| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
|---|
| 08/10/2004 | US6773819 Curable polyester from alicyclic polybasic acid and polyhydric alcohola and a vinyl polymer with epoxy and hydroxy groups with universal hardness of </= 500 n/mm2 |
| 08/10/2004 | US6773638 Epoxy resins; lenses |
| 08/10/2004 | US6773474 Photopolymerizable coating for particles; abrasing substrate |
| 08/05/2004 | WO2004065486A1 Epoxy resin composition and semiconductor device made with the same |
| 08/05/2004 | WO2004065485A1 Thermosetting, themoexpansible composition with a high degree of expansion |
| 08/05/2004 | US20040152866 for sealing apertures |
| 08/05/2004 | US20040152804 Epoxy resin encapsulated semiconductor resin and foaming agent for halogen free polymer |
| 08/05/2004 | US20040152803 Compositon of bulk filler and epoxy-clay nanocomposite |
| 08/05/2004 | DE10317403A1 Verfahren zur Verklebung von FPCB's A method for bonding FPCB's |
| 08/05/2004 | DE10302298A1 Hitzehärtbare, thermisch expandierbare Zusammensetzung mit hohem Expansionsgrad Thermosetting, thermally expandable composition with a high degree of expansion |
| 08/04/2004 | EP1443068A1 Modified polyoxyalkylene polyamine |
| 08/04/2004 | EP1442799A1 Process for coating metallic bodies and primer compositions to be used in the process |
| 08/04/2004 | EP0707043B1 Use of a thermosetting composition, of a molding material, of a molded structure, and method of decomposing them |
| 08/04/2004 | CN1518578A Curing agent for epoxy resins and epoxy resin composition |
| 08/04/2004 | CN1517401A Preparation of high solid content aqueous epoxy resin organic-inorganic hybridized material |
| 08/04/2004 | CN1160410C Resin for moulding and method for making resin mould |
| 08/04/2004 | CN1160392C Phenolic resin, epoxy resin, and processes for producing these |
| 08/03/2004 | US6770691 (a) bromine-free epoxy resin and curing agent; (b) a flame retardant additive that is the condensation product of a brominated phenol and a cyanuric halide; (c) thermoplastic resin (polyphenylene ether), and (d) a cyanate ester |
| 08/03/2004 | CA2111905C Increasing the molecular weight of polyamides |
| 08/03/2004 | CA2083952C Post-extended anionic acrylic dispersion |
| 07/29/2004 | WO2004063263A1 Flame-retardant for engineering thermoplastic applications |
| 07/29/2004 | WO2004063246A1 Water-based epoxy grout |
| 07/29/2004 | WO2004063245A1 Castor oil/epoxidized soybean oil based elastomeric compositions |
| 07/29/2004 | US20040147666 Fluorine-containing resin coating compositions, primers for etfe coatings, and coated articles |
| 07/29/2004 | US20040147658 Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler, and process for producing copper double clad laminate |
| 07/29/2004 | US20040147643 Moulding composition for producing bipolar plates |
| 07/29/2004 | US20040147642 Sound deadening and structural reinforcement compositions and methods of using the same |
| 07/29/2004 | US20040147640 Mixture of phosphoorus containing epoxy resin, promer, hardener , polyphenylene oxide and filler; heat resistance, flame retarders |
| 07/29/2004 | US20040146728 thermosetting resin and decabromodiphenylethane prepreg |
| 07/29/2004 | DE19755031B4 Bei Raumtemperatur härtbare Epoxidharzmischungen und ihre Verwendung A room temperature curable epoxy resin mixtures and use thereof |
| 07/29/2004 | CA2509087A1 Castor oil/epoxidized soybean oil based elastomeric compositions |
| 07/28/2004 | EP1440465A1 Contact planarization materials that generate no volatile byproducts or residue during curing |
| 07/28/2004 | EP1114845B1 Paste composition, and protective film and semiconductor device both obtained with the same |
| 07/28/2004 | CN1516727A Method for adhering substrates using ultraviolet activatable adhesive film and ultraviolet irradiation apparatus |
| 07/28/2004 | CN1515623A Wavelength exchange pouring material, its application and preparation method |
| 07/28/2004 | CN1159625C Photosensitive thermosetting composition |
| 07/27/2004 | US6767937 A polymer phase having molecularly dispersed therein an acid scavenger compound; a hindered amine light stabilizer and a hindered phenol antioxidant compound are present at a weight ratio of from 20:1 to 1:20 |
| 07/27/2004 | US6767639 Cured epoxy resin compositions with brominated triazine flame retardants, and laminates comprising them |
| 07/22/2004 | WO2004060996A1 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 07/22/2004 | WO2004060984A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/22/2004 | WO2004060958A1 Curable resin composition and products of curing thereof |
| 07/22/2004 | WO2004060957A1 Phosphorus-modified epoxy resin |
| 07/22/2004 | WO2004039886A3 Flip-chip system and method of making same |
| 07/22/2004 | US20040143062 Thermosetting resin composition |
| 07/22/2004 | US20040143060 Using organometallic compounds as polymerization catalyst; impact strength, flexibility, noncracking, wear resistance |
| 07/22/2004 | US20040143037 Epoxy ebonite compositions |
