Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
07/2003
07/22/2003US6596373 Epoxy resin composition for fiber-reinforced composite material prepreg, and fiber-reinforced composite material
07/17/2003WO2003057780A1 Powdered epoxy composition
07/17/2003WO2003057754A1 Highly functional polymers
07/17/2003WO2003057753A1 Adhesive of epoxy compound, aliphatic amine and tertiary amine
07/17/2003WO2003057749A1 Organic compositions
07/17/2003US20030134985 Styrene-butadiene block copolymer coupled with epoxidised vegetable oils used for shoe soles
07/17/2003US20030131937 Thermosetting resin compositions useful as underfill sealants
07/17/2003CA2468699A1 Powdered epoxy composition
07/17/2003CA2443846A1 Organic compositions
07/16/2003EP1327642A1 Carboxylated photosensitive resin, alkali-developable photocurable/heat-curable composition containing the same, and cured article obtained therefrom
07/16/2003CN1114664C Structure and its manufacturing method
07/16/2003CN1114647C Flowable granulates
07/15/2003US6593434 Preparing polyester block copolymer with excess unreacted lactones to be removed
07/15/2003US6593403 Additive mixture for improving the mechanical properties of polymers
07/15/2003US6592783 Anisotropic conductive adhesive film
07/15/2003US6592780 Using epoxy resin
07/15/2003CA2068465C Process for priming plastic substrates, coating compositions for this purpose, and the use thereof
07/10/2003WO2003055957A1 Multi-phase structural adhesives
07/10/2003US20030130439 Hybrid materials employing PPE/polystyrene/curable epoxy mixtures
07/10/2003US20030130437 Comprising an epoxy resin and a vinyl polymer which has a main chain produced by living radical polymerization and has a reactive functional group at a main chain terminus; flexiblity, hardness
07/10/2003US20030130435 Modified polyvinyl acetal resin, curable resin composition containing the same, and laminated products
07/10/2003US20030129542 Contact planarization materials that generate no volatile byproducts or residue during curing
07/10/2003US20030129383 Liquid thermosetting resin composition, printed wiring boards and process for their production
07/09/2003EP1325937A1 Epoxy resin composition, process for producing fiber -reinforced composite materials and fiber-reinforced composite materials
07/09/2003EP1325053A1 Die-attaching paste and semiconductor device
07/09/2003CN1428470A Length-measuring staying device for weft
07/09/2003CN1113926C Storage-stable compositions useful for production of structural forms
07/08/2003US6589656 Epoxy resin composition, prepreg and metal-clad laminate
07/08/2003CA2033882C Curing compositions
07/03/2003WO2003054069A1 Expandable epoxy resin-based systems modified with thermoplastic polymers
07/03/2003WO2003053536A1 Novel demulsifiers,their preparation and use in oil bearing formations
07/03/2003US20030125464 Prepared by melt-kneading the blends; moldability, tensile strength, dimensional stability, bonding strength, impact resistance, flexibility, embossing
07/03/2003US20030125433 Chemical resistance
07/03/2003US20030124378 Fluxing underfill compositions
07/03/2003US20030124355 2,4-toluenebis(N,N-dimethyl urea) catalyst; preferably contains a latent curing agent, such as dicyandiamide.
07/03/2003US20030124248 Epoxy resin; and a styrene-maleic anhydride copolymer having a glass transition temperature less than 105 degrees C; low gloss finishes at low curing temperatures, as well as consistent gloss over a wide range of curing temperatures.
