Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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04/22/2003 | US6552133 Copolymerization or redistribution of o-hydroxyaromatic substituted aliphatic carboxylic acids into polyphenylene ethers; thermoplastic engineering resins with excellent hydrolytic stability, dimensional stability and toughness |
04/22/2003 | US6551714 Flame-retardant resin composition, and prepregs and laminates using such composition |
04/22/2003 | US6551711 Metal-polymer composite comprises metal and substrate layer disposed on the metal, substrate layer formed from curable thermosetting resin system comprising a curing agent and 0.1 to 100 weight percent episulfide |
04/22/2003 | US6551662 Polyester with average molecular weight of 10,000-50,000, and a modifying epoxy resin with an epoxy equivalent weight of 500-15,000 |
04/22/2003 | CA2219483C Material comprising a polyamide, a polyether-polyamide block polymer and a functionalized polyolefin, film and object obtained from the said material |
04/22/2003 | CA2112862C Electrodeposition coating composition comprising crosslinked microparticles |
04/17/2003 | WO2003032090A1 Photosensitive resin composition |
04/17/2003 | US20030073768 Polymer of epichlorhydrin and 2,2,4,4-tetramethyl-7-oxa-3,20-diaza-20-(2,3-epoxi-propyl)-dispiro -(5.1.11.2)-heneicosane-21-one and phenolic antioxidant |
04/17/2003 | US20030071367 Epoxy resin compositions, solid state devices encapsulated therewith and method |
04/17/2003 | US20030071366 For encapsulating a solid state device, such as a light emitting diode |
04/16/2003 | EP1302517A2 Powder coating composition, method for the curing thereof, and articles derived therefrom |
04/16/2003 | EP1302499A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink |
04/16/2003 | EP1302495A1 Epoxy resin composition and fiber-reinforced composite material formed with the epoxy resin composition |
04/16/2003 | EP1302492A1 Multi-component local foaming system and its use |
04/16/2003 | EP1268189A4 Flame retardant optical films |
04/16/2003 | CN1410483A Polyiner/laminate inorganic nano composite material and its milling shearing preparation method |
04/16/2003 | CN1105749C Conductive epoxy resin compositions and application thereof |
04/15/2003 | US6548608 Polyetherimide and/or polysulphone, aromatic polyamine-modified epoxy resin and thermoplastic |
04/15/2003 | US6548576 Epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components |
04/15/2003 | US6548575 High temperature underfilling material with low exotherm during use |
04/15/2003 | US6548175 Epoxy-siloxanes based electrically conductive adhesives for semiconductor assembly and process for use thereof |
04/15/2003 | CA2043337C Spherical curing agent for epoxy resin, curing agent masterbatch for epoxy resin and their preparation |
04/10/2003 | WO2003029323A1 Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition |
04/10/2003 | WO2003029258A1 Oligomeric, hydroxy-terminated phosphonates |
04/10/2003 | WO2003028644A2 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes |
04/10/2003 | WO2002053531A3 Methyl propyl ketone peroxide formulations and their use for curing unsaturated polyesters |
04/10/2003 | US20030069384 Preparation of polyindanebisphenols and polymers derived therefrom |
04/10/2003 | US20030069357 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured product obtained therefrom |
04/10/2003 | US20030069356 Comprising an organophosphorus compound, a trifunctional epoxy resin and a bifunctional epoxy resin; curing; semiconductor coatings; electronic and electrical apparatus prepregs |
04/10/2003 | US20030069349 Liquid epoxy resin composition and semiconductor device |
04/10/2003 | US20030069335 Structural hot melt material and methods |
04/10/2003 | US20030069334 Thermoplastic dispersion and a stabilizer including the reaction product of an epoxy resin and an multifunctional acid(having 2 or more carboxyl group), wherein the stabilizer has at least two oxirane functional groups/molecule |
04/10/2003 | US20030068542 Bipolar plate for fuel cell, method for manufacturing the bipolar plate, and fuel cell using the bipolar plate |
04/10/2003 | US20030068498 An aqueous blends comprising one dispersed epoxy resin, one dispersed acrylic resin and curing agent as protective coatings for metallic substrate; nongloss, corrosion resistance, and uniform appearance |
04/10/2003 | US20030068491 Pressure-sensitive adhesive for pressure-sensitive adhesive layer in volume hologram laminate |
04/09/2003 | EP1300444A1 Epoxy resin composition and cured object obtained therefrom |
04/09/2003 | EP1300438A1 Stabilizer system for polymer components of displays |
04/09/2003 | EP1300409A1 Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets |
04/09/2003 | EP1274770A4 High strength polymers and aerospace sealants therefrom |
04/09/2003 | CN1409743A Polymer blends containing modified polyesters |
04/09/2003 | CN1409742A Storage stable, foamable, single latex/epoxy emulsion |
04/09/2003 | CN1409426A Bipolar plate for fuel battery, its producing method and fuel battery |
04/09/2003 | CN1408765A Resin composition for insulation and laminated body using said composition |
04/09/2003 | CN1408764A Light solidified and heat solidified resin composition and method for producing printed circuit board |
04/09/2003 | CN1408749A Stabilizer system for display polymer assembly |
