| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 10/15/2003 | EP1352027A2 Curing agent for epoxy resins and epoxy resin composition |
| 10/15/2003 | EP1352026A1 Filled epoxy resin system having high mechanical strength values |
| 10/15/2003 | EP1352008A2 Epoxy resin composition for semiconductor encapsulation |
| 10/15/2003 | EP1351759A1 Dispersing agent |
| 10/15/2003 | CN1449429A Aromatic polycarbonate resin composition and moldings |
| 10/15/2003 | CN1449427A Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board |
| 10/14/2003 | US6632892 For encapsulating a solid state device, such as a light emitting diode |
| 10/14/2003 | US6632881 Superior moisture-resistant adhesion and low-stress properties |
| 10/14/2003 | US6632523 Polyimidesiloxane made from a dianhydride, an aromatic diamine and a siloxanediamine, an epoxy resin, and a cyanate; tape |
| 10/09/2003 | WO2003083901A2 Novel polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same |
| 10/09/2003 | WO2003082996A2 Coating composition less susceptible to surface defects |
| 10/09/2003 | WO2003082978A1 Cold curable resin composition, curing method of the resin composition and cured product of the resin composition |
| 10/09/2003 | WO2003082977A1 Resin containing dielectric filler for formation of built-in capacitor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate |
| 10/09/2003 | WO2003082955A1 Polyarylene sulfide resin and sealing agent for electronic parts |
| 10/09/2003 | WO2003082947A1 Thermosetting resin composition and adhesive films |
| 10/09/2003 | US20030191218 A multifunctional hindered phenolic stabilizer as a viscosity modifier added to curable diglycidyl ethers of bisphenol A, a particulate flame retardant and an adhesion promoter; penetration; shear overlap; protective coatings |
| 10/08/2003 | CN1446847A Resin compsn. and adhering thin film made by same |
| 10/07/2003 | US6630745 An epoxy resin, a phenolic resin curing agent, a molybdenum compound, an organopolysiloxane, an organopolysiloxane cured product, or a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an |
| 10/02/2003 | WO2003080731A2 Compatibilized polyester/polyamide blends |
| 10/02/2003 | US20030187154 Corrosion and aging resistance; hot melt adhesive |
| 10/02/2003 | US20030187145 Aqueous film forming solution |
| 10/02/2003 | US20030187107 Epoxy resin composition and semiconductor device |
| 10/02/2003 | US20030187099 Filling three-dimensional cavities; curable epoxy resin |
| 10/02/2003 | US20030186010 For use in a transport pipe for a fuel cell system, a cooling liquid-transport pipe for a super computer, membrane cleaning liquid-transport pipe for an analytical instrument, and a chip or wafer cleaning liquid-transport pipe |
| 10/01/2003 | EP1348742A2 Coating powders, methods of manufacture thereof, and articles formed therefrom |
| 10/01/2003 | EP1348733A1 Rubber composition and low-contaminative hose produced by using the same |
| 10/01/2003 | EP1347954A2 Methyl propyl ketone peroxide formulations and their use for curing unsaturated polyesters |
| 10/01/2003 | EP1095087B1 Self-dispersing hardenable epoxy resins |
| 10/01/2003 | EP0707610B1 Self-dispersing curable epoxy resins and coatings |
| 10/01/2003 | EP0703931B1 Vibration damping constructions using thermally polymerized epoxides |
| 09/30/2003 | US6627690 Brominated epoxy compound, brominated polyacrylate, and antimony trioxide |
| 09/30/2003 | US6627684 Comprising an epoxy resins with two or more epoxy groups, an aromatic diamine curing agent containing asymmetric chemical structures with different reactivity and an inorganic powder; printed circuits; controlling the thickness; workability |
| 09/30/2003 | US6627683 Curing cyclic hydrocarbon including oxirane or thiirane moiety joined by (thio)ester by exposure to heat and decomposition; polyepoxides and polythioepoxides |
| 09/30/2003 | US6627328 Naphthalene epoxide, curing agent, activator and silica-titania filler; sealing material for optical semiconductor; cured products having high transparency at various temperatures |
| 09/28/2003 | CA2423214A1 Coating powders, methods of manufacture thereof, and articles formed therefrom |
| 09/25/2003 | WO2003078494A1 Curable resins and curable resin compositions containing the same |
| 09/25/2003 | WO2003078163A1 Epoxy adhesive having improved impact resistance |
| 09/24/2003 | EP1346101A2 Method and composition for cutting dry fabric |
| 09/24/2003 | EP1345984A2 Method for making biodegradable polyhydroxyalkanoate copolymers having improved crystallization properties |
| 09/24/2003 | EP1099138B1 Stereolithographic compositions for preparing polyethylene-like articles |
| 09/24/2003 | EP0843685B1 Ionizing radiation curing of epoxy resin systems incorporating cationic photoinitiators |
| 09/24/2003 | CN1443805A Filling material composition for printing distributing board |
| 09/24/2003 | CN1443804A Phosphorus-containing flame retardant epoxy resin and its composition |
| 09/23/2003 | US6624260 Rubber-modified epoxy resin composition |
| 09/23/2003 | US6624216 Contains an epoxy resin, a fluxing agent, a linear polyanhydride and a catalyst; to protect and reinforce interconnections between an electronic component and a substrate in a microelectronic device |
| 09/23/2003 | US6623558 Epoxy resin and a moisture-curing type curing agent; applied to the surface of a tendon used in a post-tensioning system for prestressed concrete |
