| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 07/17/2002 | CN1359410A Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using the same |
| 07/17/2002 | CN1358798A High-temp. under mould-filling material with low heat generating in use |
| 07/17/2002 | CN1087752C 复合环氧树脂 Epoxy composite |
| 07/17/2002 | CN1087751C Epoxy resin composition |
| 07/16/2002 | US6420496 Basic catalyst for phenol aldehyde for curing |
| 07/16/2002 | US6420494 Epoxy compounds and organo siloxanes and silicates |
| 07/16/2002 | US6420459 Phosphinic salt or diphosphinic salt and polymer |
| 07/16/2002 | US6420450 Cationically hardening mass, the use thereof and process for preparing hardened polymer masses |
| 07/16/2002 | CA2150503C Pourable liquid rheological additives and the use thereof |
| 07/11/2002 | WO2002053531A2 Methyl propyl ketone peroxide formulations and their use for curing unsaturated polyesters |
| 07/11/2002 | US20020091179 Halogen-containing polymer composition stabilized by a latent mercaptan and a mixture of a zinc carboxylate and zinc chloride |
| 07/11/2002 | US20020089071 Liquid epoxy resin composition and semiconductor device |
| 07/10/2002 | EP1221724A2 Sealing material with wavelength converting effect, application and production process |
| 07/10/2002 | EP0960161B1 High-melting polyamide resin compositions and molded articles thereof |
| 07/10/2002 | CN1358205A Polyolefin compositions, method for the production and use thereof |
| 07/04/2002 | WO2002026887A3 Crosslinked polyamide |
| 07/04/2002 | WO2001083634A3 Formulation for strippable adhesive and coating films |
| 07/04/2002 | US20020086163 For use in liquid crystal display; dimension stability |
| 07/04/2002 | US20020086161 Radiation-curable compositions and cured articles |
| 07/03/2002 | EP1174467A9 Heat stable, corrosion inhibiting polyorganosiloxane resins |
| 07/02/2002 | CA2123610C A dispersion-based heat sealable coating |
| 06/27/2002 | WO2002050239A1 Branched alkoxide reaction products, and uses thereof |
| 06/27/2002 | WO2002050238A1 Reaction products of melamine and derivatives thereof |
| 06/27/2002 | WO2002050237A1 Reaction products of polycarboxylic acids and derivatives thereof |
| 06/27/2002 | WO2002050236A1 Branched reaction products of alcohols and aldehydes |
| 06/27/2002 | WO2002050235A1 Branched reaction products of amines and multifunctional compounds |
| 06/27/2002 | WO2002050222A1 Reaction products of alkoxylated compounds and polyepoxides |
| 06/27/2002 | WO2002050184A2 Compositions for vibration damping |
| 06/27/2002 | WO2002050156A2 Method for making biodegradable polyhydroxyalkanoate copolymers having improved crystallization properties |
| 06/27/2002 | WO2002050154A1 One-pack moisture-curable epoxy resin composition |
| 06/27/2002 | WO2002050153A1 Flame-retardant epoxy resin composition, and prepregs and fiber-reinforced composite materials made by using the composition |
| 06/27/2002 | WO2002050146A1 Polyaldehyde reaction products |
| 06/27/2002 | US20020082379 Novel epoxy hardeners for improved properties, processing and handling |
| 06/27/2002 | US20020082350 To produce laminates and printed wiring boards |
| 06/27/2002 | US20020082349 Resistance to heat and humidity, producing virtually no voluminal expansion even under the conditions of high temperature and high humidity |
| 06/27/2002 | US20020082322 For use in composite material, laminated plates, printed circuit boards, electronic products, electrical products |
| 06/27/2002 | US20020081434 Thermosetting resin composition composed mainly of a polycarbodiimide obtained from organic polyisocyanates |
| 06/27/2002 | CA2427509A1 Method for making biodegradable polyhydroxyalkanoate copolymers having improved crystallization properties |
| 06/26/2002 | EP0755415B1 Epoxidized low viscosity rubber toughening modifiers for epoxy resins |
| 06/25/2002 | US6410647 Clear coating; acid resistance; waterproofing |
| 06/25/2002 | US6410617 Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same |
| 06/25/2002 | US6410615 Semiconductor sealing epoxy resin composition and semiconductor device using the same |
| 06/25/2002 | US6410145 Thermosetting resin composition for build-up |
| 06/25/2002 | US6410127 Epoxy resin compositions, epoxy resin compositions for fiber-reinforced composite materials, and fiber-reinforced composite materials comprising the same |
| 06/20/2002 | WO2002048584A1 Form-in-place gasket for electronic applications |
| 06/20/2002 | WO2002048226A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 06/20/2002 | US20020076558 Epoxy resin compositions and premolded semiconductor packages |
| 06/20/2002 | US20020076539 Process for producing a multi-layer printer wiring board |
| 06/20/2002 | US20020076482 Viscosity modifier for thermosetting resin composition |
| 06/19/2002 | EP1215723A1 Process for producing epoxy resin composition for photosemiconductor element encapsulation |
| 06/19/2002 | EP1215718A2 Novel high temperature underfilling material with low exotherm during use |
| 06/19/2002 | EP0832145B1 Thermoplastic biodegradable polyester, a process for the preparation thereof and articles manufactured therefrom |
