Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
04/2003
04/22/2003US6552133 Copolymerization or redistribution of o-hydroxyaromatic substituted aliphatic carboxylic acids into polyphenylene ethers; thermoplastic engineering resins with excellent hydrolytic stability, dimensional stability and toughness
04/22/2003US6551714 Flame-retardant resin composition, and prepregs and laminates using such composition
04/22/2003US6551711 Metal-polymer composite comprises metal and substrate layer disposed on the metal, substrate layer formed from curable thermosetting resin system comprising a curing agent and 0.1 to 100 weight percent episulfide
04/22/2003US6551662 Polyester with average molecular weight of 10,000-50,000, and a modifying epoxy resin with an epoxy equivalent weight of 500-15,000
04/22/2003CA2219483C Material comprising a polyamide, a polyether-polyamide block polymer and a functionalized polyolefin, film and object obtained from the said material
04/22/2003CA2112862C Electrodeposition coating composition comprising crosslinked microparticles
04/17/2003WO2003032090A1 Photosensitive resin composition
04/17/2003US20030073768 Polymer of epichlorhydrin and 2,2,4,4-tetramethyl-7-oxa-3,20-diaza-20-(2,3-epoxi-propyl)-dispiro -(5.1.11.2)-heneicosane-21-one and phenolic antioxidant
04/17/2003US20030071367 Epoxy resin compositions, solid state devices encapsulated therewith and method
04/17/2003US20030071366 For encapsulating a solid state device, such as a light emitting diode
04/16/2003EP1302517A2 Powder coating composition, method for the curing thereof, and articles derived therefrom
04/16/2003EP1302499A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink
04/16/2003EP1302495A1 Epoxy resin composition and fiber-reinforced composite material formed with the epoxy resin composition
04/16/2003EP1302492A1 Multi-component local foaming system and its use
04/16/2003EP1268189A4 Flame retardant optical films
04/16/2003CN1410483A Polyiner/laminate inorganic nano composite material and its milling shearing preparation method
04/16/2003CN1105749C Conductive epoxy resin compositions and application thereof
04/15/2003US6548608 Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic
04/15/2003US6548576 Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
04/15/2003US6548575 High temperature underfilling material with low exotherm during use
04/15/2003US6548175 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof
04/15/2003CA2043337C Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation
04/10/2003WO2003029323A1 Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition
04/10/2003WO2003029258A1 Oligomeric, hydroxy-terminated phosphonates
04/10/2003WO2003028644A2 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes
04/10/2003WO2002053531A3 Methyl propyl ketone peroxide formulations and their use for curing unsaturated polyesters
04/10/2003US20030069384 Preparation of polyindanebisphenols and polymers derived therefrom
04/10/2003US20030069357 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured product obtained therefrom
04/10/2003US20030069356 Comprising an organophosphorus compound, a trifunctional epoxy resin and a bifunctional epoxy resin; curing; semiconductor coatings; electronic and electrical apparatus prepregs
04/10/2003US20030069349 Liquid epoxy resin composition and semiconductor device
04/10/2003US20030069335 Structural hot melt material and methods
04/10/2003US20030069334 Thermoplastic dispersion and a stabilizer including the reaction product of an epoxy resin and an multifunctional acid(having 2 or more carboxyl group), wherein the stabilizer has at least two oxirane functional groups/molecule
04/10/2003US20030068542 Bipolar plate for fuel cell, method for manufacturing the bipolar plate, and fuel cell using the bipolar plate
04/10/2003US20030068498 An aqueous blends comprising one dispersed epoxy resin, one dispersed acrylic resin and curing agent as protective coatings for metallic substrate; nongloss, corrosion resistance, and uniform appearance
04/10/2003US20030068491 Pressure-sensitive adhesive for pressure-sensitive adhesive layer in volume hologram laminate
04/09/2003EP1300444A1 Epoxy resin composition and cured object obtained therefrom
04/09/2003EP1300438A1 Stabilizer system for polymer components of displays
04/09/2003EP1300409A1 Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets
04/09/2003EP1274770A4 High strength polymers and aerospace sealants therefrom
04/09/2003CN1409743A Polymer blends containing modified polyesters
04/09/2003CN1409742A Storage stable, foamable, single latex/epoxy emulsion
04/09/2003CN1409426A Bipolar plate for fuel battery, its producing method and fuel battery
04/09/2003CN1408765A Resin composition for insulation and laminated body using said composition
04/09/2003CN1408764A Light solidified and heat solidified resin composition and method for producing printed circuit board
04/09/2003CN1408749A Stabilizer system for display polymer assembly
