| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 01/29/2004 | WO2003035778A3 Thermally curable binding agents |
| 01/29/2004 | US20040019174 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition |
| 01/29/2004 | US20040019140 Comprises ketimine hardening compound such as N,N'-di(1-ethylpropylidene)-1,3-bisiminomethylcyclohexane; improved storage stability; for use as adhesive, putty material, paint, coating, and potting material |
| 01/29/2004 | US20040019134 Flame retarded epoxy resin composition |
| 01/29/2004 | US20040016908 Wavelength-converting casting composition and white light-emitting semiconductor component |
| 01/28/2004 | EP1383818A1 Method for the production of reinforcing or laminating materials treated with resin |
| 01/28/2004 | CN1470550A Solidifying promotor, epoxy resin composition and semiconductor device |
| 01/28/2004 | CN1136270C Adhesion agent, sealing glue and paint composition |
| 01/22/2004 | WO2004007616A1 Thermoplastic resin composition, process for producing the same, and molded object thereof |
| 01/22/2004 | WO2004007612A1 Novel coating compositions for high temperature pipes |
| 01/22/2004 | US20040014843 Liquid epoxy resin, a curing agent, and an inorganic filler is useful for semiconductor encapsulation when the curing agent contains 5- 100% by weight of a specific aromatic amine compound of at least 99% pure, the epoxy resin and the curing |
| 01/22/2004 | US20040014842 Die-attaching paste and semiconductor device |
| 01/22/2004 | US20040013833 Compatibilized polyester/polyamide blends |
| 01/21/2004 | CN1469891A Crosslinked polyamide |
| 01/21/2004 | CN1469890A Die-attaching paste and semiconductor device |
| 01/21/2004 | CN1468903A Epoxy resin material for intaglio roller |
| 01/21/2004 | CN1468902A Active organic-inorganic nano calcium carbonate mixture and its prepn process |
| 01/20/2004 | US6680123 Embedding resin |
| 01/20/2004 | US6680007 Suitable for use in electrical and mechanical connection of electronic parts as a substitute for the existing solder; adhesion, heat resistance, moisture resistance, flexibility and impact resistance |
| 01/15/2004 | US20040010092 By-product inhibition; melt processability; heat sensitive bodies |
| 01/15/2004 | US20040010073 Mixture of amorphous and crystalline polyestrer with nucleation agent |
| 01/15/2004 | US20040007769 Solvent-free thermosetting resin composition, process for producing the same, and product therefrom |
| 01/15/2004 | DE10323429A1 Verfahren zur Herstellung einer Prepreg-Harzzusammensetzung A process for preparing a prepreg resin composition |
| 01/14/2004 | CN1468270A One-pack moisture-curable epoxy resin composition |
| 01/14/2004 | CN1468153A Platable dielectric materials for microvia technology |
| 01/14/2004 | CN1467262A High temperature corrosion-resisting resin |
| 01/08/2004 | WO2004003066A1 Improved interface adhesive |
| 01/08/2004 | US20040006161 Ultraviolet curable resin composition and photo solder resist ink including the same |
| 01/08/2004 | US20040006150 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 01/08/2004 | US20040003889 Method for repairing loose molded-in bushings |
| 01/07/2004 | EP1378553A1 Method for re-bonding a dislodged part |
| 01/07/2004 | EP1377631A1 Solid polymethylmethacrylate surface material |
| 01/07/2004 | EP1377621A2 Silicone liquid crystals, vesicles, and gels |
| 01/07/2004 | EP1377451A2 Epoxy-functional polymeric microbeads |
| 01/07/2004 | CN1466774A Resin packaged semiconductor device and die bonding material and packaging material thereof |
| 01/07/2004 | CN1466611A Low temperature bonding adhesive composition |
| 01/07/2004 | CN1465607A Epoxy resin, epoxy resin composition and solidified epoxy resin and preparation method thereof |
| 01/06/2004 | US6674016 Electronic component |
| 01/06/2004 | US6673441 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/06/2004 | CA2234110C Photosensitive resin composition |
| 01/02/2004 | EP1375590A2 Laser-marking thermoplastic resin composition |
| 01/02/2004 | EP1375553A1 Curable resin, curable resin material, curable film, and insulator |
| 01/02/2004 | EP1373407A1 Binding agent mixture and the use thereof |
| 01/02/2004 | EP1373383A1 Two-component (epoxy/amine) structural foam-in-place material |
| 01/02/2004 | EP1373354A1 Highly functional polymers |
| 01/01/2004 | US20040000728 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
| 01/01/2004 | US20040000712 Interface adhesive |
| 12/31/2003 | WO2004000965A1 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 12/31/2003 | CN1464898A 树脂组合物 Resin composition |
| 12/31/2003 | CN1132879C Epoxy resin toughened by composite rubber/clay toughening agent and its preparing process |
| 12/30/2003 | US6670017 Photocurable form-in-place gasket for electronic applications |
| 12/30/2003 | US6669428 Locating door hinge washer device for hinge assembly |