07/03/2003CA2471368A1 Expandable epoxy resin-based systems modified with thermoplastic polymers
07/02/2003EP1324135A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition
07/02/2003EP1323761A1 Polyphenol resin, process for its production, epoxy resin composition and its use
07/02/2003EP0738759B1 Epoxy resin composition for sealing photosemiconductor device
07/02/2003CN1427869A Noncrystalline cyclic polyolefin/epoxidized diene block copolymer composition and sheet
07/02/2003CN1427831A Reworkable composition of oxirane (S) or thiirane (S)-containing resin and curing agent
07/02/2003CN1427753A Fluxing under fill compositions
07/02/2003CN1427036A Power distribution equipment box made of composite material
07/02/2003CN1427035A Paste for connecting circuit, anisotropic conducting paste and application thereof
07/02/2003CN1113083C Semiconductor sealing epoxy resin composition and semiconductor device using same
07/02/2003CN1113074C Phenolic resin as water-unaffected accelerators for epoxy resin hardeners
07/01/2003US6586549 Water-absorbing composition and its use
07/01/2003US6586526 Curable resin composition, multilayer printed circuit board manufactured by using the composition, and method for the production thereof
07/01/2003US6586496 Photocurable resin composition for sealing material and method of sealing
06/2003
06/26/2003WO2003051955A1 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
06/26/2003WO2003051649A2 Method of making models
06/26/2003US20030120021 Crosslinking agents
06/26/2003US20030119987 Non-polyvinyl chloride, interpenetrating network epoxy/urethane acrylates
06/26/2003US20030118835 Anhydride polymers for use as curing agents in epoxy resin-based underfill material
06/26/2003US20030116347 Electronic component
06/26/2003US20030116273 Using an organosilicon compound primer; heat resistance, bonding strength
06/25/2003EP0620259B1 Epoxy/polyester hot melt compositions
06/25/2003CN1426437A Non-aqueous solvent-free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers
06/25/2003CN1425709A Process for preparing dynamic cured epoxy resin/polypropylene blend
06/25/2003CN1112419C Non-aqueous solvent free process for making UV carable adhesives and sealants from epoxidized monohydroxylated diene polymers
06/25/2003CN1112418C Solvent free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers
06/24/2003US6583201 Polymeric resin, a conductive filler, a curing agent, an optional (reactive) diluent, and as corrosion inhibitor, one of 6-hydroxyquinoline, 2-hydroxyquinoline or piperidene to improve contact resistance in harsh conditions
06/24/2003US6583198 A photocurable resin consists of an acid modified vinyl group containing epoxy resin, an elastomer, a photopolymerization initiator, a diluent and a curing agent, can give high performance cured film
06/19/2003US20030114631 Comprises trigylcidylisocyanurate for production of epichlorohydrin-free resins; papermaking
06/19/2003US20030114606 A phosphazene compound or polyphosphazenes; fireproofing
06/19/2003US20030114574 Heat processing a thermosetting resin, an aromatic polysulfone resin and an organic solvent
06/19/2003US20030114556 Epoxy resin component, filler, initiator; filler contains silanized fused silica; processable as a one-component system
06/19/2003US20030113792 Epoxide polymer surfaces
06/19/2003US20030112307 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink
06/18/2003EP1282660A4 Rheology-controlled epoxy-based compositions
06/18/2003CN1425042A Coherent insert
06/17/2003US6579943 Method of producing modified polyester moulded articles, and said moulded articles
06/17/2003US6579588 Substrate provided with removable adhesive of polyepoxide, curing agent and microspheres
06/17/2003US6579474 A conductive composition, and articles and methods using the conductive composition are disclosed. conductive particles in an amount of at least about 75 wt. % based on the weight of the composition, wherein at least 50% by weight of the
06/17/2003US6579325 Silicone compositions for treating wool materials
06/17/2003CA2079657C Solid compositions of polyglycidyl compounds having a molecular weight of less than 1500
06/12/2003WO2003048251A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s)
06/12/2003WO2003048238A1 Method of making a finished product
06/12/2003WO2003048235A1 Heat-curable resin composition
06/12/2003WO2003048170A1 Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same
06/12/2003US20030109603 Epoxy resin and polyglycoside based polymers and process for the preparation thereof
06/11/2003EP1317499A1 Method for cross-linking polyacrylates
06/11/2003CN1423678A Flame retardant phosphorus element-containing epoxy resin compositions
06/11/2003CN1423674A Flame retardant epoxy molding compositions
06/11/2003CN1422897A Self-lubricating organic-inorganic composite nano film and preparation method thereof
06/11/2003CN1422881A Flame-retarding nitrogenous epoxy resin and its composition
06/11/2003CN1111187C Polyester compositions and use thereof in extrusion coating
06/11/2003CN1111186C Single-component thermosetting epoxy resin system
06/11/2003CN1111179C Nucleo capsid particles and solidifiable epoxy resin composition containing same
06/10/2003US6576718 Powder coating of thermosetting resin(s) and poly(phenylene ethers(s))
06/10/2003US6576297 Curable resin compositions
06/10/2003CA2269803C Gas barrier coating compositions containing platelet-type fillers
06/05/2003WO2003046076A1 Toughened thermosetting resins and preparation of the same
06/05/2003WO2003046042A1 Radiation curable resin composition for making colored three dimensional objects
06/05/2003WO2003046026A1 Epoxy group containing vinylidene fluoride copolymer, and resin composition, electrode structure and non-aqueous electrochemical element comprising the same
06/05/2003US20030105175 Two component (epoxy/amine) structural foam-in-place material
06/05/2003US20030102466 Anisotropic conductive adhesive film
06/04/2003CN1422316A Impact-resistant epoxy resin compositions
06/04/2003CN1422293A Aqueous two-component cross-linkable composition
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