| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
|---|
| 01/31/2002 | US20020013449 High strength polymers and aerospace sealants therefrom |
| 01/31/2002 | US20020013425 Polymerizable compositions |
| 01/31/2002 | US20020013420 Polyepoxides; electronic packages |
| 01/31/2002 | US20020012800 Coated molding of thermoplastic resin composition and production method therefor |
| 01/31/2002 | US20020011190 Curable composition for tendon for prestressed concrete and tendon |
| 01/30/2002 | EP1176172A1 Epoxy resin composition, prepreg and metal-clad laminate |
| 01/30/2002 | EP1176171A2 Dielectric material and method of manufacture thereof |
| 01/30/2002 | EP1176170A1 Sealing strips for the construction industry and method for producing and using the same |
| 01/30/2002 | EP1176159A1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same |
| 01/30/2002 | EP0942949B1 Gas barrier coating compositions containing platelet-type fillers |
| 01/30/2002 | CN1333308A Strong alkaline corrosion resistant material composition and firming agent |
| 01/29/2002 | US6342577 Between semiconductor and printed circuit; epoxy resin and latent hardener comprising cyanate ester and imidazole |
| 01/29/2002 | CA2093322C Epoxy resins based on diaminobisimide compounds |
| 01/24/2002 | WO2002006399A1 Halogen-free flame-retardant epoxy resin compoisition, halogen-free flame-retardant epoxy resin composition for build-up type multilayer boards, prepregs, copper-clad laminates, printed wiring boards, resin films with copper foil or carriers, and build-up type laminates and multilayer boards |
| 01/24/2002 | WO2002006398A1 Volume-modified casting compounds based on polymeric matrix resins |
| 01/24/2002 | WO2002006371A2 Radiation-curable compositions and cured articles |
| 01/24/2002 | WO2002006038A2 Method of manufacturing a replica as well as a replica obtained by carrying out a uv light-initiated cationic polymerization |
| 01/24/2002 | US20020010286 Multifunctional cyanate ester and epoxy blends |
| 01/24/2002 | US20020010274 Adhesive compositions that are removable after thermosetting |
| 01/24/2002 | CA2415707A1 Radiation-curable compositions and cured articles |
| 01/23/2002 | EP1174467A2 Heat stable, corrosion inhibiting polyorganosiloxane resins |
| 01/23/2002 | EP1174456A2 High tg potting compound |
| 01/23/2002 | EP1174455A1 Epoxy resin composition for encapsulating semiconductor |
| 01/23/2002 | EP0933010B1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
| 01/23/2002 | CN1332778A Sealant compositions and sealant articles using the same |
| 01/23/2002 | CN1078223C Mosaic self-lubricating composite material |
| 01/22/2002 | US6340714 Chloride-sensitive electrode membrane |
| 01/22/2002 | CA2048320C Process for the preparation of pigment paste resins for cathodically depositable coating compositions |
| 01/17/2002 | US20020006986 Epoxy resin composition for encapsulating semiconductor and semiconductor device using the same |
| 01/17/2002 | US20020005508 Process of injection molding highly conductive molding compounds and an apparatus for this process |
| 01/16/2002 | EP1172424A1 Primer composition |
| 01/16/2002 | EP1172408A1 Volume modified casting masses based on polymer matrix resins |
| 01/16/2002 | EP1172393A1 Curable resin composition, process for producing the same, and coated object made with the same |
| 01/16/2002 | EP1172192A2 A curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method |
| 01/16/2002 | EP1171925A1 Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds |
| 01/16/2002 | EP1054921B1 A polymeric composition for friction elements |
| 01/16/2002 | EP1005509B1 Conductive epoxy resin compositions, anisotropically conductive adhesive films and electrical connecting methods |
| 01/16/2002 | CN1331259A High-toughness pull rod made of aramid fibre-carbon fibre composition |
| 01/15/2002 | US6338903 Resin composition for semiconductor encapsulation, method and apparatus for producing the composition, as well as semiconductor device using the composition |
| 01/11/2002 | CA2352835A1 A curing method to cure epoxy resins in a short time, and a method for absorbing electromagnetic wave through cured epoxy resins obtained by said curing method |
| 01/10/2002 | US20020004562 Thermosetting resin composition |
| 01/10/2002 | US20020004542 Containing flame retardant compound, synergist, drip suppressant; housings for electronics, power tools |
| 01/10/2002 | US20020004353 Composition for bulkhead of thin display panel |
| 01/09/2002 | EP1170317A1 Curable compositions on the basis of glycidyl compounds, amine curing agents and low viscosity curing accelerators |
| 01/09/2002 | EP1170315A1 Urethane oligomer, resin compositions thereof, and cured article thereof |
| 01/09/2002 | EP1169357A1 Hydroxy-epoxide thermally cured undercoat for 193 nm lithography |
| 01/09/2002 | CN1330693A Power coating compositions |
| 01/09/2002 | CN1330686A Acrylic terpolymer for use as self-fixuring adhesive |
| 01/09/2002 | CN1330676A Highly branched oligomers, process for their preparation and application thereof |