| 06/19/2002 | CN1354199A Polyester composition and connector |
| 06/19/2002 | CN1354198A Epoxy resin/montmorillonoid nano-compoiste-material and its preparation method |
| 06/19/2002 | CN1086399C Photogeneration of amine by using alpha-amino acetophenone |
| 06/18/2002 | US6407183 Liquid crystals; radiation transparent |
| 06/18/2002 | US6407146 Curable composition |
| 06/18/2002 | US6406782 Conformable, compressible tape |
| 06/18/2002 | CA2154074C Urethane modified epoxy resin compositions |
| 06/13/2002 | WO2002046840A1 Photocurable and thermosetting resin composition |
| 06/13/2002 | WO2002046264A1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 06/13/2002 | WO2002046255A1 Curable compositions comprising an epoxidised unsaturated polyester and mineral fillers |
| 06/13/2002 | WO2001096085A3 Process of injection molding highly conductive resin compositions and apparatus for that |
| 06/13/2002 | WO2001094467A3 Soft polymer composition including epoxy |
| 06/13/2002 | DE10060314A1 Epoxidverbindungen enthaltende Mischungen und ihre Verwendung Epoxide-containing compounds and their use |
| 06/13/2002 | CA2364933A1 Novel high temperature underfilling material with low exotherm during use |
| 06/12/2002 | EP1213612A2 Radiation curable resin composition, manufacturing process and article made using such a composition |
| 06/12/2002 | EP1213312A1 Compositions containing epoxy resins and use thereof |
| 06/12/2002 | EP1123203B1 Method for producing a stove-enameled molded component |
| 06/12/2002 | EP1082391B1 Thermosetting resinous binder compositions, their preparation and use as coating materials |
| 06/12/2002 | EP1073697B1 Epoxy/thermoplastic photocurable adhesive composition |
| 06/12/2002 | EP0761722B1 Organopolysiloxane derivative |
| 06/12/2002 | EP0726922B1 Metal-nitrogen polymer compositions comprising organic electrophiles |
| 06/12/2002 | CN1353637A Fiber reinforced epoxy resin product and method for manufacture thereof |
| 06/11/2002 | US6404068 (a) a thermoplastic resin, (b) an epoxy resin, (c) a coupling agent, (d) a powdery inorganic filler, (e) a powder having rubber elasticity and (f) an organic solvent; low water vapor permeability |
| 06/11/2002 | US6403684 Polyetherimide resin/polyester resin blends having improved visual clarity |
| 06/11/2002 | US6403670 Powder blend |
| 06/11/2002 | US6403669 Alveolar materials that contain at least one thermoplastic polymer, at least one modified epoxide resin and at least one pore-forming agent |
| 06/11/2002 | US6403222 Epoxy resin, microcrystalline or paraffin wax, curing agent, and hollow glass alkali or alkaline earth metal silicate microspheres; corrosion resistant protective coatings for automobiles |
| 06/11/2002 | US6403221 Epoxy resin containing phosphorus, phenolic curing agent, bisphenol s phenolic resin and accelerator; heat resistance; peeling strength |
| 06/11/2002 | US6403201 Substrate material for wiring and substrate material for printed circuit using the same |
| 06/06/2002 | WO2002044274A1 Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 06/06/2002 | WO2002044273A1 Filled epoxy resin system having high mechanical strength values |
| 06/06/2002 | WO2002044240A1 Hydroxyl-group-containing polyether amine adducts |
| 06/06/2002 | WO2002026888A3 Low temperature bonding adhesive composition |
| 06/06/2002 | WO2001067129A3 Epoxide polymer surfaces |
| 06/06/2002 | US20020068174 Cold-curing; epoxide compounds, reactive epoxide thinner, epoxy-amine addition product with terminal amino groups and xylene-formaldehyde resin; solvent-free; low irritant potential, faultless surface; coatings for bathroom |
| 06/06/2002 | CA2430074A1 Filled epoxy resin system having high mechanical strength values |
| 06/06/2002 | CA2429300A1 Hydroxyl-group-containing polyether amine adducts |
| 06/04/2002 | US6399714 Crosslinked polyamide |
| 06/04/2002 | US6399690 Layered compositions with multi-charged onium ions as exchange cations, and their application to prepare monomer, oligomer, and polymer intercalates and nanocomposites prepared with the layered compositions of the intercalates |
| 06/04/2002 | US6399677 Comprising an epoxy resin, a curing agent, and an inorganic filler in the form of porous silica having a specific surface area of 6 to 200 m2/g, a true specific gravity of 2.0 to 2.2, and a mean particle size of 2-50 micro m |
| 06/04/2002 | US6399199 Epoxy resin, curing agent and matrix resin |
| 06/04/2002 | CA2034968C Rubber modified epoxy resin compositions |
| 05/30/2002 | WO2002042548A2 Method and composition for cutting dry fabric |
| 05/30/2002 | WO2002042391A2 Extrusion freeform fabrication of soybean oil-based composites by direct deposition |
| 05/30/2002 | WO2002042349A2 Hardener for epoxy of polyols and n-containing hardener |
| 05/30/2002 | WO2002042235A2 Epoxy urethane string binder |
| 05/30/2002 | US20020065386 Glass transition temperature, low moisture absorption, adhesion |
| 05/30/2002 | US20020063239 Derivatives of cycloaliphatic diamines as cosolvents for aqueous hydrophobic amines |