| 07/22/2004 | US20040142276 reaction product of an organohydrogenpolysiloxane, an alkenyl-organopolysiloxane and a diallyl bi- or bisphenol; curable by exposure to radiation having a wide range of wavelength; highly elastic, transparent, minute pattern |
| 07/22/2004 | US20040142178 gelled copolymer comprising one or more residues of a first polymerizable ethylenically unsaturated monomer containing a pendant amide, ester or carboxylic acid group; multi-layer composite coatings |
| 07/22/2004 | DE19702278B4 Pastöse Kittmasse Pasty putty |
| 07/22/2004 | CA2509629A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/21/2004 | EP1352026B1 Filled epoxy resin system having high mechanical strength values |
| 07/21/2004 | EP0928304B1 Epoxy resin mixtures |
| 07/21/2004 | CN1514302A Improved photo anticorrosion agent |
| 07/21/2004 | CN1513910A Preparation method of rare earth modified fanglun fiber/epoxy composite material |
| 07/21/2004 | CN1158351C Thermoplastic resin modified and electronic beam cured composite material epoxy resin-base |
| 07/21/2004 | CN1158340C Process for molding and shaping of polymer blends |
| 07/20/2004 | US6765043 Epoxy resin, epoxy resin composition, cured epoxy resin, and manufacturing method thereof |
| 07/20/2004 | US6764616 Hydrophobic epoxide resin system |
| 07/15/2004 | WO2004058895A1 Resin composition |
| 07/15/2004 | WO2004020506A3 Polyether polyamine agents and mixtures therefor |
| 07/15/2004 | US20040138381 Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications |
| 07/15/2004 | US20040138325 Ultraviolet activatable adhesive film |
| 07/15/2004 | US20040134163 Water-based epoxy grout |
| 07/15/2004 | DE10300462A1 Phosphormodifiziertes Epoxidharz A phosphorus-modified epoxy resin |
| 07/14/2004 | EP1437393A1 Adhesive for gas barrier laminates and laminated films |
| 07/14/2004 | EP1075498B1 Energy cured sealant composition |
| 07/14/2004 | CN1157355C Novel ester compound and themrosetting resin composition using the same |
| 07/14/2004 | CN1157111C Improved animal mastax |
| 07/13/2004 | US6762511 Thermosetting resin composition |
| 07/13/2004 | US6762019 Use in activated slides for making microarrays of nucleic acids; monomers with pendant epoxy groups to immobilize biological targets, diluent monomers or polymers, and monomers having a photoreactive group to surface treat the substrate |
| 07/13/2004 | US6761842 Heat conductive mold and manufacturing method thereof |
| 07/08/2004 | US20040132956 Thermosetting resin composition for vacuum, method for manufacturing the same, and vacuum device using the same |
| 07/08/2004 | US20040132924 Polyester powder coating materials for coatings with a matt appearance |
| 07/08/2004 | US20040132867 Transparent composite composition |
| 07/08/2004 | US20040131839 Heat activated epoxy adhesive and use in a structural foam insert |
| 07/07/2004 | EP1435377A1 Polyester composition and method in extrusion coating |
| 07/07/2004 | EP1435376A1 Toughened thermosetting resins and preparation of the same |
| 07/07/2004 | EP1434831A1 Stabilized coating compositions |
| 07/07/2004 | EP1000980B1 Curable composition |
| 07/07/2004 | CN1156533C Resin composition for sealing semiconductor, and semiconductor using its and manufacturing method |
| 07/07/2004 | CN1156504C Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 07/01/2004 | WO2004055092A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 07/01/2004 | CA2510486A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 06/30/2004 | EP1432936A1 Photocurable form-in-place gasket for electronic applications |
| 06/30/2004 | EP1432770A1 Coating compositions having epoxy functional stabilizer |
| 06/30/2004 | EP1432719A1 Oligomeric, hydroxy-terminated phosphonates |
| 06/30/2004 | EP1432488A2 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes |
| 06/30/2004 | CN1509317A Thermosetting resin composition and laminates and circuit board substrates made by using same |
| 06/30/2004 | CN1156029C Wavelength conversion pouring material, its use and manufacturing method |
| 06/30/2004 | CN1155641C Curing agent for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin |
| 06/29/2004 | US6756469 Polysilazane-modified polyamine hardeners for epoxy resins |
| 06/29/2004 | US6756466 Reacting a polyamine and ketone; self-life, storage stability |
| 06/27/2004 | WO2004058905A1 Self-priming coil coating compositions and method |
| 06/24/2004 | WO2004037878A3 Co-curable compositions |
| 06/24/2004 | US20040122171 Hydrolysis resistant polyesters and articles made therefrom |
| 06/24/2004 | US20040122148 Formulation and process for title compression molded component parts |
| 06/24/2004 | US20040118514 Heat resistant, impact resistant, acrylic/epoxy adhesives |
| 06/23/2004 | EP1431365A1 Heat resistant, impact resistant, acrylic/epoxy adhesives |
| 06/23/2004 | EP1431336A2 Formulation and process for compression molded component parts |
| 06/23/2004 | EP1431325A1 Heat-curable epoxy resin composition with improved low-temperatur impact strength |