium rouge and preparation method thereof
04/20/2010US7700489 depositing a silica film on the substrate having formed thereon a wiring pattern, coating a SOG film on the silica film, and polishing the SOG film using a slurry containing cerium oxide and cationic surfactant with a chemical-mechanical polishing process; polishing selectivity
04/20/2010US7700159 Protective coatings; gloss; antisoilants
04/20/2010US7699684 CMP porous pad with component-filled pores
04/15/2010WO2010041223A1 Abrasive molten grains
04/15/2010WO2010040280A1 Chemical-mechanical polishing liquid
04/15/2010WO2010009304A3 Finishing glaze for decorative texturing medium
04/15/2010US20100090159 Semiconductor polishing composition
04/15/2010CA2739567A1 Abrasive molten grains
04/14/2010EP2173706A1 Fluorinated sulfonate surfactants
04/14/2010CN101693813A Silicon-based fine polishing liquid
04/08/2010WO2010037265A1 Chemical-mechanical polishing liquid
04/08/2010WO2010037264A1 Chemical-mechanical polishing slurry
04/08/2010US20100083584 Dispersion comprising cerium oxide and sheet silicate
04/08/2010DE102008049175B3 Method for treating a surface of silicon carbide substrate for epitaxial layer growth on the treated silicon carbide surface, comprises applying polishing slurry containing calcium fluoride particles and/or oxidation agent, on the surface
04/06/2010CA2508332C Composition and method for copper chemical mechanical planarization
04/01/2010WO2010034181A1 Use of amine compound and chemical-mechanical polishing liquid
03/2010
03/31/2010CN101684393A Chemical mechanical polishing sizing agent
03/31/2010CN101684392A Chemical mechanical polishing solution
03/31/2010CN101684391A Chemical mechanical polishing solution
03/31/2010CN101683721A Chemical mechanical polishing manufacture procedure, hydrogen peroxide application and cleaning method
03/30/2010US7687393 Polishing composition and rinse composition
03/25/2010DE102007035266B4 Verfahren zum Polieren eines Substrates aus Silicium oder einer Legierung aus Silicium und Germanium A method for polishing a substrate of silicon or an alloy of silicon and germanium
03/24/2010CN101679810A An aqueous slurry composition for chemical mechanical polishing and chemical mechanical polishing method
03/24/2010CN101679809A Dispersion comprising cerium oxide, silicon dioxide and amino acid
03/24/2010CN101679808A Dispersion comprising cerium oxide, sheet silicate and amino acid
03/24/2010CN101679790A Aqueous compositions of fluorinated surfactants and methods of using the same
03/24/2010CN100595032C Soft crisp functional crystal abrasive machining method
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