| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 10/25/2001 | US20010034418 Carboxy-functionalized polyphenylene ethers and blends containing them |
| 10/25/2001 | US20010034382 Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith |
| 10/25/2001 | US20010033544 Optical medium |
| 10/24/2001 | EP0779337B1 Fluorine-containing epoxy resin composition highly soluble in solvents |
| 10/24/2001 | CN1318589A Modified furfural-acetone epoxy as reinforcing, concreting and grouting material and its preparation |
| 10/24/2001 | CN1318571A Semiconductor device and its manufacture |
| 10/24/2001 | CN1073603C Resin composition for powder coating |
| 10/24/2001 | CN1073581C Prep. of injection epxoy resin for high voltage switch |
| 10/23/2001 | US6306980 Resin composites and method for producing the same |
| 10/23/2001 | US6306935 Thermosetting resin compositions for build-up method |
| 10/23/2001 | US6306926 Radiopaque cationically polymerizable compositions comprising a radiopacifying filler, and method for polymerizing same |
| 10/23/2001 | US6306792 Mixing with water, subjecting to pressure cooking, measuring electroconductivity of extraction mixture |
| 10/23/2001 | CA2010819C Novel electrodeposition coating system having improved impact and chip resistance |
| 10/18/2001 | WO2001077227A1 Polycarbonate having excellent hydrolytic stability |
| 10/18/2001 | WO2001077202A1 Aqueous two-component cross-linkable composition |
| 10/18/2001 | WO2001077192A1 Aromatic oligomer, phenolic resin composition containing the same, and epoxy resin composition and cured object obtained therefrom |
| 10/18/2001 | US20010031851 Thermosetting resin composition |
| 10/18/2001 | US20010031837 Pressure sensitive adhesives |
| 10/18/2001 | US20010031829 Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization |
| 10/18/2001 | US20010030062 Conductive composition |
| 10/17/2001 | EP1146084A2 Curable composition |
| 10/17/2001 | EP1144535A2 Autodepositable adhesive |
| 10/17/2001 | EP1144478A2 Viscosity modifier for thermosetting resin composition |
| 10/17/2001 | EP1144190A2 Manufacture of void-free laminates and use thereof |
| 10/17/2001 | EP0836627B1 Polymer material, process for its production and use thereof |
| 10/17/2001 | EP0644803B1 Encapsulated semiconductor device |
| 10/17/2001 | EP0528874B2 Use of a dispersion-based two-component, filmforming reactive system |
| 10/17/2001 | CN1318077A Glycidyl ether group-contg. partial alkoxysilane condensate, silane-modified resin, compsns. of these, and processes for producing these |
| 10/17/2001 | CN1073133C Thermosetting compsn. molding material, molded structure, and method of decomposing them |
| 10/17/2001 | CN1073127C Hologen-free flame-retardant epoxy resin compsn. and prepreg and laminate containing same |
| 10/16/2001 | US6303706 Impact resistance and weather resistance |
| 10/11/2001 | WO2001074798A1 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
| 10/11/2001 | WO2001000405A3 Manufacture of void-free laminates and use thereof |
| 10/11/2001 | US20010028053 Wavelength-converting casting composition and light-emitting semiconductor component |
| 10/11/2001 | DE10017784A1 Thermally curable epoxy resin composition, useful as an adhesive, contains a reaction product prepared from a difunctional amine terminated polymer and a tri- or tetracarboxylic acid anhydride. |
| 10/11/2001 | DE10017783A1 Thermosetting resin composition, especially useful as structural adhesive with high impact strength at low temperature, containing epoxy resin, reactive copolymer, acid anhydride reaction product and latent hardener |
| 10/11/2001 | CA2403595A1 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
| 10/10/2001 | EP1142952A1 Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same |
| 10/10/2001 | EP1142924A1 Acid catalyzed polymerization of aqueous epoxy resin emulsions and uses thereof |
| 10/10/2001 | EP1142923A1 Flame-retardant epoxy resin composition and semiconductor device made using the same |
| 10/10/2001 | EP1142922A2 Photo-curable resin composition, process for producing the same and products using the same |
| 10/10/2001 | EP1142921A1 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
| 10/10/2001 | EP1142920A1 Epoxy resin composition, prepreg, and roll made of resin reinforced with reinforcing fibers |
| 10/10/2001 | EP1141130A1 Polyetherimide resin/polyester resin blends having improved visual clarity |
| 10/10/2001 | EP1141127A1 Hydrophobic epoxide resin system |
| 10/10/2001 | EP1141126A1 Epoxy resins and stable aqueous dispersions thereof |
| 10/10/2001 | EP1141104A1 Heat debondable adhesive composition and adhesion structure |
| 10/10/2001 | EP1141073A1 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 10/10/2001 | EP1141071A2 High strength epoxy adhesive and uses thereof |
| 10/10/2001 | EP0454839B1 Low gloss thermoplastic molding compositions |
| 10/10/2001 | CN1317019A Polymer and epoxy resin compositions |
| 10/10/2001 | CN1316463A Phasphorus-containing epoxy resin composition, flame-retarded sheet resin composite metal forming, semi-solidified sheet, veneer shect, multiply sheet using the phasphorus-containing epoxy resin |
