| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 12/13/2001 | WO2001094467A2 Soft polymer composition including epoxy |
| 12/13/2001 | WO2000009581A3 Viscosity modifier for thermosetting resin composition |
| 12/13/2001 | US20010051260 Conformable, compressible tape |
| 12/13/2001 | US20010051227 Solvent-free uncured, flexible, protective coatings such as for metal cans; blend of two polyesters of given molecular weight and glass transition temperatures, and optionally a modifying resin, inorganic filler, flow control agent |
| 12/13/2001 | EP1144478A3 Viscosity modifier for thermosetting resin composition |
| 12/13/2001 | DE10027206A1 Alterungsstabile Epoxidharzsysteme, daraus hergestellte Formstoffe und Bauelemente und deren Verwendung Aging stable epoxy resin, produced therefrom mold materials and components and their use |
| 12/12/2001 | EP1162228A1 Epoxy resin composition for fiber-reinforced composite material, prepreg, and fiber-reinforced composite material |
| 12/12/2001 | EP1162225A1 Hardener for epoxy resin and epoxy resin composition |
| 12/12/2001 | EP1162224A2 Curable composition for tendon for prestressed concrete and tendon |
| 12/12/2001 | EP1161507A1 Soluble adhesives |
| 12/12/2001 | EP1159342A4 Storage-stable compositions useful for the production of structural foams |
| 12/12/2001 | EP1155053A4 Corrosion resistant structural foam |
| 12/11/2001 | US6329492 Useful as material for encapsulating electronic devices, for lamination or for adhesion; curing agent for epoxy resins |
| 12/11/2001 | US6329474 For printed wiring boards; heat resistance, hydrophobic; corrosion resistance, discoloration inhibition |
| 12/11/2001 | US6329473 Used as coating for crack bridging, as an adhesive and in powder surface coatings |
| 12/11/2001 | CA2028673C Thermoplastic resin composition |
| 12/06/2001 | WO2001092415A1 Thermoset materials with improved impact resistance |
| 12/06/2001 | WO2001092396A1 Epoxy-resin systems, which are resistant to ageing, moulding materials and components produced therefrom and the use thereof |
| 12/06/2001 | US20010049046 Highly conductive molding compounds for use as fuel cell plates and the resulting products |
| 12/06/2001 | US20010049009 Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof |
| 12/05/2001 | EP1159342A1 Storage-stable compositions useful for the production of structural foams |
| 12/05/2001 | EP0935628B1 Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent |
| 12/05/2001 | CN1075823C Low VOC laminating formulations |
| 12/04/2001 | US6326425 Mixture of synthetic resin and polysiloxane |
| 11/29/2001 | WO2001090243A1 Modified thermoplastic composition and method of production of same |
| 11/29/2001 | US20010047058 A tape comprises a conformable, compressible, melt flow-resistant foam core layer having first and second surfaces, a thermosetting sealant layer on first surface of core, sealant layer having a surface for contacting substrate |
| 11/29/2001 | US20010045647 Method of producing a wavelength-converting casting composition |
| 11/28/2001 | EP1158017A2 Coated molding of thermoplastic resin composition and production method therefor |
| 11/28/2001 | EP1157075A1 Sealant compositions and sealant articles using the same |
| 11/28/2001 | CN1324384A Epoxy resins and stable aqueous dispersions thereof |
| 11/28/2001 | CN1324123A 锂电池 Lithium Battery |
| 11/28/2001 | CN1324091A Composite material used for mfg. isolation sheet of thin layer display panel |
| 11/27/2001 | US6322892 Cation-polymerizable coating composition |
| 11/27/2001 | US6322848 Flexible epoxy encapsulating material |
| 11/26/2001 | CA2348820A1 Modified thermoplastic composition and method of production of same |
| 11/26/2001 | CA2309508A1 Modification of polyethylene terephthalate (pet) |
| 11/22/2001 | WO2001088034A1 Thermosetting composition |
| 11/22/2001 | WO2001088033A1 Sound deadening and structural reinforcement compositions and methods of using the same |
| 11/22/2001 | US20010044518 Dust-free, epoxy-containing stabilizer granules and the preparation process |
| 11/22/2001 | CA2409750A1 Sound deadening and structural reinforcement compositions and methods of using the same |
| 11/21/2001 | EP1155084A1 Sound deadening and structural reinforcement compositions and methods of using the same |
| 11/21/2001 | EP1155074A1 Polyetherimide resin/polyester resin blends having improved properties |
| 11/21/2001 | EP1155053A1 Corrosion resistant structural foam |
| 11/21/2001 | CN1075044C Glass fibre size composition, method using the same composition and resulted products |
| 11/20/2001 | US6320013 Heating: a heavy oil or pitch of given average molecular weight; formaldehyde or a formaldehyde precursor; and an allylphenol with stirring in the presence of an acid catalyst |
| 11/20/2001 | US6319652 To form cured resin having dimensional stability, humidity absorption, chemical resistance; for stereolithography |
| 11/20/2001 | US6319619 Semiconductor sealing resin composition, semiconductor device sealed with the same, and process for preparing semiconductor device |
| 11/20/2001 | US6319603 Poly(meth)acrylate polymer with epoxy groups, ring opening polymerization monomer with glycidyl groups, cationic initiators and free radical photoinitiators |
