| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
|---|
| 03/25/2004 | CA2535943A1 An apparatus for the application of a curable composition to a fastener and curable compositions suitable for application to a fastener |
| 03/24/2004 | EP1399511A2 Hydrolysis resistant polyesters and articles made therefrom |
| 03/24/2004 | EP1185808B1 Gasket and method for producing a gasket |
| 03/24/2004 | CN1484674A Thermosetting resin composition and prepreg laminate for circuit board and printed circuit board each made therewith |
| 03/24/2004 | CN1142977C Thermoplastic plastics composite containing cross-linked phase |
| 03/23/2004 | US6709753 Adherence, heat resistance and humidity resistance, flexibility and impact resistance |
| 03/18/2004 | US20040054119 Curing agent for epoxy resins and epoxy resin composition |
| 03/18/2004 | US20040054081 Crosslinking using ultraviolet radiation; pressure sensitive adhesives |
| 03/18/2004 | US20040054061 Waterproof, heat resistance, shockproof; undercoating for semiconductor, flip chips |
| 03/18/2004 | DE10241510A1 Preparation of nano composites by organic modification of nano filler useful as a paint, adhesive, casting composition, in aircraft construction, electronics, automobile finishing, and as a parquet flooring lacquer |
| 03/17/2004 | EP1169357A4 Hydroxy-epoxide thermally cured undercoat for 193 nm lithography |
| 03/17/2004 | CN1483020A Methyl propyl ketone peroxide formulations and their use in processes to cure unsaturated polyester resins |
| 03/17/2004 | CN1142215C Strong alkaline corrosion resistant material composition and firming agent therefor |
| 03/16/2004 | US6706824 Heating, mixing and extrusion of a polyester with the addition of aromatic dicyanate and sterically hindered hydroxyphenyl-alkyl-phosphonic ester or secondary aromatic amine; waste recycling |
| 03/16/2004 | US6706772 Two component (epoxy/amine) structural foam-in-place material |
| 03/16/2004 | US6706417 Fluxing underfill compositions |
| 03/16/2004 | US6706404 Solventless, homogeneity blend |
| 03/11/2004 | WO2004020506A2 Polyether polyamine agents and mixtures therefor |
| 03/11/2004 | WO2004020485A1 Reactive and gel-free compositions for making hybrid composites |
| 03/11/2004 | WO2003082996A3 Coating composition less susceptible to surface defects |
| 03/11/2004 | WO2003063572A3 Thermoset materials with improved impact strength |
| 03/11/2004 | WO2003028644A3 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes |
| 03/11/2004 | US20040048971 Epoxy resin composition for semiconductor encapsulation |
| 03/11/2004 | US20040048072 N-substituted arylamino-phenol-formaldehyde condensates |
| 03/11/2004 | CA2496457A1 Reactive and gel-free compositions for making hybrid composites |
| 03/10/2004 | CN1481421A Hardoner for epoxy of polyols and n-contg hardener |
| 03/10/2004 | CN1481408A Method for making biodegradable polyhydroxyalkanoate copolymers having improved crystallization properties |
| 03/10/2004 | CN1141505C Nano high-property resin composite material pipeline and making method thereof |
| 03/09/2004 | US6703124 Epoxy resin composition and laminate using the same |
| 03/04/2004 | WO2004018584A1 Adhesive film |
| 03/04/2004 | US20040044175 Mixture containing epoxy resin and curing agents; corrosion resistance; covering concrete with sheath |
| 03/04/2004 | US20040044168 Phosphorus- and nitrogen-containing resin hardener and a flame retarding resin composition containing said hardener |
| 03/04/2004 | US20040044161 Semiconductor dielectric |
| 03/04/2004 | US20040044147 Epoxy resin composition, process for producing fiber-reinforced composite materials and fiber-reinforced composite materials |
| 03/04/2004 | US20040044102 Mixture of addition polymer and epoxy resin |
| 03/04/2004 | US20040044095 Reactive and gel-free compositions for making hybrid composites |
| 03/03/2004 | EP1394229A1 Fluorine-containing resin coating compositions, primers for etfe coating, and coated articles |
| 03/03/2004 | CN1140602C Plugging compound for chemical compound and its product |
| 03/03/2004 | CN1140560C Cyanate ester composition and cured product thereof |
| 02/26/2004 | WO2004016703A1 Epoxy compositions having improved shelf life and articles containing the same |
| 02/26/2004 | WO2003041464A3 Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
| 02/26/2004 | WO2003035718A9 Hardenable cyanate compositions |
| 02/26/2004 | US20040039154 The epoxy resin includes a compound having two or more epoxy groups in one molecule, a compound having two or more phenolic hydroxy groups, in a molecule, and a trisubstituted phosphoniophenolate or salt as a curing accelerator |
| 02/26/2004 | US20040039136 Addition condensation copolymers, having chemical resistance, used as binders for agglomeration of marble, granite, quartz or stone powders |
| 02/26/2004 | US20040039133 Polyoxyalkylene amines formed by reacting polyethers with epichlorohydrin and primary amines, then curing with epoxy resins to form thermosetting resins having chemical resistance, used as seals moldings or coverings |
| 02/26/2004 | US20040039120 Process for producing a prepreg resin composition |
| 02/26/2004 | US20040039084 Curable epoxy resin casting materials of a core/shell polymer as toughness modifier, aluminium oxide and a certain phosphate compound as filler; crosslinked castings used as dielectrics |
| 02/26/2004 | US20040036199 Silicone-modified single-component casting compound |
