| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 05/06/2004 | US20040087685 Mixtures of thermoplastic resins, binders, thickeners, curing agents and water, used as impregnation varnishes for electronics |
| 05/06/2004 | US20040087681 Toughened epoxy-anhydride no-flow underfill encapsulant |
| 05/06/2004 | US20040086720 Latent catalysts for epoxy curing systems |
| 05/06/2004 | US20040084687 Wavelength-converting casting composition and white light-emitting semiconductor component |
| 05/06/2004 | EP1416007A1 Epoxy resin composition |
| 05/06/2004 | EP1416003A1 RESIN COMPOSITION, COMPOSITION FOR SOLDER RESIST, AND CURED ARTICLE OBTAINED THEREFROM |
| 05/06/2004 | EP1414919A2 Unsaturated powder coating compositions |
| 05/06/2004 | EP1414902A1 Epoxy resin |
| 05/06/2004 | EP1414895A1 Flame retardant molding compositions |
| 05/06/2004 | DE69432839T2 Epoxydharz und Polyesterharz enthaltende heissschmelzbare Zusammensetzungen Epoxy resin and polyester resin containing hot melt compositions |
| 05/05/2004 | CN1494559A Organic compositions |
| 05/05/2004 | CN1493610A Modified dimaleimide resin and its preparation method and application in cladding copper plate |
| 05/04/2004 | US6730942 Light emitting apparatus |
| 05/04/2004 | US6730402 Mixture of epoxy resin, phenolic resin curing agents and metal hydroxide |
| 04/29/2004 | US20040082734 Impact strength, toughness |
| 04/29/2004 | US20040082720 Seals, coatings, adhesives, composites; chemical resistance, toughness, electrical resistance |
| 04/29/2004 | US20040082107 Flip-chip system and method of making same |
| 04/28/2004 | EP1412445A1 Polysilazane-modified polyamine hardeners for epoxy resins |
| 04/28/2004 | EP1412409A1 Curable compositions for display devices |
| 04/28/2004 | EP1102803B1 Hardener for epoxy resins |
| 04/28/2004 | CN1492221A Self diagnostic intellgient structure of fiber reinforced resin base composite material and method for self diagnosis |
| 04/28/2004 | CN1491985A Flow induced vibration model material of hydraulic gate |
| 04/28/2004 | CN1147929C Epoxy resin sealing material for molding semiconductor chip and method for manufacturing the same |
| 04/27/2004 | US6728502 Electroconductive member and image forming apparatus using the same |
| 04/27/2004 | US6727325 Composition of epoxy resin and clathrate of tetrakisphenol and epoxy-reactive curing compound |
| 04/27/2004 | US6727043 Solid imaging compositions for preparing polyethylene-like articles |
| 04/22/2004 | US20040077791 Maintains elasticity |
| 04/22/2004 | US20040076805 Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| 04/22/2004 | US20040075802 Sealant for liquid crystal display cell, composition for liquid crystal display cell sealant and liquid crystal display element |
| 04/22/2004 | US20040074598 Which comprises applying a curable composition comprising at least one polymer or resin selected from the group consisting of (A) a reactive silyl group-containing polyoxyalkylene polymer, (B) a reactive silyl group-containing saturated |
| 04/21/2004 | EP1409590A1 Epoxy functionalized ethylene copolymer asphalt reaction products |
| 04/21/2004 | EP1409588A2 Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
| 04/21/2004 | EP1355984A4 Novel epoxy hardeners for improved properties, processing and handling |
| 04/21/2004 | EP1270668B1 Epoxy resin composition and electronic part |
| 04/21/2004 | CN1491245A Liquid epoxy resin emulsions, method for production and use thereof |
| 04/21/2004 | CN1490355A Polyelectrolyte composition |
| 04/21/2004 | CN1490318A Oxynitride helerocyclic compounds and preparation thereof |
| 04/20/2004 | US6723802 Epoxy resin and polyglycoside based polymers and process for the preparation thereof |
| 04/20/2004 | US6723801 Polyphenol resin, process for its production, epoxy resin composition and its use |
| 04/20/2004 | US6723452 Cured epoxy resin provides solder crack resistance on use of lead-free solder and improved flame retardance |
| 04/20/2004 | US6723432 Can be cured and bonded to a current collector; adhesion and chemical resistance; for use in manufacture of lithium batteries and electrical double-layer capacitors of various shapes |
| 04/15/2004 | WO2004032197A2 Low temperature texturing layer to enhance adhesion of subsequent layers |
| 04/15/2004 | WO2004031500A1 Leak tight joint and method, and levelling polymer for providing a smooth surface on a concrete body being jointed |
| 04/15/2004 | WO2004031257A1 Epoxy resin composition for sealing optical semiconductor |
| 04/15/2004 | US20040072968 Mixture of epoxy resins, curing agents, filler and phosphazene compound |
| 04/15/2004 | US20040072927 Two-part epoxy adhesives with improved flexibility and process for making and using same |
| 04/15/2004 | US20040069405 Blend of epoxy resin and an internally flexibilized epoxy resin; hardener mixture of a flexibilizer and an aliphatic amine and/or a polyamide; tensile elongation at room temperature of greater than 30%. |
| 04/14/2004 | EP1408095A1 Free radical cured coating powders for low gloss powder coatings |
