| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 04/03/2002 | EP0927209B1 Liquid curable resin composition |
| 04/03/2002 | EP0879257B1 Polymerizable substances based on epoxides |
| 04/03/2002 | CN1082067C Epopxy resin composition for sealing photosenmiconductor device |
| 04/02/2002 | US6365079 Polyetheramine |
| 04/02/2002 | US6365069 Process of injection molding highly conductive molding compounds and an apparatus for this process |
| 04/02/2002 | CA2018589C Curable resins with reduced foaming characteristics and articles incorporating same |
| 03/28/2002 | WO2002025378A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 03/28/2002 | WO2002024801A2 Polymer composition for coating film formation and use thereof |
| 03/28/2002 | WO2002024774A1 Carboxylated photosensitive resin, alkali-developable photocurable/heat-curable composition containing the same, and cured article obtained therefrom |
| 03/28/2002 | WO2002024451A1 Wax-modified thermosettable compositions |
| 03/27/2002 | EP1191063A1 Epoxy resin composition and semiconductor device |
| 03/27/2002 | EP1191062A1 Epoxy resin composition and semiconductor devices |
| 03/27/2002 | EP1189966A1 Epoxy resin hardener compositions |
| 03/27/2002 | EP0770103B1 Low voc refinish coating composition |
| 03/27/2002 | CN1081664C Liquid-state epoxy resin potting material |
| 03/27/2002 | CN1081658C Laminate struction compirsing at least one crued polyphenylene ether resin composition layer |
| 03/26/2002 | US6361924 Applied, in the form of coatings, onto substrates such as printed circuit boards |
| 03/26/2002 | US6361879 Sealed semiconductors |
| 03/26/2002 | US6361866 Prepreg and laminated board |
| 03/21/2002 | WO2002022752A1 Synthetic composition based on thermosetting resins |
| 03/21/2002 | WO2002022704A1 Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing the resin, and laminate |
| 03/21/2002 | US20020035204 Thermoplastic resin |
| 03/21/2002 | US20020035201 No-flow reworkable epoxy underfills for flip-chip applications |
| 03/21/2002 | US20020033547 Method of manufacturing a replica as well as a replica obtained by carrying out an UV light-initiated cationic polymerization |
| 03/20/2002 | EP1188778A1 Thermosetting resin composition, and resin coated metal foil, prepreg and film-shaped adhesive all using the composition |
| 03/20/2002 | EP1187875A1 Process for preparing starch and epoxy-based thermoplastic polymer compositions |
| 03/20/2002 | CN1340586A Resin composition for sealing semiconductor, semiconductor device, semiconductor chip and semiconductor mounting structural body |
| 03/19/2002 | US6359082 Reacting dicarboxylic anhydrides with meth)acrylic acid and tri- or tetrahydric ether alcohols containing at least two ethylene and/or propylene oxide units to form epoxy (meth)acrylate |
| 03/19/2002 | US6359076 Wet strength of coated capet |
| 03/19/2002 | US6358629 Encapsulated and cured epoxy resin with fillers, catalysts and flame retarders |
| 03/14/2002 | WO2002020647A1 Method for cross-linking polyacrylates |
| 03/14/2002 | US20020032286 Epoxidized low viscosity rubber |
| 03/14/2002 | DE10048179C1 Epoxidharzzusammensetzung mit halogenfreiem, phosphorfreiem Flammschutzmittel Epoxy resin with halogen-free, phosphate-free flame retardants |
| 03/13/2002 | EP1185808A1 Gasket and method for producing a gasket |
| 03/13/2002 | EP0669949B1 Tertiary amine derivatives as components of polymer forming systems |
| 03/13/2002 | CN1340082A 环氧树脂组合物 The epoxy resin composition |
| 03/13/2002 | CN1340067A Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 03/13/2002 | CN1339534A Fire-retarded epoxy resin composition, its preparing method and use |
| 03/13/2002 | CN1339518A Phosphorous polymer having phenolic structure and its use |
| 03/13/2002 | CN1080746C Inorganic filler, epoxy resin composition, and semiconductor device |
| 03/13/2002 | CN1080740C UV curable composition |
| 03/13/2002 | CN1080735C Toughening modified epoxy resin composition |
| 03/13/2002 | CN1080727C Monohydroxylated diene polymers and epoxidized derivatives thereof |
| 03/12/2002 | US6355735 Non-glycidyl epoxy and olefin monomers; palladium compound polymerization catalyst uniformly distributed; vibration damping; adhesives, seals, gaskets |
| 03/07/2002 | WO2002019440A1 Encapsulants for solid state devices |
| 03/07/2002 | US20020028880 Interpenetrating network ("IPN") of a secondary polymer which is intensely dispersed within a first polymer such as polyethylene terephthalate, using an isocyanate or epoxy compound reacted with a catalyst; tensile strength |
| 03/07/2002 | US20020028879 Having a relatively high glass transition temperature, and a curing agent having functional groups reactive with the carbamate groups; forming a wrinkled coating on a substrate; storage stability, acid resistance, wear resistance |
| 03/07/2002 | US20020028296 Heat-stable, corrosion-inhibiting polyorganosiloxane resins |
| 03/06/2002 | EP1184419A2 Resin composition for selaing semiconductor, semiconductor device using the same semiconductor wafer and mounted structure of semiconductor device |
| 03/06/2002 | EP1184403A2 Polyimide silicone resin, process for its production, and polyimide silicone resin composition |
