Patents
Sitemap › C08 - Organic macromolecular compounds; Their preparation or chemical working-up; Compositions based thereon › C08L - Compositions of macromolecular compounds › C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
11/2003
11/27/2003WO2003002667A3 Moldable poly(arylene ether) thermosetting compositions, methods, and articles
11/27/2003US20030220455 Heat resistant resin composition and adhesive film
11/27/2003US20030220425 An amine functional silicone compound or an organic amine group modified polysiloxanes; for use on skin, hair, cosmetics
11/27/2003US20030218269 Image-receiving layer composition and overcoat layer composition for ink-jet recording
11/26/2003CN1459049A Ultraviolet-curable resin composition and photosolder resist ink contaning the composition
11/26/2003CN1458210A Thermoplastic resin composition for laser mark
11/25/2003US6653436 Water dispersible epoxy resins
11/25/2003US6652694 Photocurable resin compound and method of curing the same
11/20/2003WO2003095554A1 Photo-induced cation curable epoxy resin composition
11/20/2003WO2003051649A3 Method of making models
11/20/2003US20030216514 Photocurable and thermosetting resin composition
11/20/2003US20030216500 Hydrolysis resistant polyester elastomer compositions and related articles and methods
11/20/2003US20030215746 Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof
11/20/2003US20030215567 A blends comprising an adduct of epoxidized phenolic resins with (meth)acrylic acid, a (meth)acrylates, a liquid epoxy resins and curing agents; noncracking, solder-resistance, corrosion resistance, durability
11/19/2003EP1362876A1 One-pack moisture-curable epoxy resin composition
11/19/2003EP1362489A1 Wireless local loop antenna
11/19/2003EP1228119B1 High performance polyetherester containing laminating resin compositions
11/19/2003EP0958326B1 Method for gluing a surface to a component
11/18/2003US6649729 Novolaks as water-unaffected accelerators for epoxy resin hardeners
11/18/2003CA2124831C Water compatible amine terminated resin useful for curing epoxy resins
11/13/2003WO2003093393A1 Wavelength-converting reactive resinous compound and light-emitting diode component
11/13/2003WO2003093387A1 Heat-curable epoxy resin composition
11/13/2003WO2003093379A1 Compliant overprint varnishes
11/13/2003WO2003093368A1 Epoxy modified organopolysiloxane resin based compositions useful for protective coatings
11/13/2003WO2003093366A1 Hydrolysis resistant polyester compositions and related articles and methods
11/13/2003WO2003093359A1 Hydrolysis resistant polyester elastomer compositions and related articles and methods
11/13/2003WO2003093352A1 Amino-functional polysiloxanes and their use in coatings
11/13/2003WO2003093350A1 Organo-functional polysiloxanes
11/13/2003WO2003070826A3 Powder coating compositions having improved mar and acid resistance
11/13/2003WO2003018687A3 Thermosetting polyvinyl alcohol binder resin composition, slurry of electrode mix, electrode, non-aqueous electrolysis solution-containing secondary battery and use of thermosetting polyvinyl alcohol binder resin as electrode material
11/13/2003WO2003010254A3 Unsaturated powder coating compositions
11/13/2003US20030212230 Using mixture of curing agent containing anhydride and zinc octanoate
11/13/2003US20030211792 Crosslinked epoxy resin
11/13/2003US20030211328 Blend of epoxy resin, curing agent, phosphate and aluminum hydroxide
11/13/2003US20030211327 Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device
11/13/2003CA2484347A1 Compliant overprint varnishes
11/13/2003CA2483878A1 Epoxy modified organopolysiloxane resin based compositions useful for protective coatings
11/13/2003CA2483867A1 Amino-functional polysiloxanes and their use in coatings
11/13/2003CA2482678A1 Hydrolysis resistant polyester compositions and related articles and methods
11/13/2003CA2482673A1 Hydrolysis resistant polyester elastomer compositions and related articles and methods
11/12/2003EP1109870B1 Selective deposition modeling material
11/12/2003CN1455960A Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor
11/12/2003CN1455828A Water-based treating agent for metal surface
11/12/2003CN1455799A Volume-modified casting compound based on polymeric matrix resins
11/12/2003CN1454929A Composite solid polymer electrolyte for secondary lithium cell and preparing method thereof
11/11/2003US6646048 Comprising 100 parts by weight reactive acrylic resin, 100-500 parts silane compound obtained by reaction of an aminosilane having two amino groups with di- and trialkoxyepoxysilane, 10-300 parts epoxy resin, carbon black; windshield repair
11/11/2003US6646031 Polyetherimide resin/polyester resin blends having improved visual clarity
11/11/2003US6645643 For plastic packaging material for microelectronic applications
11/11/2003US6645633 Autodeposition compositions
11/11/2003US6645631 Flame retardant phosphorus element-containing epoxy resin compositions
11/11/2003US6645630 Phosphorus compound having an average of not less than 1.8 and less than 3 of phenolic hydroxy groups reactive with an epoxy resin and an average of not less than 0.8 of a phosphorus element in the molecule, an inorganic filler having particles,