| 11/20/2001 | US6319557 Coating composition and method for application thereof |
| 11/15/2001 | WO2001085842A1 Noncrystalline cyclic polyolefin/epoxidized diene block copolymer composition and sheet thereof |
| 11/14/2001 | EP1153986A1 Molded resin and process for producing the same |
| 11/14/2001 | EP1153984A1 Resin composition, molded article therefrom, and utilization thereof |
| 11/14/2001 | EP1153980A1 Epoxy resin composition |
| 11/14/2001 | EP1153972A1 Rubber composition |
| 11/14/2001 | EP1153952A1 Sealing agent for liquid-crystal display cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element |
| 11/14/2001 | EP1153941A1 Polymer and epoxy resin compositions |
| 11/14/2001 | EP1153057A1 Self-dispersible hardenable epoxide resins |
| 11/14/2001 | CN1322223A 橡胶组合物 The rubber composition |
| 11/14/2001 | CN1321706A Production method of high wear-resisting solid surfacing material |
| 11/14/2001 | CN1321697A Epoxy resin/microparticle composite solidified microsphere water base system and its preparation method |
| 11/14/2001 | CN1321694A Epoxy resin solidified microsphere water-base system and its preparation method |
| 11/14/2001 | CN1074773C Aqueous dispersion and composition prepared therefrom |
| 11/13/2001 | USRE37448 Free from epoxy groups; reaction product of an epoxide and a carboxyl- and ester-group-containing compound formed from 1) dicarboxylic acid and 2)(meth)acrylated polyol containing ethylene oxide groups |
| 11/13/2001 | US6316583 Fluorescence, ultraviolet radiation absorbance and solubility in organic solvents, can be epoxidized to form epoxy products whicha are used in manufacture of laminates, coatings, and adhesives |
| 11/13/2001 | US6316572 Curable composition for coatings, coated articles and resin composition for coatings |
| 11/08/2001 | WO2001083634A2 Formulation for strippable adhesive and coating films |
| 11/08/2001 | WO2001083629A1 Method of bonding adherend |
| 11/08/2001 | WO2001083607A1 Rheology-controlled epoxy-based compositions |
| 11/08/2001 | WO2001083604A1 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom |
| 11/08/2001 | US20010039324 Film-forming compositions having improved scratch resistance |
| 11/08/2001 | US20010039300 Photo-curable resin composition, process for producing the same and products using the same |
| 11/07/2001 | EP1151053A1 Adhesive powder |
| 11/07/2001 | EP1151025A1 Epoxy resin system |
| 11/07/2001 | EP1115768A4 Epoxy curing agent of phenol-aldehyde reacted with polyamine |
| 11/07/2001 | EP1084185A4 Conductive sheet molding compound |
| 11/07/2001 | CN1321179A Epoxy resin composition and semiconductor device |
| 11/07/2001 | CN1321176A Radiopaque cationically polymerizable compositions comprising radiopacifying filler, and method for polymerizing same |
| 11/06/2001 | US6313208 Heat stability during molding |
| 11/06/2001 | US6312829 Epoxy resin and resin-sealed type semiconductor apparatus |
| 11/06/2001 | US6312801 Adhesive tape for electronic parts |
| 11/01/2001 | WO2001081494A2 Non-aqueous solvent-free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 11/01/2001 | WO2001081468A1 Coherent insert |
| 11/01/2001 | WO2001023474A3 Polymer blends containing modified polyesters |
| 11/01/2001 | US20010037009 Top coat of the composite coating composition comprising an ungelled organic polysiloxane containing reactive group selected from hydroxy, carbamate, epoxy, isocyante, carboxyl; a reactive functional group containing curing agent |
| 11/01/2001 | US20010037003 Latent catalyst, thermosetting resin composition comprising the catalyst, epoxy resin molding material comprising the catalyst, and semiconductor device |
| 11/01/2001 | US20010035588 Epoxy resin composition, semiconductor device, and method of judging visibility of laser mark |
| 11/01/2001 | US20010035111 Curable two-component mortar composition and its use |
| 10/31/2001 | EP1149864A1 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom |
| 10/31/2001 | EP1149130A1 Acrylic terpolymer for the use as a self-fixturing adhesive |
| 10/31/2001 | CN1320146A Photocurable resin composition for sealing material and method of sealing |
| 10/31/2001 | CN1320132A Phenolic resin, epoxy resin, and processes for producing these |
| 10/31/2001 | CN1319737A Nanometer high-property resin composite material pipeline and making method thereof |
| 10/31/2001 | CN1319699A Technology for making high-density epoxy resin scraper |
| 10/31/2001 | CN1074016C Flame-retarded thermosetting resin composition |
| 10/30/2001 | US6310119 Film-shaped encapsulating agent for electronic parts |
| 10/30/2001 | US6309527 Thermosetting resinous binder compositions, their preparation and use as coating materials |
| 10/30/2001 | US6309502 Curable alicyclic epoxy resin, styrene thermoplastic elastomer with epoxy group, ultraviolet-active cationic polymerization catalyst; and fluorenediol; heat resistance, waterproofing |
| 10/30/2001 | CA2057537C Heat resistant resin compositions, articles and method |
| 10/25/2001 | WO2001079374A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 10/25/2001 | US20010034430 Copolymerization or redistribution of o-hydroxyaromatic substituted aliphatic carboxylic acids into polyphenylene ethers; thermoplastic engineering resins with excellent hydrolytic stability, dimensional stability and toughness |