| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 02/04/2003 | US6514067 Rotary trowel for use in the molding of ceramics and method for production thereof |
| 01/30/2003 | WO2003008514A1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 01/30/2003 | US20030022992 Charging reaction mixture comprising alkyl acrylate monomer and initiator into heated reactor; initiating polymerization of monomer with aromatic-containing initiator to produce polymer |
| 01/29/2003 | EP1279709A1 Method of bonding adherend |
| 01/29/2003 | EP1279688A1 Quick cure carbon fiber reinforced epoxy resin |
| 01/29/2003 | EP1278912A2 Hydroxy-phenoxyether polymers in papermaking |
| 01/29/2003 | EP1278801A2 Formulation for strippable adhesive and coating films |
| 01/29/2003 | EP1278796A1 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom |
| 01/29/2003 | CN1394225A Epoxy resin composition and its use |
| 01/29/2003 | CN1394218A S-B-S compositions |
| 01/28/2003 | US6512075 High Tg brominated epoxy resin for glass fiber laminate |
| 01/28/2003 | US6512031 First curing agent for polymerizing the epoxy resin into a linear polymer, and a second curing agent for crosslinking the linear polymer into a three-dimensional polymer. The use of two curing agents corresponding to straight chain growth |
| 01/23/2003 | WO2003006553A1 Resin composition |
| 01/23/2003 | US20030018132 Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device |
| 01/23/2003 | US20030018131 Thermosetting resin blend; amine curing agent |
| 01/23/2003 | US20030017351 Thermosetting epoxy resin containing dielectric ceramics with high dielectric constant |
| 01/23/2003 | US20030017343 Copolymer containing in side chain a diketene or ketoester capable of switching between keto and enol tautomeric forms and containing hydrophilic side chain, epoxy resin modified with phosphoric acid type compound, curing agent |
| 01/23/2003 | US20030017341 Adhesives and adhesive compositions containing thioether groups |
| 01/23/2003 | DE10157936C1 Modified foliated clay material, used for molding, packaging or adhesive material, especially encapsulating electronic equipment, is modified by ion exchange with zirconyl chloride and silane surfactant |
| 01/22/2003 | EP1277805A1 Thermoplastic resin composition |
| 01/22/2003 | EP1277798A2 Thermosetting resin composition |
| 01/22/2003 | EP1276812A2 Non-aqueous solvent-free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 01/22/2003 | EP1276799A2 Flame retardant epoxy molding compositions |
| 01/22/2003 | CN1392883A Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing resin, and laminate |
| 01/22/2003 | CN1099434C Epxoy resin, epoxy resin composition and products of curing thereof |
| 01/21/2003 | US6509421 Polysiloxane blend |
| 01/21/2003 | US6509414 To produce laminates and printed wiring boards |
| 01/21/2003 | US6509076 Using acrylic copolymer and crosslinking agent; appropriate hardness to prevent spotty defects during storage in pressed state |
| 01/21/2003 | US6509063 Preparation of polyindanebisphenols and polymers derived therefrom |
| 01/21/2003 | CA2224441C Photogeneration of amines from .alpha.-aminoacetophenones |
| 01/16/2003 | WO2003005118A1 Epoxy-based composition |
| 01/16/2003 | WO2002050156A3 Method for making biodegradable polyhydroxyalkanoate copolymers having improved crystallization properties |
| 01/16/2003 | US20030013408 Wireless local loop antenna |
| 01/16/2003 | US20030012957 Hardened sheet comprising an epoxy resin, and another resin layer formed on one side thereof, wherein the sheet has a retardation of 5 nm or less, an average thickness of 500 mu m or less; smooth surface |
| 01/15/2003 | EP1275695A1 Curable composition and multilayered circuit substrate |
| 01/15/2003 | EP1274798A1 Polycarbonate having excellent hydrolytic stability |
| 01/15/2003 | EP1274796A1 Coherent insert |
| 01/15/2003 | EP1274783A2 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 01/15/2003 | EP1274770A1 High strength polymers and aerospace sealants therefrom |
| 01/15/2003 | CN1390885A Interface treating agent of unsaturated polyester mortar as concrete repairing material |
| 01/15/2003 | CN1390687A Anticorrosion table top |
| 01/15/2003 | CN1098902C Pressure sensitive adhesive composition and use thereof |
| 01/15/2003 | CN1098884C Epoxy resin/microparticle composite solidifed microsphere water base system and its preparation method |
| 01/14/2003 | US6507049 Encapsulants for solid state devices |
| 01/14/2003 | US6506869 Anhydride-terminated polyimide from a dianhydride and a diaminopolysiloxane as curing agent |
| 01/14/2003 | US6506868 Silane-modified polyamide(polyimide) and/or phenolic resin; heat resistance, high strength, noncracking |
| 01/14/2003 | US6506828 Resin composition, molded article therefrom, and utilization thereof |
| 01/14/2003 | US6506822 For encapsulation of semiconductor devices by potting, chip-on-bonding or screen printing |
| 01/14/2003 | US6506821 A self-dispersible curable epoxy resin composition containing a reaction product of: (a) 1.0 equivalent of epoxy resin; equivalent of polyhydric phenol; and equivalent of an amine/epoxy adduct formed by reacting: (i) an aromatic |