| 01/08/2002 | US6337384 Mixing bismaleimide with furan compound with oxirane group to form diepoxy compound, adding amine curing agent |
| 01/08/2002 | US6337375 High optical contrast resin composition and electronic package utilizing same |
| 01/08/2002 | US6337363 Epoxy resin composition with non-halogen, non-phosphorus flame retardant |
| 01/03/2002 | WO2002000791A1 Epoxy resin composition and cured object obtained therefrom |
| 01/03/2002 | WO2002000667A1 Phosphorus-containing hydroquinone derivatives, process for their production, phosphorus-containing epoxy resins made by using the derivatives, flame-retardant resin compositions, sealing media and laminated sheets |
| 01/03/2002 | WO2001053072A3 Laminate and process for producing a laminate of this type |
| 01/03/2002 | WO2001046305A3 Recycling of articles comprising hydroxy-phenoxyether polymers |
| 01/03/2002 | WO2001045941A3 Laminates and coated materials comprising hydroxy-phenoxyether polymers |
| 01/03/2002 | US20020002214 Consists of a cationically polymerizable active functional group; a polymerization ctalyst capable of initiating cationic polymerization and a filler containing metal oxides, halides, borates, phosphates, silicates carbonates etc. |
| 01/03/2002 | US20020002212 Epoxides, cycloepoxides, aromatic epoxides, having 1-18 carbon ateoms, wherein one or more carbon atoms can be replaced by ether, carbonyl, ester, silane, or amine |
| 01/03/2002 | US20020001720 Adhesives; coatings; encapsulation |
| 01/03/2002 | DE10014017C1 Verfahren zum Herstellen eines Doppellagenbleches sowie ein tiefziehfähiges Doppellagenblech A method for producing a double-layered sheet as well as a deep-drawable double-layer plate |
| 01/02/2002 | EP1167484A2 Poly(arylene ether) adhesive compositions |
| 01/02/2002 | EP1167483A1 Adhesive tape for electronic parts |
| 01/02/2002 | EP1167451A1 Curable resin composition |
| 01/02/2002 | EP1167417A1 Flame-retardant vinyl esters, resins and resin compositions containing the same, and cured products thereof |
| 01/02/2002 | EP1165712A1 Polyester powder coating compositions |
| 01/02/2002 | EP1165711A1 Extrusion coating polyester compositions |
| 01/02/2002 | EP1165692A1 Polyester molding composition |
| 01/02/2002 | EP1165688A1 Hardenable composition with a particular combination of characteristics |
| 01/02/2002 | EP1165438A1 Melamine-modified phyllosilicates |
| 01/02/2002 | CN1329651A Adhesive powder |
| 01/02/2002 | CN1329642A Hydrophobic epoxide resin system |
| 01/02/2002 | CN1077121C Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith |
| 01/01/2002 | US6335079 Refractive index, scratch resistance |
| 01/01/2002 | CA2220531C Flame resistant polyester resin composition |
| 01/01/2002 | CA2026015C Polymeric compositions and components therefore |
| 12/27/2001 | WO2001098411A1 Sealing material for plastic liquid crystal display cells |
| 12/27/2001 | US20010056174 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming |
| 12/27/2001 | US20010056137 Aqueous two-component cross-linkable composition |
| 12/27/2001 | US20010055605 Printed circuits; containing cockroach repellent |
| 12/26/2001 | CN1328588A Impact-resistant epoxide resin compositions |
| 12/26/2001 | CN1328088A Flame-retarding non-halogen non-phosphorus epoxy resin composition |
| 12/25/2001 | US6333383 And an epoxidized block copolymer of butadiene-styrene; excellent in moldability, improved in transparency and impact resistance |
| 12/25/2001 | US6333206 Process for the production of semiconductor device |
| 12/25/2001 | US6333102 Expandable reinforcing sheet material for vehicle outer panel |
| 12/25/2001 | US6333064 Viscosity modifier for thermosetting resin composition |
| 12/20/2001 | WO2001096473A1 Thickenable vinyl ester resin compositions |
| 12/20/2001 | WO2001096440A1 Epoxy resin composition and laminate using the same |
| 12/20/2001 | WO2001096085A2 Process of injection molding highly conductive resin compositions and apparatus for that |
| 12/20/2001 | US20010053817 Curable; radiation transparent |
| 12/20/2001 | US20010053448 Thermosetting resin composition |
| 12/20/2001 | US20010053437 Cured film of acid- modified, vinyl group-containing epoxy resin, and an elastomer; heat resistance, humidity resistance adhesibility, mechanical characteristics, given elastic modulus |
| 12/20/2001 | US20010052588 Such as isophoronediamine, diaminocyclopentane, and diaminocyclohexane |
| 12/19/2001 | EP1163280A1 Epoxy resin compositions having a long shelf life |
| 12/19/2001 | CN1327458A Process for the production of polyester block copolymers, polyester block copolymer compositions and the preparation thereof |
| 12/19/2001 | CN1327457A Hardener for epoxy resin and epoxy resin composition |
| 12/19/2001 | CN1327019A Solidifying composition for prestress concrete steel bar and steel bar |
| 12/19/2001 | CN1076361C Flame retardant polymer compositions comprising thermally stable resins |
| 12/18/2001 | US6331583 Acid catalyzed polymerization of aqueous epoxy resin emulsions and uses thereof |
| 12/18/2001 | CA2033903C Low gloss thermoplastic molding compositions |