| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 06/23/2004 | EP1362489A4 Wireless local loop antenna |
| 06/23/2004 | EP1155084B1 Sound deadening and structural reinforcement compositions and methods of using the same |
| 06/23/2004 | EP0978541B1 Polymer mixture useful for the production of an anti-sticking agent and a heat sensitive transfer recording film |
| 06/23/2004 | CN1507463A Moulding composition for producing bipolar plates |
| 06/23/2004 | CN1506403A Insulating epoxy resin material containing N-aniline as curing agent |
| 06/17/2004 | WO2004032197A3 Low temperature texturing layer to enhance adhesion of subsequent layers |
| 06/17/2004 | WO2003059999A3 Epoxy resin component containing a cationic methine dye |
| 06/17/2004 | US20040115437 Dual cure reaction products of self-photoinitiating multifunction acrylates with cycloaliphatic epoxy compounds |
| 06/17/2004 | US20040112531 Positioning adhesive; curing; structural beams |
| 06/16/2004 | EP1427785A1 Radiation curable powder coating compositions |
| 06/16/2004 | CN1505672A Method for adhering substrates using light activatable adhesive film |
| 06/16/2004 | CN1504491A Preparing methods of glycidyl ether group-containing partial condensate of alkoxysilane |
| 06/16/2004 | CN1153815C Thermosetting resinous binder combination, their preparing method and uses as coating materials |
| 06/16/2004 | CN1153806C Latency catalyst and use thereof |
| 06/15/2004 | US6749962 Gel electrolyte solution of a crosslinked polymer |
| 06/15/2004 | US6749939 Mixture of polyepoxides, thermoplastic polyester and curing agents |
| 06/15/2004 | US6749862 Method and composition of disrupting feeding patterns of woodpeckers |
| 06/10/2004 | WO2004048477A1 Thermosetting resin composition |
| 06/10/2004 | WO2004048476A1 Thermosetting resin composition |
| 06/10/2004 | WO2004048470A1 Hardener composition for epoxy resins |
| 06/10/2004 | WO2004048457A1 Curable epoxy compositions, methods and articles made therefrom |
| 06/10/2004 | WO2004048436A1 Flame-retardant epoxy resin composition and cured object obtained therefrom |
| 06/10/2004 | WO2004048434A1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
| 06/10/2004 | US20040110908 comprises aromatic polyester; high glass transition temperature and low dissipation factor; improved solvent solubility; dielectrics; electronics |
| 06/10/2004 | US20040110857 Photo-curable resin composition containing cyclic acetal compound and cured product |
| 06/10/2004 | US20040109949 Latent hardener, manufacturing method for latent hardener, and adhesive |
| 06/10/2004 | CA2507630A1 Flame-retardant epoxy resin composition and cured object obtained therefrom |
| 06/09/2004 | EP1425358A1 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus |
| 06/09/2004 | EP1425330A1 Network polymers comprising epoxy-terminated esters |
| 06/09/2004 | EP1222229B1 Formulation for strippable adhesive and coating films and high performance adhesives |
| 06/09/2004 | EP0932648B1 Epoxy curing agent |
| 06/09/2004 | CN1152931C Powder paints and its preparation and use |
| 06/03/2004 | WO2004046245A1 Improved thermosetting powder |
| 06/03/2004 | US20040106770 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 06/03/2004 | US20040106766 ketimine prepared by reacting a ketone and a polyamine and a main polymer of an epoxy resin and/or a modified silicone having at least two hydrolyzable alkoxysilyl groups |
| 06/03/2004 | US20040106764 clathrate comprising a tetrakisphenol compound; prolonged pot life; improved curability at low temperatures |
| 06/03/2004 | US20040106742 Mixture of polymer and solvent; storage stability; protecitve coating |
| 06/03/2004 | US20040106734 Tensile strength; sutures; tensioning fiber under tension, drawing |
| 06/03/2004 | US20040105990 Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity |
| 06/03/2004 | DE4480670B4 Wäßrige Dispersionszusammensetzung Aqueous dispersion composition |
| 06/03/2004 | DE10255250A1 Polyester-Pulverlacke für Beschichtungen mit mattem Erscheinungsbild Polyester powder coating for coating with matte appearance |
| 06/02/2004 | EP1424376A1 Polyester powder coating compositions with mat appearance |
| 06/02/2004 | EP1117728B1 Aqueous dispersions of epoxy resins and a process to prepare them |
| 06/02/2004 | EP0839166B1 Polymeric composition |
| 06/02/2004 | EP0819723B1 Resin compositions for fiber-reinforced composite materials and processes for producing the same, prepregs, fiber-reinforced composite materials, and honeycomb structures |
| 06/02/2004 | CN1502209A Wireless local loop antenna |
| 06/02/2004 | CN1152089C Producing method of highly wear-resisting solid face material |
| 06/01/2004 | US6743838 Expoxy functionalized ethylene copolymer asphalt reaction products |
| 06/01/2004 | US6743375 Curing at lower temperatures |
| 05/27/2004 | WO2004044054A1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 05/27/2004 | WO2004044053A1 Toughened epoxy/polyanhydride no- flow underfill encapsulant composition |
