Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
08/2003
08/28/2003WO2003070798A1 Resin composition and optical elements
08/28/2003WO2003070781A1 Thermosetting compositions containing alternating copolymers of isobutylene type monomers
08/28/2003US20030162935 Halogen-free
08/28/2003US20030162911 No flow underfill composition
08/28/2003US20030162898 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards
08/28/2003US20030162884 Fiber-treating agent, glass fiber and rubber product both made with the fiber treating agent
08/28/2003US20030162049 Laminate and process for producing a laminate of this type
08/28/2003CA2476079A1 Powder coating compositions having improved mar and acid resistance
08/27/2003EP1338624A1 Liquid thermosetting resin composition, printed wiring boards and process for their production
08/27/2003EP1337585A1 Silicone-modified single-component sealing compound
08/27/2003EP0843509B1 Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil
08/27/2003CN1439038A Epoxyresin composition and cured object obtained therefrom
08/27/2003CN1439015A Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins make by using the derivatives, flame-retardant resin compositions, sealing media and
08/27/2003CN1119245C Inkjet print head containing radiation curable resin layer
08/27/2003CN1119221C Rotary trowel for use in the molding of ceramics and method for production thereof
08/26/2003US6610406 Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony
08/26/2003US6610236 Compounding a polymer or a compound having a perfluoroalkyl group in the thermoplastic or thermosetting resin, and molding the resin, and a method for producing such a molded article
08/26/2003CA2086719C Heimd-containing polyetheramine curative for flexible, toughened products
08/21/2003WO2003068876A1 Coating composition for protecting dazzling effect
08/21/2003WO2003068870A1 Coating compositions and method of forming coating film
08/21/2003WO2003068862A1 Polyester resin compositions for profile extrusion and profiles made therefrom
08/21/2003WO2003068841A1 Resin composition
08/21/2003WO2003068837A1 Indole resins, epoxy resins and resin compositions containing the same
08/21/2003US20030158350 Polyimide resin, epoxy resin-curing catalyst, and an epoxy resin
08/21/2003US20030158338 Aqueous adhesive compositions for bonding elastomers
08/21/2003US20030158337 Thermosetting resin composition for high performance laminates
08/21/2003US20030158289 Barcol hardness, measured using a GYZJ-935 meter, of at least 10 within 30 minutes following initiation of polymerization
08/21/2003US20030158286 Active energy beam-curable composition
08/21/2003US20030155664 Liquid epoxy resin composition and semiconductor device
08/21/2003US20030155556 Rigid, hardness adhesive; reliable adhesive; connecting semiconductor chips; heat resistance, waterproofing
08/20/2003EP1336642A1 Self-healing potting compositions for the production of electrical isolations
08/20/2003EP1336640A2 Thermoplastic resin composition
08/20/2003CN1437632A Reactive particles, curable composition comprising the same and cured products
08/20/2003CN1436810A Synthetic resin applied as dielectric material in high-density printed circuti board
08/20/2003CN1436779A Cyclic disulfide, producing process thereof and optical products containing the same
08/20/2003CN1118508C Organic silicon/modified epoxy resin packing material containing nano silicon-base oxide and its application
08/19/2003US6608161 Carboxylic acid catalysts comprising maleic acid, dihydroxyfumaric acid, acetylenedicarboxylic acid, 2,6-dihydroxybenzoic acid, salicylic acid, maleic anhydride, citraconic anhydride or chloromaleic anhydride
08/19/2003US6608126 A reaction product obtained by combining an amine functional silicone, an epoxy functional silicone and water; useful in personal care for preparing various skin, hair, and underarm products
08/19/2003CA2121305C Stabilized polyvinyl chloride
08/14/2003WO2003066737A1 Elastomer-modified epoxy siloxane compositions
08/14/2003WO2003066704A1 Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications
08/14/2003US20030153683 Co-crosslinking agent is brominated bisphenol A, or brominated bisphenol A diglycidyl ether; use as laminates for electronics and printed wiring boards
08/14/2003US20030153682 A hydrosilation curied copolymer contains epoxy resin and a polysiloxane which has hydroxy groups attachment for promoting hydrolysis with water; protective coatings for floor, impact resistance, flexibility, noncracking, nonabrasive
08/14/2003US20030153665 Heat conductive mold and manufacturing method thereof
08/14/2003US20030153650 Epoxy resin composition and electronic part
08/14/2003US20030153640 Binders comprising mixtures of polyesters, acrylic co/polymers and curing agents, used for paints or varnishes
08/14/2003US20030152777 Semiconductor encapsulating flame retardant epoxy resin composition and semiconductor device