| 12/25/2003 | US20030236388 A curable epoxy resin free of aromatic units comprising a curing agent selected from the polyamines, polyamides, anhydrides, and titanium oxide reflector particles; use as binders in binding scintillator elements in detectors |
| 12/25/2003 | US20030236361 Powder coating compositions |
| 12/25/2003 | US20030235750 Separator for fuel cell |
| 12/24/2003 | WO2003106559A1 Epoxy resin composition |
| 12/24/2003 | WO2002061010A8 Method for adhering substrates using light activatable adhesive film |
| 12/24/2003 | CN1463283A Thermosetting resin compsn. |
| 12/24/2003 | CN1463282A Thermosetting resin compsn., method for producing same and suspensionlike mixture |
| 12/24/2003 | CN1463281A Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil |
| 12/24/2003 | CN1462768A Nano composite material of epoxy resin and its preparing method |
| 12/24/2003 | CN1131883C Epoxy resin compsn. adhesive film and preimpregnatel blank and multilayer printing circuit board |
| 12/23/2003 | US6667107 Thermosetting resin composition and use thereof |
| 12/23/2003 | US6667078 Liquid crystal displays with a transparent resin plate which is obtained by curing an epoxy resin |
| 12/18/2003 | WO2003104295A1 Acenaphthylene modified phenolic resin and epoxy resin composition |
| 12/18/2003 | WO2003104284A2 Epoxide-type formaldehyde free insulation binder |
| 12/18/2003 | US20030232964 Epoxy resin, epoxy resin composition, cured epoxy resin and manufacturing method thereof |
| 12/17/2003 | EP1144190B1 Manufacture of void-free laminates and use thereof |
| 12/17/2003 | CN1462302A Adhesive and electric device |
| 12/17/2003 | CN1461773A Composition of epoxy resin |
| 12/11/2003 | WO2003102060A1 Halogen free ignition resistant thermoplastic resin compositions |
| 12/11/2003 | WO2003102049A1 Adhesive resin and film adhesives made by using the same |
| 12/11/2003 | US20030229159 Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof |
| 12/10/2003 | EP1369456A1 Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| 12/10/2003 | EP1369445A1 Curing accelerator, epoxy resin composition, and semiconductor device |
| 12/10/2003 | EP1368402A1 Polymerizable preparations on the basis of silicon compounds comprising aliphatic and cycloaliphatic epoxide groups |
| 12/10/2003 | EP1368401A1 Liquid epoxy resin emulsions, method for the production and use thereof |
| 12/10/2003 | EP0929607B1 Resin transfer molding process using stable epoxy resin compositions |
| 12/10/2003 | EP0895523B1 Uv curable composition |
| 12/10/2003 | CN1461318A Carboxylated photosensitive resin, alkali-developable photocurable/heat-curable composition containing the same, and cured article obtained therefrom |
| 12/10/2003 | CN1130427C Epoxy resin composition and semi-solidified sheet and multilayer printed board produced therewith |
| 12/10/2003 | CN1130423C Polyamide curing agents based on mixtures of polyethyleneamines and piperazine derivatives |
| 12/09/2003 | US6660786 For use in composite material, laminated plates, printed circuit boards, electronic products, electrical products |
| 12/09/2003 | US6660374 Radiation-curable compositions and cured articles |
| 12/04/2003 | WO2003099927A1 Process for making a thermoplastic composition comprising dynamic cross-linking |
| 12/04/2003 | WO2003080731A3 Compatibilized polyester/polyamide blends |
| 12/04/2003 | WO2002085975A8 Composition of acrylated urethane oligomer, epoxy resin and amine hardener |
| 12/04/2003 | US20030224177 Epoxy resin composition |
| 12/04/2003 | US20030221964 Cationic electrodeposition coating composition containing at least two emulsions to an electrodeposition coating, said cationic electrodeposition coating composition being such that a difference in an electrical quantity (a) required for |
| 12/03/2003 | EP1366130A1 Adhesives and adhesive compositions containing thioether groups |
| 12/03/2003 | EP1366102A1 Hydroxyl-group-containing polyether amine adducts |
| 12/03/2003 | EP1004630B1 Semiconductor sealing epoxy resin composition and semiconductor device using the same |
| 12/03/2003 | CN1460114A Epoxy resin composition, fiber-reinforced composite material and mfg. method thereof |
| 12/03/2003 | CN1129648C Latent catalysts for epoxy curing systems |
| 12/03/2003 | CN1129624C Amine base curing agent, curable resin copmosition contg said agent and corrosionproofing coating composition contg said agent |
| 12/03/2003 | CN1129561C Composite material containing organic and/or inorganic material and sized glass fiber bundle |
| 12/02/2003 | US6656996 Contains a filler of spherical fused silica having a maximum particle size of not larger than 45 mu m and may contain metal impurities having a particle size of not larger than 53 mu m. |
| 12/02/2003 | US6656531 Clear coating with composition of acrylic and polyester polycarboxylic acids, polyepoxide and crosslinked resin particles |
| 12/02/2003 | US6656305 Method for producing a stove-enameled molded component |
| 12/02/2003 | CA2185681C Curable resin composition, coating composition, coating method and coated article |