| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 03/19/2003 | EP0929608B1 Curable thermoset resin composition |
| 03/19/2003 | CN1404516A Powdered thermosetting composition for coatings |
| 03/19/2003 | CN1403501A Hard transparent epoxy resin-base composite material and its synthesis process |
| 03/19/2003 | CN1103350C Epoxy resin composite material and its producing process |
| 03/19/2003 | CN1103349C Epoxy resin composition flexibilized with liquid and hydroxyl rubber |
| 03/18/2003 | US6534601 Flame retardant epoxy resin modified with phosphorus and silicon |
| 03/18/2003 | US6534568 Powder coating or adhesives employing silanes or silane treated fillers |
| 03/18/2003 | US6534193 Liquid epoxy resin composition and semiconductor device |
| 03/18/2003 | US6534188 Cured polysiloxane |
| 03/18/2003 | US6534179 Polytriazine product of cyanate ester monomer or prepolymer and a bismaleimide, and a flame inhibitor of a polyepoxide reacted with an organic phosphorus compound |
| 03/18/2003 | US6534177 Crosslinkable polymer composition |
| 03/18/2003 | CA2122618C Thermoplastic polyester low profile additives for vinyl ester polyester resinous compositions |
| 03/13/2003 | WO2003021138A1 Photocurable form-in-place gasket for electronic applications |
| 03/13/2003 | WO2003020846A1 Color-changing material composition and color-changing membranes made by using the same |
| 03/13/2003 | WO2003020658A1 Calcium carbonate filled epoxy urethane string binders |
| 03/13/2003 | US20030050399 Cured epoxy resin provides solder crack resistance on use of lead-free solder and improved flame retardance |
| 03/13/2003 | US20030050397 Thermoset compositions, tougheners, and composites thereof |
| 03/12/2003 | EP1291096A2 Method for producing isolating plates and binder mixture therefor |
| 03/12/2003 | EP1290089A2 Soft polymer composition including epoxy |
| 03/12/2003 | EP1290088A1 Thermoset materials with improved impact resistance |
| 03/12/2003 | CN1402767A Powder coating compositions |
| 03/12/2003 | CN1102894C Article including sealant layer |
| 03/06/2003 | WO2003018687A2 Thermosetting polyvinyl alcohol binder resin composition, slurry of electrode mix, electrode, non-aqueous electrolysis solution-containing secondary battery and use of thermosetting polyvinyl alcohol binder resin as electrode material |
| 03/06/2003 | WO2003018674A1 Intermediate for composite material molding and fiber-reinforced composite material |
| 03/06/2003 | US20030045635 Polysilazane-modified polyamine hardeners for epoxy resins |
| 03/06/2003 | US20030044588 Insulating resin composition for multi-layered printed circuit wiring board, multi-layerd printed circuit wiring board using the particular resin composition, and manufacturing the same |
| 03/06/2003 | US20030044521 Low voc laminating formulations |
| 03/06/2003 | US20030042468 Highly conductive molding compounds for use as fuel cell plates and the resulting products |
| 03/06/2003 | US20030042466 Modified blend of epoxy resin and polyanhydride |
| 03/05/2003 | EP1288259A1 Noncrystalline cyclic polyolefin/epoxidized diene block copolymer composition and sheet thereof |
| 03/05/2003 | EP1287071A1 Epoxy resin composition and semiconductor device |
| 03/05/2003 | EP1287069A1 Sound deadening and structural reinforcement compositions and methods of using the same |
| 03/05/2003 | EP1287063A1 Epoxy-resin systems, which are resistant to ageing, moulding materials and components produced therefrom and the use thereof |
| 03/05/2003 | CN1400988A 热固性树脂组合物 A thermosetting resin composition |
| 03/05/2003 | CN1400987A Branched polymeric surfactant reaction products methods for their preparation, and uses therefor |
| 03/05/2003 | CN1400246A Free radical polymerized resin composite |
| 03/04/2003 | US6528607 Process control; controlling temperature |
| 03/04/2003 | US6528594 Flowable glanulates |
| 03/04/2003 | US6528571 Extrusion freeform fabrication of soybean oil-based composites by direct deposition |
| 03/04/2003 | US6528552 Permanent protective coating of a printed wiring board; aluminum hydroxide, inorganic molybdenum compound, zinc stannate or zinc hydroxystannate in a resin |
| 03/04/2003 | US6528546 Reuse; precipitation with base |
| 02/27/2003 | WO2003016394A1 Composition of bulk filler and epoxy-clay nanocomposite |
| 02/27/2003 | US20030040578 Electrode-forming compositions and electrode members |
| 02/27/2003 | US20030039835 Ion exchanging clay; encapsulated electronic package |
| 02/26/2003 | EP1285939A1 Epoxy resin compositions and solid state devices encapsulated therewith |
| 02/26/2003 | EP1108259B1 Electrically conductive layer material |
| 02/26/2003 | EP1040150B1 Novolaks as water-unaffected accelerators for epoxy resin hardeners |
| 02/26/2003 | CN1399662A Formulation for strippable adhesive and coating films and high preformance adhesives |
| 02/26/2003 | CN1398918A Thermosetting resin composition |
| 02/25/2003 | US6525159 Ketimine and epoxy resin and/or modified silicone; shelf stability; high curing rate |
| 02/25/2003 | US6524989 Tetraorganophosponium dicyclic tetraorganoborate catalyst |
| 02/25/2003 | US6524711 Thermosetting resin composition, and resin-covered metal foil, prepreg and film-shaped adhesive all using the composition |
| 02/25/2003 | US6524709 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