04/09/2003 | CN1105149C Heat resistant polymer composition, alignment layer formed using same and liquid crystal display having alignment layer |
04/09/2003 | CN1105144C Resin composition for preparing adhesive film |
04/08/2003 | US6544652 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film |
04/08/2003 | CA2184318C Composite material, method for producing the same and composite material for lateral rigid member for track belt |
04/08/2003 | CA2043970C Treating an underground formation |
04/03/2003 | WO2003027164A1 Curable resin composition |
04/03/2003 | WO2003026888A1 Autodeposition compositions |
04/03/2003 | US20030065095 Comprising a bisphenol type epoxy resin, a phenol novolak type epoxy resin, and an aromatic amine curing agent; a cured product displays a breaking elongation of at least 5%; low viscosity, high stength, heat resistance; aircraft components |
04/03/2003 | US20030064185 Coating compositions having epoxy functional stabilizer |
04/03/2003 | CA2461735A1 Autodeposition compositions |
04/03/2003 | CA2461012A1 Curable resin composition |
04/02/2003 | EP1298748A2 Bipolar plate for fuel cell, method for manufacturing the bipolar plate, and fuel cell using the bipolar plate |
04/02/2003 | EP1298155A1 Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board |
04/02/2003 | EP1192199A4 Phenol-novolacs with improved optical properties |
04/02/2003 | EP1030885B1 Water compatible curing agents for epoxy resins |
04/02/2003 | EP0745640B1 Prepreg and fiber-reinforced composite material |
04/02/2003 | CN1407016A Polymer sol-electrolyte and lithium cell therewith |
04/01/2003 | US6541553 Formulation for strippable adhesive and coating films and high performance adhesive |
04/01/2003 | US6541544 Curing agent reactable with an acid or anhydride (especially containing glycidyl groups); acid or anhydride group containing addition polymer; carboxylic acid functional polyester; provides textured finish without texturing agents. |
04/01/2003 | US6541541 Epoxy resin or polyepoxy compound based on glycidol and a bisphenol compound; use as sizing agent for glass fibers; fiber-reinforced resins resistant to thermal coloring and excellent in physical properties |
04/01/2003 | US6541119 Film-forming compositions having improved scratch resistance |
04/01/2003 | US6540942 Nonaqueous compositions and additives therefor |
04/01/2003 | CA2109630C Polyacetal resin composition |
03/27/2003 | WO2003025081A1 Die attached adhesives for semiconductor devices, an efficient process for producing such devices and the devices per se produced by the efficient processes |
03/27/2003 | WO2003025080A1 Die attach adhesives for semiconductor applications, processes for producing semiconductor devices and semiconductor devices produced by such processes |
03/27/2003 | WO2003024985A2 Epoxy resin and polyglycoside based polymers and process for the preparation thereof |
03/27/2003 | US20030059681 Polymeric sol electrolyte and lithium battery using the same |
03/27/2003 | US20030057594 Method of making a sheet of building material |
03/27/2003 | US20030057538 Die attach adhesives for semiconductor applications efficient processes for producing such devices and the devices per se produced by the efficient processes |
03/26/2003 | EP1295899A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink |
03/26/2003 | EP1295857A1 Aqueous resin composition |
03/26/2003 | EP1294807A1 Thickenable vinyl ester resin compositions |
03/26/2003 | CN1405231A Modified laminated clay and epoxy resin/clay nano composite material comprising said clay |
03/26/2003 | CN1103791C Polymer material, process for its production and use thereof |
03/26/2003 | CA2404841A1 Biopolar plate for fuel cell, method for manufacturing the bipolar plate, and fuel cell using the bipolar plate |
03/25/2003 | US6538093 Polyimide silicone resin, process for its production, and polyimide silicone resin composition |
03/25/2003 | US6538052 Curable compositions of glycidyl compounds, aminic hardeners and novel low viscosity curing accelerators |
03/25/2003 | US6537729 Solid imaging compositions for preparing polyethylene-like articles |
03/20/2003 | WO2003022957A1 Stabilized coating compositions |
03/20/2003 | WO2003022953A1 Structural hot melt material and methods |
03/20/2003 | WO2003022952A1 Adhesive for gas barrier laminates and laminated films |
03/20/2003 | WO2003022944A1 Coating compositions having epoxy functional stabilizer |
03/20/2003 | WO2003022929A1 Flame-retardant heat-resistant resin composition and adhesive film comprising the same |
03/20/2003 | WO2003022925A1 Flame-retardant polyethylene terephthalate resin composition |
03/20/2003 | WO2003022904A1 Network polymers comprising epoxy-terminated esters |
03/20/2003 | US20030054162 Adhesive for joining surface of semiconductor |
03/20/2003 | US20030054146 Epoxy resin composition and laminate using the same |
03/20/2003 | CA2460312A1 Network polymers comprising epoxy-terminated esters |
03/20/2003 | CA2459054A1 Coating compositions having epoxy functional stabilizer |
03/20/2003 | CA2458335A1 Stabilized coating compositions |
03/20/2003 | CA2427866A1 Structural hot melt material and methods |
03/19/2003 | EP1293590A1 Water-based treating agent for metal surface |
03/19/2003 | EP1293536A1 Sealing material for plastic liquid crystal display cells |
03/19/2003 | EP1292439A2 Process of injection molding highly conductive resin compositions and apparatus for that |
03/19/2003 | EP1102804B1 Composite materials on the basis of renewable resources |