| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 09/11/2002 | EP1000372B1 Retroreflective article having a binder layer containing an epoxy resin and a silicone cross-linked polymer |
| 09/10/2002 | US6448346 Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus making use of the same |
| 09/10/2002 | US6447913 Thermoplastic polyester resin composition |
| 09/10/2002 | US6447867 Epoxy resin composition and optical information recording medium using the same |
| 09/06/2002 | WO2002042548A3 Method and composition for cutting dry fabric |
| 09/06/2002 | WO2002042349A3 Hardener for epoxy of polyols and n-containing hardener |
| 09/06/2002 | WO2001009231A9 Cured coatings having improved scratch resistance, coated substrates and methods related thereto |
| 09/05/2002 | US20020123540 Dielectric compositions having two steps of laminating temperatures |
| 09/05/2002 | US20020123537 Nonaqueous compositions and additives therefor |
| 09/05/2002 | DE10108129A1 Wäßrige Epoxidharzemulsionen, Verfahren zu ihrer Herstellung und ihre Verwendung Aqueous epoxy resin emulsion, process for their preparation and their use |
| 09/04/2002 | EP1194953A4 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 09/04/2002 | CN1090204C Multifunctional cyanate ester and epoxy blends |
| 09/04/2002 | CN1090203C Material comprising polyamide, polymer having polyamide and polyether blocks and functiojnalized polyolefin, and object obtained therefrom |
| 09/03/2002 | US6444320 Thermosetting anti-reflective coatings for full-fill dual damascene process |
| 09/03/2002 | CA2039404C Modified epoxy resins |
| 08/29/2002 | WO2002066535A1 Polymerizable preparations on the basis of silicon compounds comprising aliphatic and cycloaliphatic epoxide groups |
| 08/29/2002 | WO2002066534A1 Liquid epoxy resin emulsions, method for the production and use thereof |
| 08/29/2002 | WO2002024801A3 Polymer composition for coating film formation and use thereof |
| 08/29/2002 | US20020120031 Photothermosetting component |
| 08/29/2002 | US20020119317 Mixture containing phosphorous compound |
| 08/29/2002 | US20020119298 Epoxy optical sheet and process for producing the same |
| 08/29/2002 | US20020117774 Epoxy resin, a hardener and a hardening accelerator are melt mixed together followed by regulating viscosity at a given temperature |
| 08/29/2002 | US20020117259 Two part, room temperature curable epoxy resin/ (meth) acrylate compositions with high flash point and low odor, reaction products of which demonstrate improved fixture |
| 08/29/2002 | CA2438726A1 Liquid epoxy resin emulsions, method for the production and use thereof |
| 08/28/2002 | CN1366002A Conductive rubber composition, conductive polymer composition, conductive vulcanized rubber, conductive rubber roller and conductive rubber band |
| 08/27/2002 | US6441106 Curing agent for epoxy resin comprising a siloxane-modified phenolic resin obtained by dealcoholization condensation between a phenolic resin and a hydrolyzable alkoxysilane such as a polysilicate |
| 08/27/2002 | US6440572 Polydimethylsiloxane block type copolymer and resin(s) selected from: polyvinyl acetates, polyamide, acrylic resin, epoxy resin, unsaturated polyester resin and precursor of unsaturated polyester and/or cellulose derivatives |
| 08/27/2002 | CA2144584C Dental filling composition and method |
| 08/22/2002 | WO2002064856A1 Metal surface-treatment agents, metal surface-treatment method and surface-treated metal materials |
| 08/22/2002 | US20020115789 Thermoplastic resin compostions and thier injection moldings |
| 08/22/2002 | US20020114969 Covercoats to protect the circuitry |
| 08/21/2002 | EP1233663A2 Via fill compositions for direct attach of devices and methods for applying same |
| 08/21/2002 | EP1232215A1 Thermally stable polyester molding materials |
| 08/20/2002 | US6437059 Composition of epoxy, urethane polyacrylate and polyamine |
| 08/20/2002 | US6437054 Moldings of reduced moisture absorption |
| 08/20/2002 | US6437045 Powder coating of carboxyl polyester or (poly)methacrylate and cycloaliphatic polyepoxide |
| 08/20/2002 | US6437026 Hardener for epoxy molding compounds |
| 08/20/2002 | US6436315 Corrosion resistant, conductivity polymer |
| 08/20/2002 | US6436177 Setting composition and ink, paint and adhesive containing the same composition |
| 08/15/2002 | WO2002063896A1 Wireless local loop antenna |
| 08/15/2002 | WO2002062883A1 Solid polymethylmethacrylate surface material |
| 08/15/2002 | US20020111514 Polyaldehyde reaction products |
| 08/15/2002 | US20020111457 Reaction products of melamine and derivatives thereof |
| 08/15/2002 | US20020111423 Method for manufacturing conductive adhesive for high frequency flip chip package application |
| 08/15/2002 | US20020111422 Blend of epoxy resin and amidamine oligomer |
| 08/15/2002 | US20020111398 Curable epoxy resin compositions and the cured residues thereof |
| 08/15/2002 | US20020111288 Surfactants, antifoam agents; reaction product of polyol and alkoxide |
| 08/15/2002 | CA2471305A1 Wireless local loop antenna |
| 08/14/2002 | EP1231248A1 Conductive and resistive materials with electrical stability for use in electronics devices |
| 08/14/2002 | EP1230302A2 Polymer blends containing modified polyesters |
| 08/14/2002 | EP1230294A1 Storage-stable prepregs on the basis of duroplastic, oleochemical matrices |
| 08/13/2002 | US6433084 Powder coating |