| 04/14/2004 | EP1408087A1 Epoxy-polysiloxane resin compositions, solid state devices encapsulated therewith and method |
| 04/14/2004 | EP1408084A2 Epoxy resin compositions for the manufacture of void-free laminates |
| 04/14/2004 | EP1408083A1 Curable epoxy resin composition |
| 04/14/2004 | EP1406960A1 Adhesion promoter for plastisols |
| 04/14/2004 | EP1114078B1 Thermoplastic copolyester compositions modified with epoxide compounds |
| 04/14/2004 | CN1489594A Basic silane coupting ageut0organic carboxylic acid salt composition, process for preparing said composition and epoxy resin compositions containing same |
| 04/14/2004 | CN1488672A Halogen-free flame-retarding epoxy resin composition containing phosphor and nitrogen and preimpregnated material and laminate containing same |
| 04/14/2004 | CN1488663A Polymer cladding layer material of isocyarate crosslinked epoxy resin for integrated optical device |
| 04/14/2004 | CA2444382A1 Two-part epoxy adhesives with improved flexibility and process for making and using same |
| 04/13/2004 | US6720370 Polycarbonate composition and injection molding made thereof |
| 04/13/2004 | US6720077 Resin composition, and use and method for preparing the same |
| 04/08/2004 | WO2004029154A1 Flame-retardant polybutylene terephthalate resin composition and moldings |
| 04/08/2004 | WO2004029127A1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 04/08/2004 | US20040068027 Free radical cured coating powders for smooth, low gloss powder coatings |
| 04/08/2004 | US20040067440 Actinic energy ray-curable resin, photocurable and thermosetting resin composition containing the same, and cured products thereof |
| 04/08/2004 | US20040067366 Epoxy resin compositions, solid state devices encapsulated therewith and method |
| 04/08/2004 | US20040067304 Blend of a free radical curable resin, a cationic curable resin, a free radical photoinitiator and a cationic photoinitiator |
| 04/08/2004 | CA2444305A1 Free radical cured coating powders for smooth, low gloss finish powder coatings |
| 04/07/2004 | EP1405879A1 Flame retardant polyethylene terephthalate resin composition |
| 04/07/2004 | EP1405715A1 Method of making a sheet of building material |
| 04/07/2004 | EP0851894B1 Semi-interpenetrating polymer networks of epoxy and polyolefin resins, methods therefor, and uses thereof |
| 04/07/2004 | CN1487963A Epoxy resin composition for semiconductor encapsulation |
| 04/07/2004 | CN1487852A 分散剂 Dispersant |
| 04/07/2004 | CN1144831C Electronic circuit device comprising epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 04/07/2004 | CN1144830C Viscosity modifier for thermosetting resin composition |
| 04/06/2004 | US6716892 Urethane oligomer, resin compositions thereof, and cured article thereof |
| 04/06/2004 | US6716767 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 04/06/2004 | US6716530 Resin compound for fabricating interlayer dielectric of printed wiring board, resin sheet and resin applied-copper foil for forming insulation layer using the resin compound, and copper-clad laminate using them |
| 04/06/2004 | US6716377 Use of plastic foams containing swellable fillers for sealing wall channels |
| 04/06/2004 | CA2084620C Curable binder and process for its preparation |
| 04/02/2004 | CA2444117A1 Method of making a sheet of building material |
| 04/01/2004 | WO2004026984A1 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 04/01/2004 | WO2004026574A1 Method of producing laminates, and laminates |
| 04/01/2004 | WO2003022953A8 Structural hot melt material and methods |
| 04/01/2004 | US20040063901 Water dispersible epoxy resins |
| 04/01/2004 | US20040063896 Resin compositions for press-cured mica tapes for high voltage insulation |
| 04/01/2004 | US20040063828 Dispersing agent |
| 04/01/2004 | US20040063030 Photoresist |
| 04/01/2004 | US20040063026 Dry film photoresist |
| 03/31/2004 | EP1403948A2 Electrolyte compositions |
| 03/31/2004 | EP1403708A2 Photoresist |
| 03/31/2004 | EP1401984A1 Ultraviolet activatable adhesive film |
| 03/31/2004 | EP0826017B1 Curable resin sols |
| 03/31/2004 | CN1485370A Thermosetting resin composition, epoxy resin moulding material and semiconductor device |
| 03/30/2004 | US6713589 Phenyl, naphthly or fluorene cyclopentyl epoxy resins |
| 03/30/2004 | US6713571 Epoxy resin, a hardener and a hardening accelerator are melt mixed together followed by regulating viscosity at a given temperature |
| 03/25/2004 | WO2004024843A1 Adhesive composition and glass plate with thermoplastic elastomer molding |
| 03/25/2004 | WO2004024811A2 Nanocomposite, method for production and use thereof |
| 03/25/2004 | WO2003104284A3 Epoxide-type formaldehyde free insulation binder |
| 03/25/2004 | WO2003083901A3 Novel polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same |
| 03/25/2004 | WO2003065447A3 No-flow underfill encapsulant |
| 03/25/2004 | US20040059047 Blending polylactones in solvents, then heating and cooling, or evaporating the solvents to form blends used as films, fibers or nonwoven fabrics |