| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 05/30/2002 | US20020062926 Resin composition with excellent dielectric property |
| 05/30/2002 | CA2429559A1 Method and composition for cutting dry fabric |
| 05/29/2002 | EP1209253A2 Process for treating adhesion promoted metal surfaces with epoxy resins |
| 05/29/2002 | EP1209211A1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 05/29/2002 | EP1209200A2 Polyester composition and connector |
| 05/29/2002 | EP1208179A1 Bonding of concrete parts |
| 05/29/2002 | CN1085704C Thermoplastic moulding materials based on polyethylene terephthalate for use in injection moulding of parts |
| 05/29/2002 | CN1085702C Fire-retardant for thermosetting resin |
| 05/28/2002 | US6395845 Comonomers of long chain dicarboxylic acid and aminoalkylpiperazine; polyamine, filler; roofing, ponds, swimming pool liners, bridges |
| 05/28/2002 | US6395807 Blend with epoxy and silicone resins; semiconductors, integrated circuits |
| 05/23/2002 | WO2002040589A1 Thermally conductive casting compound |
| 05/23/2002 | US20020061971 One-pack type epoxy resin composition and cured epoxy resin |
| 05/23/2002 | US20020061941 Aqueous resin composition |
| 05/22/2002 | EP1206496A1 Semi-interpenetrating networks comprising polyepoxides |
| 05/22/2002 | CN1350030A Fireproof epoxy resin composite and its application |
| 05/22/2002 | CN1350027A Polymer composition containing halogen stabilized by crypto-thio-alcohol and mixture of zinc carboxylate and zinc chloride |
| 05/22/2002 | CN1350026A Phenol curing agent for epoxy resin and epoxy resin composition using said curing agent |
| 05/22/2002 | CN1350024A Tower support made of composite material |
| 05/21/2002 | US6392003 Flame retardant |
| 05/21/2002 | US6391436 Modified epoxy resin impregnated unidirectional glass, quartz, polyamide, carbon or graphite fibers; prepreg; aerospace; aircraft |
| 05/21/2002 | US6391391 Coating substrate with atom transfer radical polymerized carboxyl polymer and polyepoxide |
| 05/21/2002 | US6391140 Adhesive material with flexibility modifiers |
| 05/16/2002 | WO2001079374A3 Stabilized cationically polymerizable composition, and adhesive film and conductor circuit comprising the same |
| 05/16/2002 | US20020058742 As underfill for flip-chip type semiconductor devices for optical communications |
| 05/16/2002 | US20020058145 Light-transmissive epoxy resin composition and semiconductor device |
| 05/16/2002 | US20020056517 Methods of bonding metal surfaces, and components therefor |
| 05/15/2002 | EP1205518A1 Material for the production of moulded products |
| 05/15/2002 | EP1204701A1 Cured coatings having improved scratch resistance, coated substrates and methods related thereto |
| 05/15/2002 | CN1348972A Method for prodn. of epoxy resin composite used for optical semiconductor sealing |
| 05/15/2002 | CN1348971A Reversible epoxy resin gel and its curing agent |
| 05/14/2002 | US6388009 Controlling concentration of curing agents |
| 05/14/2002 | US6387990 Blend containing thermoplastic resin |
| 05/14/2002 | US6387989 Using a,b-unsaturated carboxylic acid ester |
| 05/14/2002 | US6387537 Epoxy resin composition and semiconductor device |
| 05/14/2002 | US6387519 Cured coatings having improved scratch resistance, coated substrates and methods thereto |
| 05/14/2002 | US6387470 Sound deadening and structural reinforcement compositions and methods of using the same |
| 05/14/2002 | US6387387 Electronic component material containing pest repellent, electronic component using the same, and its manufacturing method |
| 05/14/2002 | US6387310 Thermosetting resin composition for prestressed concrete tendon, its use and prestressed concrete tendon using the composition |
| 05/14/2002 | CA2049854C Binder compositions and their use in coating compositions and sealing compositions |
| 05/10/2002 | WO2002006038A3 Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization |
| 05/10/2002 | WO2001046303A3 Hydroxy-phenoxyether polymer/fiber composites and foams |
| 05/09/2002 | US20020053302 Epoxy resin composition for encapsulating semiconductor, and resin-encapsulated type semiconductor apparatus |
| 05/08/2002 | EP1203792A1 Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 05/08/2002 | EP1203515A1 Thermosetting polymer systems and electronic laminates |
| 05/08/2002 | CN1348481A Resin composition for semiconductor encapsulation, semiconductor device obtained with the same, and process for producing semiconductor device |
| 05/08/2002 | CN1347940A Conductive rubber composition and the conductive rubber roller and rubber belt |
| 05/07/2002 | US6384134 Polymer gel composition comprising maleated polyalkylene grated via grafting agent to poly(alkenyl-co-maleimide), epoxy polymer, and optionally, extender; vibration damping material |
| 05/07/2002 | US6383660 Epoxy resin, phenolic resin, curing accelerator, and hollow inorganic filler of given particle size and shell thickness; low-dielectric constant epoxy resin |
| 05/07/2002 | US6383659 Autopolymerizable epoxy resin or curable phenolic resin; semiconductor packaging; filler, curing catalyst, and thermoplastic resin |
| 05/02/2002 | WO2002034832A1 Epoxy resin composition and its use |
| 05/02/2002 | WO2001046523A3 Hydroxy-phenoxyether polymers in papermaking |
| 05/02/2002 | WO2000057506A9 Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds |
| 05/02/2002 | US20020051942 Photo-or heat-curable resin composition and multilayer printed wiring board |