11/11/2003US6645595 Optical medium
11/11/2003US6645340 Blend containing epoxy resin
11/11/2003CA2220062C Cationically polymerizable epoxy resins and optical information recording medium made therefrom
11/06/2003WO2003091338A1 Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
11/06/2003WO2003091335A1 Surface improver for reinforced composite compositions
11/06/2003US20030208009 Epoxy resin compositions, solid state devices encapsulated therewith and method
11/06/2003US20030207973 Thermoplastic resin composition for electrical/electronic contact part and electrical/electronic contact part using the same
11/06/2003US20030207035 Solid extrusion coating compositions for metal substrates, a method of extrusion coating a metal substrate, and a metal article are disclosed. The extrusion coating composition is a thermoplastic material and comprises: (a) a polyester having
11/06/2003CA2483510A1 Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product
11/05/2003EP1359202A1 Temperature curable epoxy resin composition
11/05/2003EP1359198A1 Epoxy-modified polysiloxane resin based compositions useful for coatings
11/05/2003EP1359197A1 Epoxy-polysiloxane resin based compositions useful for coatings
11/05/2003EP1359182A1 Organo-functional polysiloxanes
11/05/2003EP1359174A1 Flame-retardant epoxy resin composition, and prepregs and fiber-reinforced composite materials made by using the composition
11/05/2003EP1359172A1 Ultraviolet-curable resin composition and photosolder resist ink containing the composition
11/05/2003EP1358291A2 Method for adhering substrates using light activatable adhesive film
11/05/2003EP1358235A1 Curable compositions comprising an epoxidised unsaturated polyester and mineral fillers
11/05/2003EP1153980B1 Epoxy resin composition
11/05/2003EP1112312B1 Polymer compound with improved gloss properties
11/05/2003CN1454239A Polycarbonate having excellent hydrolytic stability
11/05/2003CN1126962C Retroreflective products and producing method thereof and clothes products containing the same retroreflective products
11/05/2003CN1126946C Temp. sensor and electronic apparatus containing same
10/2003
10/30/2003WO2003089194A1 Coated abrasive article
10/30/2003WO2000064572A3 Epoxy-functional polymeric microbeads
10/30/2003US20030200701 Coated abrasive article
10/29/2003EP1357610A1 Light emitting diode, optical semiconductor elemet and epoxy resin composition suitable for optical semiconductor element and production methods therefor
10/29/2003EP1355984A2 Novel epoxy hardeners for improved properties, processing and handling
10/29/2003EP1109862B1 Thermosetting compositions containing carboxylic acid functional polymers prepared by atom transfer radical polymerization
10/29/2003EP0845015B1 Storage stable autodepositable dispersions of epoxy resins and processes therefor and therewith
10/29/2003CN1451685A Polymer flame retardant of mixture contg. two different aryl phosphates, method for preparing same and use thereof
10/29/2003CN1125854C Water thinned epoxy/acrylic amino resin emulsion and water thinned baking paint with the emulsion as base material
10/28/2003US6639104 Comprises passing liquid slurry containing crystalized terephthalic acid with impurities into a high pressure rotary filter
10/28/2003US6639025 Elastomer-modified epoxy siloxane compositions
10/28/2003US6638567 Hardenable composition with a particular combination of characteristics
10/23/2003US20030199669 Synthetic or natural rubbers comprising conjugated homo/co-and/or terpolymers having improved balance between low rolling resistance and wet skid resistance, for use as automobile tires
10/23/2003US20030199640 Copolymers of vinyl monomers for multi-layer composite coatings; performance characteristics such as solvent or chemical resistance at reduced costs
10/23/2003US20030199391 Thermosetting resin composition, epoxy resin molding material and semiconductor device respectively using latent catalyst
10/23/2003US20030196753 Epoxy adhesive having improved impact resistance
10/22/2003EP1354916A1 Self-hardening epoxy resin for the manufacture of electric insulators
10/22/2003EP1354885A1 Flame retardants for polymers comprising a mixture of two different aryl phoaphates, their preparation and use thereof
10/22/2003CN1125488C Liquid epoxy composite for packaging semiconductor and its appliaction
10/22/2003CN1125143C Ionizing radiation curable resin composition for fresnel lens and transmission projection screen
10/16/2003WO2003085052A1 Conductive composition, conductive film, and process for the formation of the film
10/16/2003WO2003002663A3 Hydrolysis resistant polyesters and articles made therefrom
10/16/2003US20030195281 Having high glass transition temperatures and/or markedly less discoloration/yellowing, for use in epoxy resins
10/16/2003US20030194562 Curable end groups, such as allyl, (meth)acryloyloxy, glycidyloxy and cyanate groups; printed wiring board
10/16/2003US20030194560 Coating powders, methods of manufacture thereof, and articles formed therefrom
10/16/2003US20030192643 Epoxy adhesive having improved impact resistance
10/15/2003EP1352957A1 Carriers for covalent immobilization of enzymes
1 ... 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 ... 246