04/09/2003CN1105149C Heat resistant polymer composition, alignment layer formed using same and liquid crystal display having alignment layer
04/09/2003CN1105144C Resin composition for preparing adhesive film
04/08/2003US6544652 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film
04/08/2003CA2184318C Composite material, method for producing the same and composite material for lateral rigid member for track belt
04/08/2003CA2043970C Treating an underground formation
04/03/2003WO2003027164A1 Curable resin composition
04/03/2003WO2003026888A1 Autodeposition compositions
04/03/2003US20030065095 Comprising a bisphenol type epoxy resin, a phenol novolak type epoxy resin, and an aromatic amine curing agent; a cured product displays a breaking elongation of at least 5%; low viscosity, high stength, heat resistance; aircraft components
04/03/2003US20030064185 Coating compositions having epoxy functional stabilizer
04/03/2003CA2461735A1 Autodeposition compositions
04/03/2003CA2461012A1 Curable resin composition
04/02/2003EP1298748A2 Bipolar plate for fuel cell, method for manufacturing the bipolar plate, and fuel cell using the bipolar plate
04/02/2003EP1298155A1 Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board
04/02/2003EP1192199A4 Phenol-novolacs with improved optical properties
04/02/2003EP1030885B1 Water compatible curing agents for epoxy resins
04/02/2003EP0745640B1 Prepreg and fiber-reinforced composite material
04/02/2003CN1407016A Polymer sol-electrolyte and lithium cell therewith
04/01/2003US6541553 Formulation for strippable adhesive and coating films and high performance adhesive
04/01/2003US6541544 Curing agent reactable with an acid or anhydride (especially containing glycidyl groups); acid or anhydride group containing addition polymer; carboxylic acid functional polyester; provides textured finish without texturing agents.
04/01/2003US6541541 Epoxy resin or polyepoxy compound based on glycidol and a bisphenol compound; use as sizing agent for glass fibers; fiber-reinforced resins resistant to thermal coloring and excellent in physical properties
04/01/2003US6541119 Film-forming compositions having improved scratch resistance
04/01/2003US6540942 Nonaqueous compositions and additives therefor
04/01/2003CA2109630C Polyacetal resin composition
03/2003
03/27/2003WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes
03/27/2003WO2003025080A1 Die attach adhesives for semiconductor applications, processes for producing semiconductor devices and semiconductor devices produced by such processes
03/27/2003WO2003024985A2 Epoxy resin and polyglycoside based polymers and process for the preparation thereof
03/27/2003US20030059681 Polymeric sol electrolyte and lithium battery using the same
03/27/2003US20030057594 Method of making a sheet of building material
03/27/2003US20030057538 Die attach adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes
03/26/2003EP1295899A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink
03/26/2003EP1295857A1 Aqueous resin composition
03/26/2003EP1294807A1 Thickenable vinyl ester resin compositions
03/26/2003CN1405231A Modified laminated clay and epoxy resin/clay nano composite material comprising said clay
03/26/2003CN1103791C Polymer material, process for its production and use thereof
03/26/2003CA2404841A1 Biopolar plate for fuel cell, method for manufacturing the bipolar plate, and fuel cell using the bipolar plate
03/25/2003US6538093 Polyimide silicone resin, process for its production, and polyimide silicone resin composition
03/25/2003US6538052 Curable compositions of glycidyl compounds, aminic hardeners and novel low viscosity curing accelerators
03/25/2003US6537729 Solid imaging compositions for preparing polyethylene-like articles
03/20/2003WO2003022957A1 Stabilized coating compositions
03/20/2003WO2003022953A1 Structural hot melt material and methods
03/20/2003WO2003022952A1 Adhesive for gas barrier laminates and laminated films
03/20/2003WO2003022944A1 Coating compositions having epoxy functional stabilizer
03/20/2003WO2003022929A1 Flame-retardant heat-resistant resin composition and adhesive film comprising the same
03/20/2003WO2003022925A1 Flame-retardant polyethylene terephthalate resin composition
03/20/2003WO2003022904A1 Network polymers comprising epoxy-terminated esters
03/20/2003US20030054162 Adhesive for joining surface of semiconductor
03/20/2003US20030054146 Epoxy resin composition and laminate using the same
03/20/2003CA2460312A1 Network polymers comprising epoxy-terminated esters
03/20/2003CA2459054A1 Coating compositions having epoxy functional stabilizer
03/20/2003CA2458335A1 Stabilized coating compositions
03/20/2003CA2427866A1 Structural hot melt material and methods
03/19/2003EP1293590A1 Water-based treating agent for metal surface
03/19/2003EP1293536A1 Sealing material for plastic liquid crystal display cells
03/19/2003EP1292439A2 Process of injection molding highly conductive resin compositions and apparatus for that
03/19/2003EP1102804B1 Composite materials on the basis of renewable resources