| 03/06/2002 | EP1183294A1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 03/06/2002 | CN1339013A Melamine-modified phyllosilicates |
| 03/05/2002 | CA2238778C Hardenable photoimageable compositions |
| 03/05/2002 | CA2055982C Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates |
| 02/28/2002 | WO2002016498A1 Aromatic polycarbonate resin composition and moldings |
| 02/28/2002 | US20020024170 Curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method |
| 02/27/2002 | CN1337980A Resin composition, molded article therefrom, and utilization thereof |
| 02/27/2002 | CN1337975A Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 02/26/2002 | US6350843 Epoxy resin low electronic impedance high molecular polymer |
| 02/26/2002 | US6350826 Epoxy vinyl ester and urethane vinyl ester derived from low and high MW glycols |
| 02/26/2002 | US6350792 Radiation-curable compositions and cured articles |
| 02/21/2002 | WO2002015259A1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 02/21/2002 | US20020022681 For encapsulation of semiconductor devices by potting, chip-on-bonding or screen printing |
| 02/21/2002 | US20020022679 For plastic packaging material for microelectronic applications |
| 02/21/2002 | DE10031954A1 Binding agent system, useful for production of e.g. casting cores, molds and insulation, comprises reaction product of unsaturated carboxylic acid anhydride with triglyceride |
| 02/20/2002 | EP0724613B1 Binders based on fat chemical reaction products |
| 02/20/2002 | CN1079411C Polyester composition modified by polyester elastomer and multifunction group epoxy and process for preparing same |
| 02/19/2002 | US6348523 Curable composition |
| 02/19/2002 | US6348270 High performance polyetherester containing laminating resin compositions |
| 02/19/2002 | CA2188344C Plateable structural adhesive for cyanate ester composites |
| 02/19/2002 | CA2043732C Epoxy resin compositions |
| 02/14/2002 | WO2002012424A1 Charge-modified dye absorption media |
| 02/14/2002 | WO2002012368A2 Method for charge-modifying polyester |
| 02/14/2002 | WO2002011902A1 Platable dielectric materials for microvia technology |
| 02/14/2002 | US20020019463 Curable compositions of glycidyl compounds, aminic hardeners and novel low viscosity curing accelerators |
| 02/14/2002 | US20020019449 Recycling of articles comprising hydroxy-phenoxyether polymers |
| 02/13/2002 | EP1179569A2 Silicone composition and electrically conductive cured silicone product |
| 02/13/2002 | EP0595803B1 Porous, absorbent, polymeric macrostructures and methods of making the same |
| 02/12/2002 | US6346582 Curable coating composition comprising composition prepared by glycidating at least one carboxy polyfunctional polyester, at least one alpha, alpha-branched monocarboxylic acid having tertiary carbon atom or glydicyl ester thereof, curing agent |
| 02/12/2002 | US6346330 Forming gaskets from polyolefin, reactive diluents, fillers and curing to form gaskets |
| 02/07/2002 | US20020016438 From a tetracarboxylic dianhydride and a diaminosiloxane containing little cyclic siloxane oligomer; good adhesiveness and reliability, for electronis and semiconductors |
| 02/07/2002 | US20020016411 Epoxy resin comprising reactive silicon group- containing polyoxyalkylene polymer with a copolymer having alkyl acrylate monomers, and curing agent; peel strength |
| 02/07/2002 | US20020016398 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 02/07/2002 | US20020015893 Gel electrolyte solution of a crosslinked polymer |
| 02/07/2002 | US20020014706 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 02/06/2002 | EP1177230A1 Polyolefin compositions, method for the production and use thereof |
| 02/06/2002 | CN1334840A Halogen-contg. vinyl polymer resins and processes for preparation thereof |
| 02/06/2002 | CN1334303A Adhesive tape for electronic component |
| 02/06/2002 | CN1334293A 光敏性热固树脂组合物 Photosensitive thermosetting resin composition |
| 02/06/2002 | CN1334292A Epoxy resin composition for packaging semiconductor and resin packaged semiconductor device |
| 02/06/2002 | CN1334291A Epoxy resin composition, laminated material and metal lamina laminate |
| 02/06/2002 | CN1078905C Adhesive resin composition and laminate thereof and production process of laminate |
| 02/06/2002 | CN1078904C Powder coating hardener |
| 02/06/2002 | CN1078903C 粉末涂料 Powder Coatings |
| 02/05/2002 | US6344526 Fluorine-containing epoxy resin composition, and surface modification process, ink jet recording head and ink jet recording apparatus using same |
| 02/05/2002 | US6344157 Polymeric resin, conductive filler, 8-hydroxyquinoline corrosion inhibitor |
| 02/05/2002 | US6344152 Such as isophoronediamine, diaminocyclopentane, and diaminocyclohexane |
| 02/05/2002 | CA2058364C Thermosetting coating composition and coated article |
| 01/31/2002 | WO2002008338A1 Insulating resin composition for multilayer printed wiring boards, multilayer printed wiring boards made by using the composition and process for the production thereof |
| 01/31/2002 | WO2001070867A3 Flame retardant epoxy molding compositions |