| 08/13/2002 | US6433042 Saturated nitrogen-containing heterocyclic hydrazine or salt; hardening epoxy resins in presence of water |
| 08/13/2002 | US6432540 Flame retardant molding compositions |
| 08/13/2002 | US6432539 Electronic packages |
| 08/08/2002 | WO2002061010A2 Method for adhering substrates using light activatable adhesive film |
| 08/08/2002 | WO2002060981A1 Glass epoxy board and magnetic head device |
| 08/08/2002 | US20020107321 Fatty-acid ester such as jojoba oil is present in an amount effective for providing blister resistance |
| 08/08/2002 | US20020107318 Resin Composition |
| 08/08/2002 | US20020107309 An epoxy resin ester reacted with an unsaturated monobasic acid and a reactive monomer; a glycol and/or glycol ether; pigment, a monoalkanolamine, a drier and water. |
| 08/08/2002 | US20020107308 Curable epoxy resin compositions and the cured residues thereof |
| 08/08/2002 | US20020107307 (a) bromine-free epoxy resin and curing agent; (b) a flame retardant additive that is the condensation product of a brominated phenol and a cyanuric halide; and (c) thermoplastic resin, such as a polyphenylene ether |
| 08/08/2002 | US20020106516 Free of halogen elements, flame retardancy, water resistance, heat resistance, peeling strength |
| 08/08/2002 | US20020106515 Novel high temperature underfilling material with low exotherm during use |
| 08/08/2002 | US20020106458 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer |
| 08/08/2002 | DE10129359A1 Epoxidharzzusammensetzung, Halbleitervorrichtung und Verfahren zur Beurteilung der Sichtbarkeit einer Lasermarkierung Epoxy resin, semiconductor device and method for assessing the visibility of a laser marking |
| 08/08/2002 | DE10044374A1 Verfahren zur Vernetzung von Polyacrylaten A process for the crosslinking of polyacrylates |
| 08/07/2002 | EP1229079A1 Thermosetting resin composition and use thereof |
| 08/07/2002 | EP1228141A1 Crosslinkable compositions of functionalised polyolefin powders |
| 08/07/2002 | EP1228119A1 High performance polyetherester containing laminating resin compositions |
| 08/07/2002 | EP1155084A4 Sound deadening and structural reinforcement compositions and methods of using the same |
| 08/06/2002 | US6429238 Liquid epoxy resin and modified polyethersiloxane cured with imidazole-derived cure accelerator; sealing material for flip-chip semiconductor devices; improved thin-film infiltration and storage stability; no need to clean flux |
| 08/01/2002 | WO2002059982A1 Light emitting diode, optical semiconductor elemet and epoxy resin composition suitable for optical semiconductor element and production methods therefor |
| 08/01/2002 | WO2002059176A1 Curable resin, curable resin material, curable film, and insulator |
| 08/01/2002 | US20020103294 Composition of polyester sulfonate salt inomer,polyamide and polyepoxide |
| 08/01/2002 | US20020103102 Useful as low foaming surfactants and as defoaming agents in aqueous and nonaqueous liquid compositions |
| 08/01/2002 | US20020102429 Good flow and curing properties, reliability, do not pose hazard to human health or environment |
| 08/01/2002 | US20020102408 Adhesive resin composition and laminate thereof and production process of laminate |
| 08/01/2002 | US20020102369 Cellulose ester film, cellulose ester dope, protective film of polarizing plate and polarizing plate |
| 08/01/2002 | US20020100566 Sizing, strength |
| 07/25/2002 | WO2002057361A2 Curing agent for epoxy resins and epoxy resin composition |
| 07/25/2002 | WO2002057360A1 Thermoplastic resin composition for use under vacuum, method for producing the same and vacuum device using the same |
| 07/25/2002 | WO2002057333A2 Epoxy resin composition for semiconductor encapsulation |
| 07/25/2002 | WO2002057004A1 Dispersing agent |
| 07/25/2002 | WO2002056921A2 Nonaqueous compositions and additives therefor |
| 07/25/2002 | WO2002006371A3 Radiation-curable compositions and cured articles |
| 07/25/2002 | US20020099150 Polyester composition and connector |
| 07/25/2002 | US20020098754 Calcium carbonate filled epoxy urethane string binders |
| 07/25/2002 | DE10201579A1 Crosslinkable resin composition for production of hydrophilic, water-resistant surfaces or materials, e.g. packaging film, contains polymer with N-vinylamide units and a compound with groups which react with active hydrogen |
| 07/24/2002 | EP1225202A1 Flame-retardant polyester resin composition, molded article thereof, and method of molding the same |
| 07/24/2002 | CN1359975A Method for preparing epoxy resin composition for sealing optoelectronic semiconductor elements |
| 07/23/2002 | US6423367 Adhesives; coatings; encapsulation |
| 07/23/2002 | CA2113814C Additives for polymer compositions |
| 07/18/2002 | WO2002055620A2 Powdered thermosetting composition for coatings |
| 07/18/2002 | WO2002055603A1 Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| 07/18/2002 | US20020094945 Reaction product of monoetherified, monoaminated, or monothioetherified polyoxyalkylene adducts or polymers with di-or polyepoxides such as glycerol, diglycidyl ether; use as low foaming surfactants |
| 07/18/2002 | CA2770436A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 07/18/2002 | CA2660875A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 07/18/2002 | CA2400592A1 Powdered thermosetting composition for coatings |
| 07/17/2002 | EP1222229A1 Formulation for strippable adhesive and coating films and high performance adhesives |