| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
|---|
| 10/31/2002 | US20020161121 Curable resin composition, coating composition and method for forming coated film |
| 10/31/2002 | US20020160895 Roll |
| 10/31/2002 | US20020160290 Forming electrostatic latent images; mixture of binder and coloring agent |
| 10/31/2002 | US20020157788 Novel polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same |
| 10/30/2002 | EP1253811A1 Thermosetting resin composition and process for producing the same |
| 10/30/2002 | EP1252244A1 Rosin-modified epoxy acrylates |
| 10/30/2002 | EP1196485A4 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| 10/30/2002 | CN1377386A Flame-retardant polyester resin composition, molded article thereof, and method of molding the same |
| 10/30/2002 | CN1376737A Epoxy resin toughened by composite rubber/clay toughening agent and its preparing process |
| 10/29/2002 | US6472472 Solvent-free uncured, flexible, protective coatings such as for metal cans; blend of two polyesters of given molecular weight and glass transition temperatures, and optionally a modifying resin, inorganic filler, flow control agent |
| 10/29/2002 | US6472070 Fire-resistant coating material |
| 10/24/2002 | WO2002083759A2 Silicone liquid crystals, vesicles, and gels |
| 10/24/2002 | WO2002056921A3 Nonaqueous compositions and additives therefor |
| 10/24/2002 | US20020156218 Curable resin composition and product treated by the same |
| 10/24/2002 | US20020156204 Liquid crystal displays with a transparent resin plate which is obtained by curing an epoxy resin |
| 10/24/2002 | US20020155298 Mixture of epoxy resins, curing agents, solvent and organophosphorus compound |
| 10/24/2002 | US20020155225 Method for charge-modifying polyester |
| 10/23/2002 | CN1376175A Cured coatings having improved scratch resistance, coated substrates and methods related thereto |
| 10/17/2002 | WO2002081540A1 Epoxy resin composition, process for producing fiber -reinforced composite materials and fiber-reinforced composite materials |
| 10/17/2002 | WO2002057333A3 Epoxy resin composition for semiconductor encapsulation |
| 10/17/2002 | US20020151632 For use in seaming components useful in electrostatographic, contact electrostatic, digital and other machines |
| 10/17/2002 | US20020151627 Adhesive and electric device |
| 10/16/2002 | EP1249469A1 Conductive carbon filled polyvinyl buyral adhesive |
| 10/16/2002 | CN1374344A Polyester imide modified epoxy resin |
| 10/16/2002 | CN1374292A Synthesis of anacardian amine as epoxy resin curing agent |
| 10/16/2002 | CN1092690C Heat resistant resin composition and adhesive sheet using the same composition |
| 10/16/2002 | CN1092680C Epoxy resin composition and optical information recording medium using with the same composition |
| 10/16/2002 | CN1092674C Epoxy propenoic acid resin and its use |
| 10/15/2002 | US6465605 Antifoam agent |
| 10/15/2002 | US6465550 Silicone composition and electrically conductive, cured silicone product |
| 10/15/2002 | US6465541 Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same |
| 10/15/2002 | US6465537 Photocurable composition, method for production of photocurable composition, photocurable pressure-sensitive adhesive and method for production of photocurable pressure—sensitive adhesive sheet |
| 10/15/2002 | US6465100 Densification of composite preforms by liquid resin infiltration assisted by rigid-barrier actinic gelation |
| 10/15/2002 | US6463871 Wood replacement system and method |
| 10/10/2002 | WO2002079325A1 Polymerizable compositions |
| 10/10/2002 | US20020147368 Branched reaction products of alcohols and aldehydes |
| 10/10/2002 | US20020147283 Process for preparing toughened thermosetting structural materials |
| 10/10/2002 | US20020147277 Thermosetting resin composition and use thereof |
| 10/10/2002 | US20020147264 Embedding resin |
| 10/10/2002 | US20020146565 Curability, moldability and mass productivity, reliability |
| 10/09/2002 | EP0932477B1 Coated abrasive article and method of making same |
| 10/09/2002 | CN1373790A Crosslinkable compositions of functionalised polyolefine powder |
| 10/09/2002 | CN1373480A Conductive and resistance material with electrical stability for electronic apparatus |
| 10/09/2002 | CN1373394A Photosensitive thermosetting composition |
| 10/09/2002 | CN1373170A Adhesive and electrical device |
| 10/09/2002 | CN1373154A Composite dielectric material with two pressing-in temp segments |
| 10/08/2002 | WO2001094492A1 Impact-resistant epoxy resin compositions |
| 10/08/2002 | US6462147 Epoxy resin compositions for printed circuit board and printed circuit board using the same |
| 10/08/2002 | US6462108 High Tg potting compound |
| 10/08/2002 | US6462107 Photoimageable compositions and films for printed wiring board manufacture |
| 10/08/2002 | US6461691 Curable sealant composition |
| 10/08/2002 | CA2405584A1 Impact-resistant epoxy resin compositions |
| 10/03/2002 | WO2002077059A1 Method for the production of reinforcing or laminating materials treated with resin |
| 10/03/2002 | WO2002077058A1 Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same, and cured article obtained therefrom |
| 10/03/2002 | WO2002057361A3 Curing agent for epoxy resins and epoxy resin composition |