| 09/18/2003 | WO2003076536A1 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 09/18/2003 | WO2003076515A1 Thermosetting resin composition and laminates and circuit board substrates made by using the same |
| 09/18/2003 | WO2003076499A1 Continuous filament mat binder system |
| 09/18/2003 | WO2003076491A1 Accelerators for cationic photopolymerization |
| 09/18/2003 | US20030176627 Curing agents comprising the reaction products of carboxylic acid, triethylenetetraamine and/or polyamines used for curing epoxy resins |
| 09/18/2003 | US20030176599 Using an encapsulant-forming thermosetting resin (an epoxy resin) and an anhydride as crosslinker for the resin, crosslinks with resin that acts as a fluxing agent for soldering |
| 09/18/2003 | US20030176598 Thermosetting resin composition |
| 09/18/2003 | US20030176525 For use in composite molding material, adhesives, coating material; curability |
| 09/18/2003 | US20030176519 Accelerators for cationic photopolymerizations |
| 09/18/2003 | US20030175521 Encapsulant with fluxing properties and method of use in flip-chip surface mount reflow soldering |
| 09/18/2003 | US20030175045 Electroconductive member and image forming apparatus using the same |
| 09/18/2003 | US20030173546 100 parts by mass of an aromatic polycarbonate resin and from 0. 001 to 1 part by mass of an additional thermoplastic resin that differs from the aromatic polycarbonate in the refractive index; optical waveguide |
| 09/18/2003 | CA2477135A1 Accelerators for cationic photopolymerization |
| 09/17/2003 | CN1442685A Image method for measuring engineering embedding material |
| 09/17/2003 | CN1121447C Hydrophobic epoxide resin system, its cross-linked product and use |
| 09/16/2003 | US6621154 Semiconductor apparatus having stress cushioning layer |
| 09/16/2003 | US6620512 Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
| 09/16/2003 | US6620510 Resin has a water absorption rate of no greater than 3.5% by weight |
| 09/16/2003 | US6618933 Resistance to heat and humidity, producing virtually no voluminal expansion even under the conditions of high temperature and high humidity |
| 09/12/2003 | WO2003075339A1 B-stageable underfill encapsulant and method for its application |
| 09/11/2003 | US20030171498 Heat and chemical resistance; weatherproofing |
| 09/11/2003 | US20030171497 Crosslinked blend; electrodeposition |
| 09/11/2003 | US20030168652 Light emitting apparatus |
| 09/10/2003 | EP1342758A2 Multi-layer electrodeposition coating film-forming method and coating product formed by the same |
| 09/10/2003 | EP1342025A1 Form-in-place gasket for electronic applications |
| 09/10/2003 | EP1341847A1 Thermally conductive casting compound |
| 09/10/2003 | CN1441830A Thermoset materials with improved impact resistance |
| 09/09/2003 | US6617701 Epoxy resin composition to seal semiconductors and resin-sealed semiconductor device |
| 09/09/2003 | US6617400 Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst |
| 09/09/2003 | US6617048 Coated with a polyester from cyclohexanedimethanol cured with a melamine resin and, optionally, a blocked isocyanate |
| 09/09/2003 | US6617029 Nitrogen-containing flame retarding epoxy resin and an epoxy resin composition containing the same |
| 09/09/2003 | US6617028 Phosphorus and nitrogen containing resin hardener and a flame retarding resin composition containing said hardener |
| 09/09/2003 | US6616976 Contacting metal surface with adhesion promotion formulation to form a micro-roughened conversion coated metal surface; contacting micro-roughened conversion coated metal surface with epoxy resin to prepare for receiving polymer |
| 09/04/2003 | WO2003072677A1 Sealing method |
| 09/04/2003 | WO2003072656A1 Silicone resin composition, curable resin composition, and cured resin |
| 09/04/2003 | WO2001014470A9 Process for producing tyres, tyres thus obtained and elastomeric compositions used therein |
| 09/04/2003 | US20030166827 Cladding resin composition |
| 09/04/2003 | US20030166796 Epoxy resin composition and cured object obtained therefrom |
| 09/04/2003 | US20030166787 Powder coating compositions having improved mar and acid resistance |
| 09/04/2003 | US20030166750 Photographic binder; polyvinyl acetal |
| 09/04/2003 | US20030166747 Casting compound based on thermosetting epoxy resins |
| 09/04/2003 | US20030166746 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders |
| 09/04/2003 | US20030165688 Mixture of polyepoxides, thermoplastic polyester and curing agents |
| 09/04/2003 | US20030165687 Cationic paint composition |
| 09/04/2003 | US20030164555 B-stageable underfill encapsulant and method for its application |
| 09/03/2003 | EP1341039A1 Photocurable and thermosetting resin composition |
| 09/03/2003 | EP1340794A2 Thermoplastic resin compositions and their injection moldings |
| 09/03/2003 | EP1339524A1 Fluxing underfill compositions |
| 09/03/2003 | EP1155074B1 Polyetherimide resin/polyester resin blends having improved properties |
| 09/03/2003 | EP1117729B1 Flowable granulates |
| 09/03/2003 | CN1120204C Flame retardant resin composition and laminate using the same |
| 09/02/2003 | US6613839 Polyepoxide, catalyst/cure inhibitor complex and anhydride |
| 08/28/2003 | WO2003070850A1 Two-pack type adhesive |
| 08/28/2003 | WO2003070826A2 Powder coating compositions having improved mar and acid resistance |