Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
05/2003
05/30/2003WO2003044089A1 Thermosetting resin compositions useful as underfill sealants
05/30/2003WO2003044074A1 Process for the alkoxylation of organic compounds
05/30/2003WO2003044073A1 Process for the polymerisation of epoxy resins
05/30/2003CA2467488A1 Process for the polymerisation of epoxy resins
05/29/2003US20030100649 Autodepositable adhesive
05/29/2003US20030099839 Free of halogen and diantimony trioxide; useful as an encapsulating material in the semiconductor industry
05/29/2003US20030099824 For producing coatings with high hardness, scratch resistance, abrasion resistance, low curling properties, adhesion, and chemical resistance
05/29/2003US20030097963 Stabilizer system for polymer components of displays
05/28/2003EP1314749A2 Polyester elastomers, processes for preparing the same, and compositions of the same
05/28/2003EP1314748A2 Curable resin compositions
05/28/2003EP1314197A1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same
05/28/2003EP1141104B1 Heat debondable adhesive composition and adhesion structure
05/28/2003CN1109702C Epoxy resin compn. for printed wiring board and laminated board produced with use of same
05/27/2003US6570029 No-flow reworkable epoxy underfills for flip-chip applications
05/27/2003US6569959 Modified phenolic hydroxyl-containing resin by reacting epoxy resin with difunctional phenol
05/27/2003US6569953 Phenolic resin polyols and polymers derived from the polyols
05/27/2003US6569926 Polymer compound with improved gloss properties
05/27/2003US6569532 With porous silica inorganic filler and curing agent; readily moldable, low moisture permeability and reliability in the cured state
05/27/2003US6569491 Dielectric coating for a circuit board which is adherent to electroless copper; an epoxy dielectric including a solubilized polybutadiene or polyisoprene agent for promoting adhesion
05/27/2003CA2083058C Post-extended anionic polyurethane dispersion
05/22/2003WO2003042298A1 Modified epoxy resins
05/22/2003WO2003042291A1 Halogen-free phosphorous- and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof
05/22/2003US20030096133 Improving the bonding strength between two components of a structure by pre-coating a surface with polysaccharide, curing, then applying an adhesive
05/22/2003US20030094738 Mixture of photocationic polymerizable substance and a photocationic polymerization initiator contains an oxetane such as 3- ethyl-3-hydroxymethyloxetane to suppress of odor and cloudiness even when heated
05/22/2003US20030094719 Adjusting a moderate pH range of polysaccharide to activate; cross- linking with poly-functional epoxy compound and producing different shapes of the product
05/21/2003EP1312646A1 Aromatic polycarbonate resin composition and moldings
05/21/2003EP1312638A1 Halogen-free phosphorous-and nitrogen-containing flame-resistant epoxy resin compositions, and prepregs derived from thereof
05/21/2003CN1418921A Process for producing thermo-hardened resin varnish
05/20/2003US6566423 Mixtures comprising epoxide compounds and their use
05/20/2003US6566414 Using radiating microwave for heating and curing epoxy resin and curing agent formulation
05/20/2003US6565935 Polymer concrete structures
05/15/2003WO2003041465A1 Photoimageable dielectric material for circuit protection
05/15/2003WO2003041464A2 Improved epoxy formulation adapted to be used in conjunction with no-lead solder in electronic components
05/15/2003WO2003040217A1 Insulating material for sound waves
05/15/2003WO2003040203A1 Curable composition excellent in optical characteristics
05/15/2003US20030092812 Copolymer of n-vinylacrylamide and unsaturated acid
05/15/2003US20030092777 Multi-component, on site foaming system and its use
05/15/2003US20030091844 Crosslinked elastic polymer in a photo- or thermally-polymerizable resin
05/14/2003EP1310525A1 Copper foil with resin and printed wiring boards made by using the same
05/14/2003EP1012200B1 Epoxy resin compositions
05/14/2003EP0970133B1 Chemical compositions
05/14/2003CN1418242A 热塑性树脂组合物 The thermoplastic resin composition
05/14/2003CN1417246A In-situ and inclusion polymerization process of preparing composite particle/epoxy resin nano material
05/14/2003CN1108343C Polysiloxane modified epoxy resin composition
05/13/2003US6562884 Epoxy resin compositions having a long shelf life
05/13/2003US6562482 Liquid potting composition
05/08/2003WO2003038887A1 Contact planarization materials that generate no volatile byproducts or residue during curing
05/08/2003WO2003037965A1 Sliding member and pump
05/08/2003WO2003037953A1 Resin composition
05/08/2003WO2003024985A3 Epoxy resin and polyglycoside based polymers and process for the preparation thereof
05/08/2003US20030088036 Toughened thermosetting resins and preparation of the same
05/08/2003US20030088026 Thermoplastic resin composition