| 05/02/2002 | EP1201706A1 A halogen-containing polymer composition stabilized by a latent mercaptan and a mixture of a zinc carboxylate and zinc chloride |
| 05/02/2002 | EP0894097A4 Radiation curable rheology modifiers |
| 05/01/2002 | CN1347274A 多层印刷线路板 Multilayer printed circuit boards |
| 05/01/2002 | CN1083851C 环氧树脂组合物 The epoxy resin composition |
| 04/30/2002 | US6380344 A cyanate ester composition comprising a cyanate ester in which the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols as impurites is 5% or less, an epoxy resin, and a curing catalyst |
| 04/25/2002 | WO2002032997A1 Silicone-modified single-component sealing compound |
| 04/25/2002 | US20020049264 Epoxy resin composition, prepreg and metal-clad laminate |
| 04/24/2002 | CN1346375A Sealing agent for liquid-crystal display, cell, composition for sealing agent for liquid-crystal display cell, and liquid-crystal display element |
| 04/24/2002 | CN1346150A 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device |
| 04/24/2002 | CN1345896A 环氧树脂组合物和半导体装置 Epoxy resin composition and a semiconductor device |
| 04/23/2002 | US6376923 Liquid epoxy resin, curing agent, copolymer of alkenyl group-containing epoxy resin and an sih group-containing organopolysiloxane, inorganic filler surface treated with an aminosilane or organosilazane |
| 04/23/2002 | US6376638 Latent curing agent for epoxy resin initiated by heat and UV-light and epoxy resin composition containing the same and cured epoxy products |
| 04/23/2002 | US6376607 Film forming mixture; corrosion resistance |
| 04/23/2002 | US6376564 Storage-stable compositions useful for the production of structural foams |
| 04/23/2002 | US6376101 Epoxy resin composition and semiconductor devices |
| 04/23/2002 | US6376053 Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same |
| 04/23/2002 | US6375867 Process for making a positive temperature coefficient conductive polymer from a thermosetting epoxy resin and conductive fillers |
| 04/23/2002 | US6375789 Powder coatings employing silanes |
| 04/23/2002 | CA2025039C Extremely tough thermosetting bismaleimide resin systems |
| 04/18/2002 | WO2002031018A1 Die-attaching paste and semiconductor device |
| 04/18/2002 | WO2002012368A3 Method for charge-modifying polyester |
| 04/18/2002 | US20020045709 Liquid epoxy resin composition and semiconductor device |
| 04/18/2002 | US20020043728 Resin composition for sealing semiconductor, semiconductor device using the same, semiconductor wafer and mounted structure of semiconductor device |
| 04/18/2002 | DE10107985C1 Polymerizable formulation used for coating and/or bonding substrates or as dental formulation, contains organosilicon compound with aliphatic and cycloaliphatic epoxide groups, filler and initiator, inhibitor and/or accelerator |
| 04/18/2002 | DE10051051A1 One-component casting material, e.g. for insulation of electrical components and for production of fuel tanks, contains epoxy resin, a silicone-containing component, filler and initiator |
| 04/17/2002 | EP1196485A1 High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| 04/17/2002 | EP0966254B1 Foaming shaving cream |
| 04/16/2002 | US6372827 A tape comprises a conformable, compressible, melt flow-resistant foam core layer having first and second surfaces, a thermosetting sealant layer on first surface of core, sealant layer having a surface for contacting substrate |
| 04/16/2002 | US6372826 Curable mixture of diglycidyl ether of bisphenol a, solvent, reactive diluent, graphite and polytetrafluoroethylene |
| 04/16/2002 | US6372825 Hydrazine compounds for epoxy resins |
| 04/16/2002 | US6372823 Cationically electrodepositable coating composition |
| 04/16/2002 | US6372351 Laser markability, electrical properties, moldability, reliability and package surface appearance |
| 04/16/2002 | CA2030312C In-mold coating composition |
| 04/11/2002 | WO2002028940A1 Polyphenol resin, process for its production, epoxy resin composition and its use |
| 04/11/2002 | WO2001081494A3 Non-aqueous solvent-free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 04/11/2002 | US20020042479 Crosslinked elastomer |
| 04/11/2002 | DE10057111C1 Casting composition for removing thermal energy from electrical or electronic device, comprises epoxide resin, silicone, filler and initiator and cures by chemical reaction, has specified thermal conductivity |
| 04/10/2002 | EP1194953A1 Controllably degradable composition of heteroatom carbocyclic or epoxy resin and curing agent |
| 04/10/2002 | CN1344429A Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds |
| 04/10/2002 | CN1344286A Urethane oligomer, resin compsns. thereof, and cured article thereof |
| 04/10/2002 | CN1343735A Stone-like slab with 3D colour pattern composed of uniform particles |
| 04/09/2002 | US6369142 Blend with styrene resin, epoxidized conjugated diene-vinyl aromatic block polymer, and grafted core/shell rubber elastomer; discoloration inhibition, fireproof, impact strength; appliances, electronics |
| 04/09/2002 | US6368438 Thermoplastic resin or synthetic rubber and epoxy resin with blowing agent; lightweight, expandable, high compression strength |
| 04/04/2002 | WO2002027780A1 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
| 04/04/2002 | WO2002026888A2 Low temperature bonding adhesive composition |
| 04/04/2002 | WO2002026887A2 Crosslinked polyamide |
| 04/03/2002 | EP1192199A1 Phenol-novolacs with improved optical properties |