| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 12/27/2002 | WO2002102911A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| 12/27/2002 | WO2002070191A8 Fluxing underfill compositions |
| 12/26/2002 | US20020198311 Primer composition |
| 12/26/2002 | US20020197479 Cyanate ester-containing insulating composition, insulating film made therefrom and multilayer printed circuit board having the film |
| 12/24/2002 | US6498260 Polyepoxides; electronic packages |
| 12/24/2002 | US6498200 Cationically polymerizable resin composition |
| 12/24/2002 | CA2071012C Stabilization of mineral filled polyesters using epoxy compounds |
| 12/19/2002 | WO2002100951A1 Thermosetting resin composition |
| 12/19/2002 | WO2002061010A3 Method for adhering substrates using light activatable adhesive film |
| 12/19/2002 | US20020193552 Flame retardant resin material and flame retardant resin composition |
| 12/19/2002 | US20020193519 Comprises epoxy resin, polysiloxane and curing agent; moldability; catalytic polymerization; nondegrading; elasticity |
| 12/19/2002 | US20020193467 Conductive materials with electrical stability for use in electronics devices |
| 12/19/2002 | US20020192477 Silicone-modified epoxy or phenolic resin compositions and semiconductor devices sealed therewith |
| 12/18/2002 | EP1266936A1 Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition |
| 12/18/2002 | EP1265969A1 A method of bonding , a bonded structure and a use of xylan |
| 12/18/2002 | EP1003816B1 Aqueous dispersions of epoxy resins |
| 12/18/2002 | CN1386131A Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof |
| 12/18/2002 | CN1386128A Method of manufacturing a replica as well as a replica obtained by carrying out a UV light-initiated cationic polymerization |
| 12/17/2002 | US6495637 Water-compatible urethane-containing amine hardener |
| 12/17/2002 | US6495270 Addition product of a heterocyclic amidine and a quinone is accelerator; encapsulation of electronic component parts; rapid curability, curability after moisture absorption under moist condition, pot life and flow properties |
| 12/12/2002 | WO2002050184A3 Compositions for vibration damping |
| 12/12/2002 | US20020188033 Active energy beam curable composition and ink |
| 12/12/2002 | US20020187353 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same |
| 12/12/2002 | US20020187339 Bonding body and method of producing the same |
| 12/12/2002 | US20020187305 The heat generated by the exothermic reaction softens a thermoplastic shell of a blowing agent formulated within the epoxy component thereby enabling a solvent core within the shell to expand from the heat generated reaction. |
| 12/11/2002 | EP1265280A1 Resin component for encapsulating semiconductor and semiconductor device using it |
| 12/11/2002 | EP1264851A1 Resin composition, molding material, and molded object |
| 12/11/2002 | EP1263991A2 Epoxide polymer surfaces |
| 12/11/2002 | EP1263841A1 S-b-s compositions |
| 12/11/2002 | EP0832164B1 Non-aqueous solvent free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 12/11/2002 | CN1384975A Reworkable thermosetting resin composition |
| 12/11/2002 | CN1384144A Thermosetting epoxy resin composition and its formed body and multilayered printed circuit board |
| 12/11/2002 | CN1384143A Semiconductor packing epoxy resin composition and its making process and semiconductor device |
| 12/11/2002 | CN1384142A Polyvinylidene chloride composition and its prepn |
| 12/10/2002 | US6492478 Wherein the variables are as defined in the claims, to crosslinked polymers, to either homo-polymers or copolymers prepared from those novel prepolymers, to mouldings produced from the said homo- or co-polymers, and especially to contact |
| 12/10/2002 | US6492454 Rubber composition containing rubber, mercapto-triazine and epoxy grafter polymer |
| 12/10/2002 | US6492443 Norbornene polymer composition |
| 12/10/2002 | US6492438 Electrically connectable adhesive agent for semiconductor |
| 12/10/2002 | US6492092 Such as isobornylmethacrylate-p-hydroxyphenylmethacrylamide copolymer with 1,4-cyclohexanedimethanol diglycidyl ether crosslinker; insoluble to topcoat resist solvents, minimizes reflectivity, etch rate comparable to novolaks |
| 12/10/2002 | US6491845 Epoxy hardener of phenolic or 2° OH polyol and methylol polyol |
| 12/05/2002 | WO2002097002A1 Ultraviolet activatable adhesive film |
| 12/05/2002 | WO2002096987A1 Copper foil with resin and printed wiring boards made by using the same |
| 12/05/2002 | US20020183406 A polymeric film with sufficient elongation and strength consists of a vinyl acetate homo or copolymer or partially hydrolyzed vinyl acetate polymer and an aqueous solution of sap, fruit liquid, honey, and saccharide |
| 12/05/2002 | US20020182339 Irradiation crosslinking a mixture of an epoxy compound, polyol like a polyetherpolyol or a polyesterpolyol, and a photoinitiator and applying the exposed composition onto a substrate thereby forming a coating upon the substrate. |
| 12/05/2002 | US20020179241 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method |
| 12/04/2002 | CN1383436A Epoxy resin compsn. and laminate using same |
| 12/04/2002 | CN1382745A Thermoset resin compsns. and its mfg. method |
| 12/03/2002 | US6489405 Curable polyoxyalkylene amines used for encapsulation of electrical and electronic apparatus |
| 12/03/2002 | US6489380 Mixtures of fillers, heterocylic ethers, nitriles, lewis acid catalysts and/or brownsted acids having high flexibility and hermetic sealing, used in semiconductor applications |