| 01/09/2003 | WO2003002671A1 Epoxy functionalized ethylene copolymer asphalt reaction products |
| 01/09/2003 | WO2003002667A2 Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
| 01/09/2003 | WO2003002663A2 Hydrolysis resistant polyesters and articles made therefrom |
| 01/09/2003 | WO2003002662A1 Curable epoxy resin composition |
| 01/09/2003 | WO2003002645A1 Adhesion promoter for plastisols |
| 01/09/2003 | US20030009001 Polyphenol resin, process for its production, epoxy resin composition and its use |
| 01/09/2003 | US20030008976 For producing pipes |
| 01/09/2003 | US20030008960 Autodepositable adhesive |
| 01/09/2003 | US20030008955 Silicone composition and electrically conductive, cured silicone product |
| 01/09/2003 | US20030008150 Radiation curable composition |
| 01/09/2003 | US20030005973 Plastic pipe and manufacturing method therefor |
| 01/09/2003 | CA2452398A1 Curable epoxy resin composition |
| 01/09/2003 | CA2449265A1 Hydrolysis resistant polyesters and articles made therefrom |
| 01/08/2003 | EP1273609A1 Resin compound for forming interlayer insulating layer of printed wiring board, resin sheet and copper foil with resin for forming insulating layer using the resin compound, and copper-clad laminate using them |
| 01/08/2003 | EP1273608A1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part |
| 01/08/2003 | EP1272587A1 Impact-resistant epoxy resin compositions |
| 01/08/2003 | EP1272582A1 Rubber-metal composites |
| 01/08/2003 | EP1272346A2 Laminates and coated materials comprising hydroxy-phenoxyether polymers |
| 01/08/2003 | CN1390246A Flame-retardant epoxy resin composition and liminate made with same |
| 01/07/2003 | US6503967 Hardener for epoxy resin and epoxy resin composition |
| 01/03/2003 | WO2003000816A1 Anisotropic conductive adhesives having enhanced viscosity and bonding methods and integrated circuit packages using the same |
| 01/03/2003 | WO2003000798A1 Thermosetting resin composition, process for producing the same, and suspension-form mixture |
| 01/02/2003 | US20030004373 Process for the recovery of purified terephthalic acid (PTA) |
| 01/02/2003 | US20030004296 Latent curing agent for epoxy resin, and curable epoxy resin composition |
| 01/02/2003 | US20030003305 Polytriazine product of cyanate ester monomer or prepolymer and a bismaleimide, and a flame inhibitor of a polyepoxide reacted with an organic phosphorus compound |
| 01/02/2003 | US20030003287 Heat conductive resin substrate and semiconductor package |
| 01/02/2003 | US20030002213 Glass epoxy board and magnetic head device |
| 01/02/2003 | EP1271578A2 Thermosetting composite dielectric film and method of manufacturing the same |
| 01/02/2003 | EP1270799A1 Fiber-treating agent and glass fiber and rubber product both made with the fiber-treating agent |
| 01/02/2003 | EP1270692A1 Emulsion composition for coating film formation, coating film obtained from the composition, processes for producing these, and method of surface treatment with these |
| 01/02/2003 | EP1270668A1 Epoxy resin composition and electronic part |
| 01/02/2003 | EP1270632A1 Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing the resin, and laminate |
| 01/02/2003 | EP1270618A2 Processes for preparing thermoset compositions and tougheners |
| 01/02/2003 | EP1268665A1 Flame retardant phosphorus element-containing epoxy resin compositions |
| 01/02/2003 | EP1268644A1 Synergistic stabilizer compositions for thermoplastic polymers in prolonged contact with water |
| 01/02/2003 | EP1268636A1 Branched polymeric surfactant reaction products, methods for their preparation, and uses therefor |
| 01/02/2003 | EP1268457A1 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
| 01/02/2003 | EP1268192A2 Laminate and process for producing a laminate of this type |
| 01/02/2003 | EP1268189A1 Flame retardant optical films |
| 01/02/2003 | EP0837908B1 Electroactive polymer coatings for corrosion control |
| 01/01/2003 | CN1388818A Sealing material for plastic liquid crystal display cells |
| 01/01/2003 | CN1388175A Thermoplastic resin modified and electronic beam cured composite material epoxy resin-base |
| 01/01/2003 | CN1388174A Water-thinned epoxy/acrylic amino resin emulsion and water-thinned baking paint with the emulsion as base material |
| 01/01/2003 | CN1388143A Potential curing agent for epoxy resin solidified epoxy resin composition |
| 01/01/2003 | CN1097517C Distributing composition for magnetic display |
| 12/31/2002 | US6500912 Epoxy resin system |
| 12/31/2002 | US6500893 Resin composition |
| 12/31/2002 | US6500878 Improving adhesion of acrylate resins |
| 12/31/2002 | US6500564 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 12/31/2002 | US6500546 Heterocyclic phosphonate or phosphinate compound; curing agent of styrene-maleic acid (anhydride, ester or salt) copolymer; printed circuits, prepregs |
| 12/31/2002 | US6500518 Epoxy optical sheet and process for producing the same |