| 02/25/2003 | US6524697 Temperature sensor and electronic equipment using the same |
| 02/20/2003 | WO2003014210A1 Flame retardant molding compositions |
| 02/20/2003 | WO2003014177A1 Resin composition, composition for solder resist, and cured article obtained therefrom |
| 02/20/2003 | US20030035903 Solventless thermosetting photosensitive via-filling ink |
| 02/20/2003 | CA2449052A1 Flame retardant molding compositions |
| 02/19/2003 | EP0763583B1 Water-dispersible pressure-sensitive adhesive composition, process for production thereof, and pressure-sensitive adhesive products made therefrom |
| 02/19/2003 | CN1398274A Resin compound for forming interlayer insualting layer of printed wiring board, resin for forming insulating layer using resin compound |
| 02/19/2003 | CN1101836C Epoxy resin/inorganic matter composite aqueous base dispersion system and its prepn. method |
| 02/19/2003 | CN1101835C Process for preparing epoxy resin and its water-base disperse system for compounding with inorganic substances |
| 02/19/2003 | CN1101830C Water compatible curing agents for epoxy resins |
| 02/18/2003 | US6521732 Epoxy/acrylic terpolymer self-fixturing adhesive |
| 02/18/2003 | US6521687 For bonding an elastomeric material to a metallic material |
| 02/18/2003 | US6521354 Epoxy resin composition and semiconductor device |
| 02/13/2003 | WO2003011971A1 Epoxy resin |
| 02/13/2003 | WO2003011939A1 Curable compositions for display devices |
| 02/13/2003 | WO2002083759A3 Silicone liquid crystals, vesicles, and gels |
| 02/13/2003 | US20030032729 Epoxy compound, an acrylic resin having an epoxy group, and a thermally activating ionic polymerization catalyst such as a sulfonium compound which can be dissolved by heating and crystallized by cooling; storage stability; various coatings |
| 02/13/2003 | US20030032717 A reaction product obtained by combining an amine functional silicone, an epoxy functional silicone and water; useful in personal care for preparing various skin, hair, and underarm products |
| 02/13/2003 | US20030030155 Resin component for encapsulating semiconductor and semiconductor device using it |
| 02/12/2003 | EP1282660A1 Rheology-controlled epoxy-based compositions |
| 02/12/2003 | CN1396943A Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 02/12/2003 | CN1396207A Flame-retarded resin composition and its forming product |
| 02/12/2003 | CN1101420C Poly(phenylene ether) thermoset compositions |
| 02/11/2003 | US6518362 Mixtures of polyphenylene ether and polystyrene, with uncured epoxy components which comprise a curable epoxy and an epoxy curing agent |
| 02/11/2003 | US6518332 Good flow and curing properties, reliability, do not pose hazard to human health or environment |
| 02/11/2003 | US6518331 Comprising epoxy resins and epoxy resin curing agents, said epoxy resins comprising bisphenol A type epoxy resins having epoxy equivalent of not less than 400 and epoxy resins having epoxy equivalent of less than 400 |
| 02/11/2003 | US6517743 Epoxy resin composition having high neutron shielding ability, and a transparent shielding materials for neutron obtained by curing said epoxy resin composition |
| 02/06/2003 | WO2003010254A2 Unsaturated powder coating compositions |
| 02/06/2003 | WO2003010248A1 Radiation curable powder coating compositions |
| 02/06/2003 | US20030027918 Contains a filler of spherical fused silica having a maximum particle size of not larger than 45 mu m and may contain metal impurities having a particle size of not larger than 53 mu m. |
| 02/06/2003 | US20030027899 Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device |
| 02/06/2003 | US20030026909 Method and composition of disrupting feeding patterns of woodpeckers |
| 02/06/2003 | US20030024723 Composition for layer on outer surface of first resin layer encapsulating semiconductor, containing epoxy resin, phenolic resin, curing accelerator and conductive or magnetic particles having surfaces coated with insulating inorganic material |
| 02/05/2003 | EP1280842A1 Aqueous two-component cross-linkable composition |
| 02/05/2003 | EP1141127B1 Hydrophobic epoxide resin system |
| 02/05/2003 | EP0997511B1 Thermosetting, high-solid coating composition and method of forming topcoating by using the same |
| 02/05/2003 | EP0794984B1 Resin composition for powder coating |
| 02/05/2003 | EP0666885B1 Novel ionic emulsion polymers and their preparation |
| 02/05/2003 | CN1395605A Treating agent for imparting hydrophilicity and high corrosion resistance, hydrophilizing fluid, and method of hydrophilizing |
| 02/05/2003 | CN1394900A Preparation method of nano particles with high refractive index and polymer nano composite film material |
| 02/05/2003 | CN1100827C Aqueous dispersions of epoxy resins |
| 02/04/2003 | US6515048 Adhesive powder |
| 02/04/2003 | US6515047 Composition of epoxy resin and triazine-formaldehyde-phenol resin |
| 02/04/2003 | US6515045 For temporarily bonding a removable flexible substrate to a rigid permanent substrate |
| 02/04/2003 | US6514657 Photosensitive composition for lithographic printing plate and photosensitive lithographic printing plate |
| 02/04/2003 | US6514560 Blend of thermosetting resin and conductive particles |
| 02/04/2003 | US6514433 Connecting material |