| 12/03/2002 | US6489042 Covercoats to protect the circuitry |
| 12/03/2002 | US6489023 Sealant compositions and sealant articles using the same |
| 12/03/2002 | US6489013 Polyamideimide with siloxane bonds, high molecular weight acrylic polymer, thermoset resin and solvent; low thermal stress and modulus of elasticity; heat resistance |
| 12/03/2002 | CA2065181C Epoxy resin mixtures, in particular for the production of prepregs with a long shelf life |
| 11/28/2002 | US20020176985 Methods of bonding metal surfaces, and components therefor |
| 11/28/2002 | US20020176046 Sealing material for plastic liquid crystal display cells |
| 11/28/2002 | US20020175104 Methods of bonding metal surfaces, and components therefor |
| 11/27/2002 | EP1260551A1 Flame-retardant epoxy resin composition and laminate made with the same |
| 11/27/2002 | EP1260532A1 Latent curing agent for epoxy resin, and curable epoxy resin composition |
| 11/27/2002 | EP1259566A1 Thermosetting resin composition |
| 11/27/2002 | EP0862794B1 Sealing material with wavelength converting effect and its production process, process of fabricating a light emitting semiconductor device and light emitting semiconductor device |
| 11/26/2002 | WO2001092416A1 Conductive resin composition |
| 11/26/2002 | US6486297 High strength polymers and aerospace sealants therefrom |
| 11/26/2002 | US6486266 Thermosetting resin composition |
| 11/26/2002 | US6486256 Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst |
| 11/26/2002 | US6486242 Flame-retardant resin composition and prepreg and laminate using the same |
| 11/26/2002 | US6486235 Composition of epoxy resin, curing agent, phosphate of resorcinol, Al (OH) |
| 11/26/2002 | US6485833 Resin-coated metal foil |
| 11/26/2002 | US6485787 An epoxy component, and a polyfunctional amine component where the urethane acrylate reacts with the amine to form a secondary amine component which reacts with the epoxy to form a crosslinked polymer; quick curing traffic paint |
| 11/21/2002 | WO2002092659A1 Moulding composition for producing bipolar plates |
| 11/21/2002 | US20020170669 Especially bonding steel locating hinge washers to a hinge assembly to facilitate doors-off/door-on processing through an automotive trim shop. |
| 11/20/2002 | EP1257606A2 Powdered thermosetting composition for coatings |
| 11/19/2002 | US6482530 Comprising polyolefins having given melt flow rate and/or olefin polymers having at least one functional group capable of reacting with an epoxy group; and an epoxy compound such as epoxidized soybean oil having at least 2 epoxy groups |
| 11/19/2002 | CA2115144C Macromonomers having reactive side groups |
| 11/14/2002 | WO2002090616A1 Water-based treating agent for metal surface |
| 11/14/2002 | WO2002090450A1 Fluorine-containing resin coating compositions, primers for etfe coating, and coated articles |
| 11/14/2002 | WO2002090434A1 Epoxy resin composition and semiconductor device |
| 11/14/2002 | WO2002090427A1 Two-component (epoxy/amine) structural foam-in-place material |
| 11/14/2002 | US20020169259 Ketimine as latent curing agent; excellent storage stability |
| 11/14/2002 | US20020169253 Primer for plastic films |
| 11/14/2002 | US20020169226 Phenolic resins for use as permanent mask resist pattern; heat resistance, humidity-heat resistance, adhesibility, mechanical properties, and electrical properties |
| 11/14/2002 | US20020168480 Epoxy molding materials; blend of surface modified silica in epoxy resin |
| 11/14/2002 | US20020166495 Wood replacement system and method |
| 11/14/2002 | CA2439611A1 Two-component (epoxy/amine) structural foam-in-place material |
| 11/13/2002 | CN1379062A Fragrant furan resin and its preparing process |
| 11/13/2002 | CN1094135C Epoxy polysiloxane coating and flooring compositions |
| 11/12/2002 | US6479167 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith |
| 11/12/2002 | US6479151 Dispersion of a partially neutralized amino-functional epoxy derived polymer and a compound with at least two acetoacetate groups and/or acetoacetamide groups; coatings with hardness, gloss, water and solvent resistance; adhesive strength |
| 11/07/2002 | WO2002089152A1 Conductive materials with electrical stability for use in electronics devices |
| 11/07/2002 | WO2002088270A1 Adhesive and electric device |
| 11/06/2002 | EP1254940A1 Treating agent for imparting hydrophilicity and high corrosion resistance, hydrophilizing fluid, and method of hydrophilizing |
| 11/06/2002 | EP1254926A1 Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof |
| 11/06/2002 | EP1254193A1 Reactive particles, curable composition comprising the same and cured products |
| 11/06/2002 | EP1163280B1 Epoxy resin compositions having a long shelf life |
| 11/06/2002 | CN1093866C Use of silicon-modified epoxy resin as casting material for electrical working or electronic assembly |
| 11/05/2002 | US6476160 One-pack composition of epoxy resin(s) with no oh groups and ketimine |
| 11/05/2002 | US6476122 Selective deposition modeling material |
| 11/05/2002 | US6476100 Solid surface materials prepared from extrudable acrylic composites |
| 11/05/2002 | US6475629 Adhesive film formed of a siloxane-modified polyamideimide resin composition, adhesive sheet and semiconductor device |
| 11/05/2002 | US6475328 Printed circuits; containing cockroach repellent |
| 10/31/2002 | WO2002085975A1 Composition of acrylated urethane oligomer, epoxy resin and amine hardener |