05/08/2003US20030088025 Resin composition, molding material, and molded object
05/08/2003US20030087997 Alloy of asphalt and ethylene-epoxide (especially glycidyl methacrylate) optionally containing acrylate units or grafted with maleic anhydride
05/08/2003US20030087992 Containing a curing agent, a curing accelerator and an inorganic filler that has a particle size of a maximum particle diameter of not more than 10 mu m and a mean particle diameter of not more than 3 mu m
05/08/2003US20030087101 Resin-coated copper foil, and printed wiring board using resin-coated copper foil
05/08/2003CA2462613A1 Contact planarization materials that generate no volatile byproducts or residue during curing
05/07/2003EP1307614A2 Method for charge-modifying polyester
05/07/2003CN1415659A Nano composite material of epoxy resin/clay for copper foil base plate
05/07/2003CN1415642A P or si modified flame vesistant ether resin
05/06/2003US6559206 Consists of a bitumen/resin composite emulsion for a road surface protection layer against the attacks of petroleum derivates, realised by mixing a first emulsion comprising at least one resin with a second emulsion comprising a bituminous
05/02/2003EP1306400A1 Flame retardant epoxy resin modified with phosphorus and silicon
05/02/2003EP1115563A4 Phenol-novolacs with improved optical properties
05/02/2003EP0939963B1 Method of impregnating components
05/01/2003WO2003035778A2 Thermally curable binding agents
05/01/2003WO2003035754A1 Thermosetting moulding composition
05/01/2003WO2003035718A1 Hardenable cyanate compositions
05/01/2003US20030082385 Mixture of carbon fibers, epoxy resin and curing agents
05/01/2003US20030080341 Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor
05/01/2003CA2477156A1 Moldable thermosetting composition
05/01/2003CA2463069A1 Thermally curable binding agents
04/2003
04/30/2003CN1414992A Blister-resistant molded polyurea polymer and method of making it
04/30/2003CN1414048A Solidified composition forming as protective membrane, forming method of the membrance and the membrane
04/30/2003CN1414031A Epoxy resin compositing, its solidification product, new-type epoxy resin, phenol compound, and its preparation method
04/29/2003US6555622 Vinyl polymer having a reactive functional group selected from the group containing an alcoholic hydroxyl, phenolic hydroxyl, amino, amido and carboxyl group prepared by living radical polymerization
04/29/2003US6555617 Modified polyvinyl acetal resin obtained by acetalizing a polyvinyl alcohol with an aldehyde and then modifying the resultant acetalization product with an acid anhydride
04/29/2003US6555602 Semiconductor encapsulation with low viscosity at </= 80 degrees c
04/29/2003US6555601 Process for impregnating electrical coils, and selected epoxy composition for carrying out the impregnation
04/29/2003US6555592 Epoxidized novolak phenolic resin modified with an unsaturated monobasic carboxylic acid, a dibasic acid, and an acid anhydride, a photopolymerizable monomer, photoinitiator and an epoxy novolak resin; use as solder mask
04/29/2003US6555187 Sealing material composition for liquid crystal
04/29/2003US6555023 Enhanced oxidation resistant polymeric insulation composition for air-cooled generators
04/24/2003WO2003034152A1 Composition for forming antireflection film for lithography
04/24/2003WO2003033173A1 Process for coating metallic bodies and primer compositions to be used in the process
04/24/2003WO2002042235A3 Epoxy urethane string binder
04/24/2003US20030078336 Coating composition
04/24/2003US20030078322 Conductive resin compositions and electronic parts using the same
04/24/2003US20030075291 Method for the production of insulation plates and binding agent mixture for same
04/23/2003EP1303568A2 Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization
04/23/2003EP1303567A1 Volume-modified casting compounds based on polymeric matrix resins
04/23/2003EP1303553A2 Radiation-curable compositions and cured articles
04/23/2003EP1114108B1 Method of bonding a chrome steel to a fibre composite
04/23/2003EP0861277B1 Powderable reactive resin compositions
04/23/2003CN1413225A Resin composition curable with actinic energy ray
04/23/2003CN1412837A 电子元件 Electronic component
04/23/2003CN1412244A Toughened thermosetting resin and its preparation method
04/23/2003CN1412234A Photosensitive resin composite for gap body of liquid crystal display
04/23/2003CN1412215A Multicomponent in suit foaming system and its use
04/23/2003CN1106417C Polymerizable composition based on epoxides
04/23/2003CN1106273C Soluble-fusible phenolic resin with improved optical properties
04/22/2003US6552159 Polyoxyalkylene polyol phosphate ester with high free hydroxyl value with polyisocyanates, active hydrogen acrylate, acrylic acid or maleic anhydride; curable; electroconductive coatings and protective films
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