| 10/03/2002 | US20020143091 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony |
| 10/03/2002 | US20020142933 Polyester-based substrate; and a poly-epoxyamine charge modifier chemically bound to said polyester-based substrate by way of reactivity through one or more of its epoxy group(s). |
| 10/02/2002 | EP1246280A2 Electrode-forming compositions and electrode members |
| 10/02/2002 | EP1244747A1 Storage stable, foamable, single latex/epoxy emulsion |
| 10/02/2002 | EP1002019B1 Curable compositions based on functional polysiloxanes |
| 10/01/2002 | US6459358 Cured reaction product of: diglycidyl ether of an alkylene glycol oligomer, optionally with other epoxide monomers; conductive filler, and curing agent; improved flexibility for use in a current limiting ptc polymer device |
| 10/01/2002 | US6458622 Stress compensation composition and semiconductor component formed using the stress compensation composition |
| 10/01/2002 | US6458472 Fluxing underfill compositions |
| 10/01/2002 | US6458439 Heating thermoplastic resins comprising polyesters and epoxy resins; weatherproofing, corrosion resistance; metal cans and containers |
| 10/01/2002 | CA2115527C Urethane modified epoxy resin compositions |
| 09/26/2002 | WO2002075748A1 Polymer electrolyte gel and method for preparation thereof |
| 09/26/2002 | US20020137829 Solid surface materials prepared from extrudable acrylic composites |
| 09/26/2002 | US20020137659 Low-foaming surfactants and/or antifoaming agents based on a monomodified butylene oxide-ethylene oxide-propylene oxide terpolymer of various molecular weights; aqueous/nonaqueous liquids; latex paints;inks; adhesives; metal working |
| 09/26/2002 | DE10113940A1 Preparing resin-treated reinforcing or coating materials, e.g. for making electrical laminates, using binder mixture comprising epoxy and ethylenically unsaturated groups, glycidal (meth)acrylate and a hardening catalyst |
| 09/25/2002 | EP1243629A1 Active energy beam curable composition and ink |
| 09/25/2002 | EP1242525A1 Blister-resistant molded polyurea polymer and method of making a blister-resistant molded polyurea polymer |
| 09/25/2002 | CN1370802A Resin composition and its use and production process thereof |
| 09/19/2002 | WO2002072725A1 Adhesives and adhesive compositions containing thioether groups |
| 09/19/2002 | WO2002072698A1 Binding agent mixture and the use thereof |
| 09/19/2002 | WO2002055620A3 Powdered thermosetting composition for coatings |
| 09/19/2002 | WO2002042391A3 Extrusion freeform fabrication of soybean oil-based composites by direct deposition |
| 09/19/2002 | US20020132932 Polyetherimide resin/polyester resin blends having improved visual clarity |
| 09/19/2002 | US20020132123 Thermosetting anti-reflective coatings for full-fill dual damascene process |
| 09/19/2002 | DE10112620A1 Bindemittelmischungen und ihre Verwendung Binder mixtures and their use |
| 09/18/2002 | EP1241238A2 Bonding body and method of producing the same |
| 09/18/2002 | EP1241225A2 Resins acting as wet strength agents and creping aids and processes for preparing and using the same |
| 09/18/2002 | EP1240262A1 Powder coating compositions |
| 09/18/2002 | CN1369521A Heat setting resin compsns. and its use |
| 09/17/2002 | US6451932 Resin composites and method for producing the same |
| 09/17/2002 | US6451879 Phenolic resin, epoxy resin, and processes for producing these |
| 09/17/2002 | US6451418 Heat conductive resin substrate and semiconductor package |
| 09/17/2002 | CA2049116C Toughened epoxy matrix with improved damage tolerance and temperature performance |
| 09/17/2002 | CA2041909C Process for the preparation of amines, the amines thus obtained and the use thereof as hardeners for the epoxide resins |
| 09/12/2002 | WO2002070582A1 Highly functional polymers |
| 09/12/2002 | WO2002070191A1 Fluxing underfill compositions |
| 09/12/2002 | US20020128397 Phenolic resins modified with phosphorus oxychloride (POCl3) of given formula; flame retardant properties and high heat resistance so as not to require additional flame retardants; use as electronic packaging material |
| 09/12/2002 | US20020128354 The addition of polybenzoxazines as a co-reactant with one or several epoxy resins provides a product with reduced moisture adsorption while maintaining a high glass transition temperature; encapsulation of microchips |
| 09/12/2002 | US20020128353 Epoxy resin; acidic fluxing agent; anhydride; latent curing agent component comprising a complex of a portion of the acidic fluxing agent and a salt of a nitrogen-containing component. |
| 09/12/2002 | US20020127407 Photocurable form-in-place gasket for electronic applications |
| 09/12/2002 | US20020127406 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
| 09/12/2002 | DE10110837A1 Bonding aluminum surfaces with aluminum or other types of substrate with the aid of epoxy adhesives involves precoating at least one of the joint surfaces with a polyacrylate coupling agent |
| 09/12/2002 | CA2401739A1 Fluxing underfill compositions |
| 09/11/2002 | EP1239340A2 Roll |
| 09/11/2002 | EP1238995A1 High functional polymers |
| 09/11/2002 | EP1238904A2 Wood replacement system and method |