| 05/27/2004 | US20040102601 Curable resin, curable resin material, curable film, and insulator |
| 05/27/2004 | US20040102545 Aqueous based vinyl acetate based emulsions with epoxy/amine for improved wet adhesion in paints |
| 05/27/2004 | US20040101689 Hardener composition for epoxy resins |
| 05/27/2004 | US20040101688 Curable epoxy compositions, methods and articles made therefrom |
| 05/27/2004 | CA2505396A1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 05/26/2004 | EP1422282A1 COLOR−CHANGING MATERIAL COMPOSITION AND COLOR−CHANGING MEMBRANES MADE BY USING THE SAME |
| 05/26/2004 | EP1422266A1 Thermosetting resin composition |
| 05/26/2004 | EP1034193A4 Phenol-novolacs with improved optical properties |
| 05/26/2004 | CN1151204C High-penetrability water-proof reinforcing carbonyl epoxy material and process for preparing its component |
| 05/26/2004 | CN1151203C Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using same |
| 05/26/2004 | CN1151202C Thermosetting resin composition use in ink stocking method |
| 05/25/2004 | US6740266 Hardened sheet comprising an epoxy resin, and another resin layer formed on one side thereof, wherein the sheet has a retardation of 5 nm or less, an average thickness of 500 mu m or less; smooth surface |
| 05/25/2004 | US6740192 Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane |
| 05/21/2004 | WO2004041904A1 Powder coating compositions containing anhydride end-caped crystalline polyesters |
| 05/21/2004 | WO2004041900A1 Sealing material for liquid crystal and liquid crystal display cell using same |
| 05/21/2004 | WO2004041875A1 Adhesion promoters, film hardeners, and water resistance modifiers for adhesives |
| 05/21/2004 | WO2004041874A1 Adhesion promoters for glass-containing systems |
| 05/21/2004 | CA2504712A1 Powder coating compositions containing anhydride end-caped crystalline polyesters |
| 05/21/2004 | CA2504411A1 Adhesion promoters for glass-containing systems |
| 05/21/2004 | CA2503143A1 Sealing material for liquid crystal and liquid crystal display cell using same |
| 05/20/2004 | US20040094264 Method for adhering substrates using light activatable adhesive film |
| 05/19/2004 | EP1272587B1 Impact-resistant epoxy resin compositions |
| 05/19/2004 | CN1498236A Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same |
| 05/19/2004 | CN1497714A Flame-retarded epoxy composition for packing semiconductor and semiconductor device |
| 05/19/2004 | CN1150244C Epoxy resin compsn. and its laminated product |
| 05/18/2004 | US6737482 Polyether with high vinyl silane terminus conversion and epoxy resin; tensile strength and shear bond strength; adhesion |
| 05/18/2004 | US6737474 Obtained by acetalizing a polyvinyl alcohol with an aldehyde and then modifying the resultant acetalization product with an acid anhydride; useful as electrical insulating materials, adhesives |
| 05/18/2004 | US6736925 Methods of bonding metal surfaces, and components therefor |
| 05/13/2004 | WO2004040375A1 Photocurable compositions with phosphite viscosity stabilizers |
| 05/13/2004 | WO2004039886A2 Flip-chip system and method of making same |
| 05/13/2004 | WO2004039851A2 Fiber dispersant-containing systems |
| 05/13/2004 | WO2003029258A8 Oligomeric, hydroxy-terminated phosphonates |
| 05/13/2004 | US20040092654 Thermally conductive casting compound |
| 05/13/2004 | US20040091726 Thermosetting resin composition and use thereof |
| 05/13/2004 | CA2504387A1 Fiber dispersant-containing systems |
| 05/12/2004 | EP1418206A1 Curable Epoxy Resin Composition |
| 05/12/2004 | EP1254193B1 Reactive particles, curable composition comprising the same and cured products |
| 05/12/2004 | EP1060213B1 Hybrid materials employing ppe/polystyrene/curable epoxy mixtures |
| 05/12/2004 | CN1496381A Highly functional polymers |
| 05/12/2004 | CN1496377A Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 05/12/2004 | CN1149668C Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 05/11/2004 | US6734263 Polymeric material and a process for making the polymeric material. the polymeric material has adhesive and noise abatement properties over a broad temperature range. further, the material is chip and corrosion resistant and provides |
| 05/11/2004 | US6733902 Liquid epoxy resin composition and semiconductor device |
| 05/11/2004 | US6733901 Grinding a premix of an epoxy resin, a phenolic resin, a curing accelerator and an inorganic filler to obtain a specific particle size distribution and melt-kneading the ground material under a reduced pressure. |
| 05/06/2004 | WO2004037935A1 Aqueous non-ionic stabilised epoxide resins |
| 05/06/2004 | WO2004037878A2 Co-curable compositions |
| 05/06/2004 | WO2004037509A1 Sealing material |
| 05/06/2004 | US20040087736 Powder coating compositions containing anhydride end-capped crystalline polyesters |
| 05/06/2004 | US20040087687 Photocurable compositions with phosphite viscosity stabilizers |