08/14/2003US20030152776 Flame-retardant epoxy resin composition and laminate made with the same
08/14/2003CA2474221A1 Elastomer-modified epoxy siloxane compositions
08/13/2003EP1334974A1 Cyclic disulfide compound, process of producing the same and optical product comprising the same
08/13/2003EP1334161A1 Structural hot melt material and methods
08/13/2003EP1055690B1 Process for producing modified phenolic resin
08/13/2003EP0787348B1 Epoxy resin casting composition
08/13/2003CN1435448A Thermosetting polyimide resin composition and method for producing polyimide resin
08/13/2003CN1435444A Cast composite based on thermosetting epoxy resin
08/13/2003CN1435443A Water adhesive composition for adhering elastomer
08/12/2003US6605355 Semiconductor connections
08/12/2003US6605353 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming
08/12/2003CA2280884C Thermoplastic compounds comprising a cross-linked phase
08/07/2003WO2003065447A2 No-flow underfill encapsulant
08/07/2003WO2003064531A1 High strength bioresorbables containing poly-glycolic acid
08/07/2003WO2003064530A1 Transparent composite composition
08/07/2003WO2003064529A1 Barrier layer made of a curable resin containing polymeric polyol
08/07/2003WO2003064493A1 No flow underfill composition
08/07/2003WO2003063572A2 Thermoset materials with improved impact strength
08/07/2003US20030149222 Polyimide resin produced by reacting a prepolymer with an isocyanate group at the end obtained by reacting a polyisocyanate compound with a polyol compound having a linear hydrocarbon structure with an anhydride
08/07/2003US20030149220 Epoxy resin hardener compositions
08/07/2003US20030149193 Powder coating; to producing coatings having a high crosslinking density and a high level of stability towards weathering and ultraviolet radiation
08/07/2003US20030149135 No-flow underfill encapsulant
08/07/2003US20030149124 Radiation curable resin composition for making colored three dimensional objects
08/07/2003US20030148107 Halogen-free nonflammable epoxy resin composition, halogen-free nonfammable epoxy resin composition for build-up type multi-layer board, prepreg, copper-clad laminate, printed wiring board, copper foil-attached resin film, carrier-attached resin film, build-up type laminate, and build-up type multi-layer board
08/07/2003US20030146421 Addition-condensation copolymer containing aromatic polyethers
08/07/2003US20030146266 Conductive adhesive material with metallurgically-bonded conductive particles
08/07/2003US20030145949 Mixture of epoxy resin and glycidyl(meth)acrylate polymer
08/07/2003CA2472965A1 Transparent composite composition
08/06/2003EP1333079A1 Conductive adhesive material with metallurgically-bonded conductive particles
08/06/2003EP1333061A1 Thermosetting polymide resin composition and process for producing polymide resin
08/06/2003EP1333057A2 Aqueous adhesive compositions for bonding elastomers
08/06/2003EP0885704B1 Carbon fiber prepreg and method of production thereof
08/05/2003US6602936 Resin containing a polyepoxide and a polyisocyanate and atomized aluminum powder
08/05/2003US6602651 Water-based solder resist composition
08/05/2003US6602602 Prepared by suspension polymerization; chromatographic columns; narrow particle size distribution
07/2003
07/31/2003US20030144430 Printed circuits; high density; heat and solvent resistance
07/31/2003US20030144416 Chain extender, a catalyst, a reactive epoxy resin, and a polymeric toughner forms a thermally curable structural adhesive
07/31/2003US20030144414 Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof
07/31/2003US20030144381 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors
07/31/2003US20030143797 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
07/30/2003EP1331244A1 Epoxy resin composition and its use
07/30/2003EP1331234A1 Potting composition based on duroplastic epoxid resin
07/30/2003CN1116479C Technology for making high density epoxy resin scraper
07/30/2003CA2416665A1 Aqueous adhesive compositions for bonding elastomers
07/24/2003WO2003059999A2 Epoxy resin component containing a cationic methine dye
07/24/2003US20030139559 One-part, room temperature moisture curable resin composition
07/24/2003US20030139506 Powdered epoxy composition
07/24/2003US20030138634 Curable polyester from alicyclic polybasic acid and polyhydric alcohola and a vinyl polymer with epoxy and hydroxy groups with universal hardness of </= 500 N/mm2
07/23/2003EP1328570A2 Crosslinked polyamide
07/23/2003EP0735118B1 Powder coating resin composition
07/23/2003CN1432047A Epoxy resin compsn. and semiconductor device
07/23/2003CN1432040A Epoxy-resin systems, which are resistant to ageing, moulding materials and components produced therefrom and use thereof
07/22/2003US6596813 Composition of epoxy resin, phenolic resin, butadiene particles and amino silicone oil
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