| 10/10/2001 | CN1316448A Acid catalysis polymerization of epoxy resin aqueous emulsion and its appliance |
| 10/10/2001 | CN1316447A Epoxy resin composition for semi-conductor packaging and semi-conductor device using the composition |
| 10/09/2001 | US6300425 Adhesive property, resistance to humidity, and heat resistance after curing; used for protective layers, electric insulation coatings and like for electric appliances, electronic devices |
| 10/04/2001 | WO2001072902A1 Curable composition and multilayered circuit substrate |
| 10/04/2001 | WO2001072898A1 Thermally degradable epoxy underfills for flip-chip applications |
| 10/04/2001 | US20010027227 Antifoam agent |
| 10/04/2001 | US20010026803 Mixture of factice and epoxidized and then crosslinked esters of at least dihydric alcohols and unsaturated fatty acids; insecticides, fungicides, bactericides |
| 10/04/2001 | US20010025947 Providing and curing liquid conductive mixture between nodes, having sufficient conductivity without diminishing resistance; electrical, integrated circuits, batteries, wireless communication devices |
| 10/04/2001 | US20010025407 Process for the production of a double-layer metal sheet and a more particularly stove enamelled shaped constructional member shaped therefrom, and also a deep-drawable double-layer metal sheet |
| 10/04/2001 | EP1138739A1 Photocurable resin composition for sealing material and method of sealing |
| 10/04/2001 | EP1138731A1 Coating composition |
| 10/04/2001 | EP1138711A1 Curing agents for epoxy resins |
| 10/04/2001 | EP1138704A1 Curable compositions |
| 10/04/2001 | EP1137708A1 Epoxy resin composition and semiconductor device |
| 10/04/2001 | EP1137692A1 Halogen-containing vinyl polymer resins and processes for the preparation thereof |
| 10/04/2001 | CA2342658A1 Acid catalyzed polymerization of aqueous epoxy resin emulsions and uses thereof |
| 10/03/2001 | CN1316066A Stereolithographic composition for preparing polyethylene-like articles |
| 10/03/2001 | CN1315974A Viscosity omdifier for thermosetting resin composition |
| 10/03/2001 | CN1315734A Insulative material for printed circuit board |
| 10/02/2001 | US6296940 Laminate comprising a flame-retardant resin composition |
| 10/02/2001 | CA2042008C Phosphorus compounds |
| 09/27/2001 | WO2001070887A1 Thermoplastic resin composition |
| 09/27/2001 | WO2001070867A2 Flame retardant epoxy molding compositions |
| 09/27/2001 | WO2001070844A1 Flame-retardant epoxy resin composition, molded object thereof, and electronic part |
| 09/27/2001 | US20010025076 Layered compositions with multi-charged onium ions as exchange cations, and their application to prepare monomer, oligomer, and polymer intercalates and nanocomposites prepared with the layered compositions of the intercalates |
| 09/27/2001 | US20010024644 Crosslinkable polymer composition |
| 09/27/2001 | US20010023734 Method of bonding a chrome steel to a fibre composite |
| 09/27/2001 | CA2402383A1 Flame retardant epoxy molding compositions |
| 09/26/2001 | EP1137328A2 Insulating material for printed wiring board |
| 09/26/2001 | EP1136253A2 Method for producing a double layer metal sheet and a piece, in particular a stove-enameled piece, formed therefrom , and a deep-drawable double layer metal sheet |
| 09/26/2001 | CN1314925A Storage-stable compositions useful for the production of structural forms |
| 09/26/2001 | CN1071772C Single-component thermosetting masses, its preparing method its their use |
| 09/25/2001 | US6294621 Resin composites and method for producing the same |
| 09/25/2001 | US6294597 Curable polymeric composition and use in protecting a substrate |
| 09/25/2001 | US6294593 Combining host polymer with guest crossliniking agent; exposing combined host polymer and guest crosslinking agent to electric field to pole second order nonlinear optical component of polymer; exposing to electromagnetic radiation |
| 09/25/2001 | US6294270 Electronic circuit device comprising an epoxy-modified aromatic vinyl-conjugated diene block copolymer |
| 09/20/2001 | WO2001068360A1 Flame retardant optical films |
| 09/20/2001 | US20010023276 Polymeric material, method for its manufacture, and its utilization |
| 09/19/2001 | EP0830640B1 Stabilizers for use with photoacid precursor formulations |
| 09/19/2001 | CN1313885A Coating composition |
| 09/19/2001 | CN1313882A Paste composition, and protective film and semiconductor device both obtained with the same |
| 09/19/2001 | CN1313360A 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |
| 09/18/2001 | US6291599 Modifier and a method for improving the flexibility of a cured epoxy resin |
| 09/18/2001 | US6291556 Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 09/18/2001 | US6291554 Curable system of self-emulsified aqueous epoxy resin and its polymeric hybrids |
| 09/18/2001 | US6291545 Fluorine-containing epoxy resin composition readily soluble in solvent |
| 09/13/2001 | WO2001067129A2 Epoxide polymer surfaces |
| 09/13/2001 | WO2001066663A1 A method of bonding, a bonded structure and a use of xylan |