| 02/26/2004 | DE10326536A1 Phenolic resin, useful for the production of epoxy resin systems for the encapsulation of semi-conductor devices, is prepared by reaction of an aromatic dihydroxyl compound with a phenol compound |
| 02/25/2004 | CN1478219A Photocurable and thermosetting resin composition |
| 02/25/2004 | CN1478127A Filled epoxy resin system having high mechanical strength values |
| 02/25/2004 | CN1139634C Soldifiable composition based on polymer containing free carboxy |
| 02/25/2004 | CN1139614C Epoxy resin solidified microsphere water-base system and its preparing method |
| 02/24/2004 | US6696506 Cationic photocatalyst composition and photocurable composition |
| 02/24/2004 | CA2205465C Epoxy polysiloxane coating and flooring compositions |
| 02/24/2004 | CA2084588C Stabiliser mixture |
| 02/19/2004 | US20040034187 A curing agent contains a fluorene diphenol rings branching with silicone compounds or modified to polysiloxane; a curied elastomeric sheets having a low elasticity, toughness and dielectrics; laminating electric circuits |
| 02/19/2004 | US20040034161 Mixtures of polyepoxides, phenolic resin curing agent, zinc molybdate, polysiloxanes, polyethersiloxane copolymers and fillers, used as flameproofing casings for electronics |
| 02/19/2004 | US20040034154 Epoxide-type formaldehyde free insulation binder |
| 02/19/2004 | US20040034142 Laser-marking thermoplastic resin composition |
| 02/19/2004 | US20040034136 Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same |
| 02/19/2004 | US20040034127 Flame retardant epoxy resin composition, and prepreg and fiber-reinforced composite materials made by using the composition |
| 02/19/2004 | US20040034126 Hydrolysis resistant polyester compositions and related articles and methods |
| 02/19/2004 | US20040034125 Phosphonium borate catalyst containing a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and monovalent anion portion in which four specific groups are bonded to boron atom |
| 02/19/2004 | US20040034124 99 to 20% of a thermoset resin, 1 to 80% of impact modifier containing at least one block copolymer or tripolymer; thermoset resin originates from the reaction of a thermosetting epoxy resin and of a hardener |
| 02/19/2004 | US20040033347 Method of making a composite with a barrier layer in a closed mold process and composite produced thereby |
| 02/19/2004 | US20040033324 Containing a hydroxyl-containing aromatic compound, such as a phenol-formaldehyde condensate |
| 02/18/2004 | EP1389631A1 Epoxy resin compositions |
| 02/18/2004 | EP1066356B1 Coating composition |
| 02/17/2004 | US6692793 Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film |
| 02/17/2004 | US6692422 Roll |
| 02/12/2004 | WO2004013239A1 Epoxy resin powder coating material |
| 02/12/2004 | WO2004013224A1 Thermoplastic composition having low gloss appearance |
| 02/12/2004 | US20040029999 Binding agent mixture and the use thereof |
| 02/12/2004 | US20040028909 Synthetic composition based on thermosetting resins |
| 02/12/2004 | CA2494081A1 Thermoplastic composition having low gloss appearance |
| 02/11/2004 | EP1387860A1 Moulding composition for producing bipolar plates |
| 02/11/2004 | EP1115768B1 Epoxy curing agent of phenol-aldehyde reacted with polyamine |
| 02/11/2004 | CN1474892A Method and composition for cutting dry fabric |
| 02/11/2004 | CN1473874A Flame-retardant epoxy resin composition, semiconductor packaging material using said composition, and resin packaged semiconductor |
| 02/11/2004 | CN1137919C Hardener for opoxy resin and epoxy resin composition |
| 02/05/2004 | WO2004011542A1 Epoxy resin composition |
| 02/05/2004 | US20040024122 Thermoplastic composition having low gloss appearance |
| 02/05/2004 | US20040024113 Polymerizable compositions based on epoxides |
| 02/05/2004 | US20040024079 Non-aqueous solvent-free process for making uv curable adhesive and sealants from expodized monohydroxylated diene polymers |
| 02/05/2004 | US20040023158 Solid imaging compositions for preparing polyethylene-like articles |
| 02/05/2004 | US20040023121 Electrolyte compositions |
| 02/05/2004 | DE19851810B4 Härtbares Harz und Harzmasse Curable resin and resin composition |
| 02/05/2004 | DE10216736A1 Flammschutzmittel für Polymere enthaltend eine Mischung aus zwei verschiedenen Arylphosphaten, deren Herstellung und deren Verwendung Flame retardants for polymers comprising a mixture of two different aryl phosphates, their preparation and their use |
| 02/04/2004 | EP1183294B1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 02/04/2004 | CN1472253A Optical solidifying-thermo solidifying resin composition and its solidified products |
| 02/04/2004 | CN1472252A Artistic sculpture shaping mud |
| 02/04/2004 | CN1472246A Reinforced toughened polypropylene material preparing method |
| 02/04/2004 | CN1472205A Benzoxazine intermediate containing N-allyl and composition and preparation thereof |
| 02/04/2004 | CN1137212C Modified furfural-acetone epoxy as reinforcing, concreting and grouting material and its preparation |
| 02/04/2004 | CN1137180C Curable polymeric composition and use in protecting substrate |
| 02/03/2004 | US6686047 For producing coatings with high hardness, scratch resistance, abrasion resistance, low curling properties, adhesion, and chemical resistance |
| 02/03/2004 | US6685851 For solubilizing a hydrophobic amine in water; as epoxy resin curing agents which yield highly cross linked, water resistant and abrasion resistant adhesive films |
| 01/29/2004 | WO2004009717A1 Superprimer |
| 01/29/2004 | WO2004009649A1 Preparation of acrylic polymer sol for coating |