Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588)
09/2004
09/15/2004EP1457510A1 Acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxides and uses thereof
09/15/2004EP1456321A1 Multi-phase structural adhesives
09/15/2004EP1456286A1 Expandable epoxy resin-based systems modified with thermoplastic polymers
09/15/2004EP1153057B1 Self-dispersible hardenable epoxide resins
09/15/2004EP0850973B1 Phenolic hydroxyl-containing modified resin, curable composition thereof, epoxidation product of said modified resin, and curable composition thereof
09/15/2004CN1166738C Flame-retardant resin composition and semiconductive sealing material made of same
09/14/2004US6790901 Epoxy resin, which has excellent strength and also has excellent heat resistance and water resistance, and the rubber latex, which is flexible, a glass fiber and a rubber product can be obtained having greatly increased durability,
09/14/2004US6790887 Aromatic polycarbonate resin composition
09/14/2004CA2270208C Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent
09/14/2004CA2084166C Polyetherdiamines containing imidazolidones
09/10/2004WO2004076558A1 Curable composition
09/10/2004WO2004076522A1 Curable resin composition
09/09/2004US20040176550 Adhesive for flexible packings
09/09/2004US20040176541 Chlorine free and reduced chlorine content polymer and resin compositons for adhesion to plastics
09/09/2004US20040176526 polyimide resin and a thermosetting resin; can be bonded and cured at a comparatively low temperature, is soluble in a solvent and has excellent heat resistance and adhesion
09/09/2004US20040176511 realizing excellent fluidity and flame retardancy as well as prevention of flame dropping when burned
09/09/2004US20040176502 Mannich based adducts as water based epoxy curing agents with fast cure capabilities for green concrete application
09/08/2004EP1454935A1 Mannich-based adducts as water based epoxy curing agents with fast cure capabilities for green concrete application
09/08/2004EP1094087B1 Epoxy resin composition, epoxy resin composition for fiber-reinforced composite, and fiber-reinforced composite containing the same
09/08/2004CN1527869A Ultraviolet activatable adhesive film
09/07/2004US6787614 Thermosetting resin composition and process for producing the same
09/07/2004US6787606 Electrochromic device with composition of epoxy resin, toughener and latent curative
09/07/2004US6787605 Composition of polyphenylene ether, polystyrene and curable epoxy
09/07/2004US6787591 Synergistic stabilizer compositions for themoplastic polymers in prolonged contact with water
09/07/2004US6787579 Two-component (epoxy/amine) structural foam-in-place material
09/07/2004CA2102484C Polyphenylene ether/polyepoxide resin system for electrical laminates
09/02/2004WO2004074359A2 Flame retardant molding compositions containing group iva metal oxides
09/02/2004US20040170774 Radiation curable powder containing unsaturated polyester and vinyl end capped epoxy resin; low temperature melting; metal and heat sensitive material coating; flowability, solvent resistance, flexibility, film hardness
09/02/2004US20040169163 Mixture containing oxidizer and polymerization inhibitor
09/01/2004EP1452566A1 Thermosetting resin composition, process for producing the same, and suspension-form mixture
09/01/2004EP1452535A1 Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same
09/01/2004EP1451011A1 Autodeposition compositions
09/01/2004CN1525997A Expoxy functionalized ethylene copolymer asphalt reaction products
09/01/2004CN1525557A Light sensitive element packaging material combination and using method thereof
08/2004
08/31/2004US6784555 Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes
08/31/2004US6784260 Powder coating of thermosetting resin(s), polyphenylene ether(s) and curing agent(s)
08/31/2004US6784248 Thermosetting compositions containing alternating copolymers of isobutylene type monomers
08/31/2004US6784247 Powder coating compositions having improved mar and acid resistance
08/31/2004US6783859 Waterproofing; protective coatings for semiconductor
08/26/2004WO2004072179A1 Halogen free ignition resistant thermoplastic resin compositions
08/26/2004WO2004072173A1 Rubber composition, crosslinkable rubber compositions, and crosslinked articles
08/26/2004WO2004072170A2 Halogen free ignition resistant thermoplastic resin compositions
08/26/2004WO2004072150A1 Silicon compound containing epoxy group and thermosetting resin composition
08/26/2004WO2004072145A1 Improvements in or relating to thermosetting resin compositions
08/26/2004US20040167253 Adhesion promoter for plastisols
08/26/2004US20040166326 Polyphenol resin, method for producing the same, epoxy resin composition and use thereof
08/26/2004CA2515393A1 Rubber composition, crosslinkable rubber compositions, and crosslinked articles
08/26/2004CA2513654A1 Halogen free ignition resistant thermoplastic resin compositions
08/26/2004CA2513207A1 Silicon compound containing epoxy group and thermosetting resin composition
08/25/2004EP1449895A2 Fire-resistant paint and coated material thereof
08/25/2004EP1449871A2 Thermoplastic polyester-based flame-retardant resin composition and molded products thereof
08/25/2004EP1448733A2 Thermally curable binding agents
08/25/2004EP1448711A1 Thermosetting moulding composition
08/25/2004EP1448663A1 Process for the alkoxylation of organic compounds
08/25/2004EP1448654A1 Radiation curable resin composition for making colored three dimensional objects
08/25/2004EP1448653A1 Process for the polymerisation of epoxy resins
08/25/2004CN1523950A Harzfilm und mehrlagige leiterplatte unter verwendung desselben
08/25/2004CN1523074A Room temperature printable adhesive paste
08/25/2004CN1523058A Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same
08/25/2004CN1523057A Resin composition and rheostat
08/24/2004US6780943 Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin
08/24/2004US6780674 Liquid epoxy resin composition and semiconductor device
08/24/2004US6780549 Photopolymerizable unsaturated compound, a compound containing an epoxy group, a photopolymerization initiator or sensitizer, and a silica sol filler with a diameter of between 5 nm-0.5 mu m
08/24/2004US6780511 N-substituted arylamino-phenol-formaldehyde condensates
08/24/2004US6780502 Crosslinked elastic polymer in a photo- or thermally-polymerizable resin
08/19/2004WO2004070080A1 Flat rolled magnetic steel sheet or strip having its surface coated for bonding
08/19/2004US20040161612 Mixture of novolak epoxy resin, modified acrylonitrile-butadiene rubber, cresol-formaldehyde resin, phosphorus compound and filler
08/19/2004US20040161545 Adhesion method
08/18/2004EP1447421A1 Room temperature printable adhesive paste
08/18/2004EP1447420A1 Curable resin composition
08/18/2004EP1446452A1 Modified epoxy resins
08/18/2004EP1035148B1 Aqueous solution of water-soluble epoxy resin, solid obtained therefrom, and processes for producing these
08/18/2004EP0749996B1 Epoxy resin composition
08/18/2004CN1521210A 环氧树脂组合物 The epoxy resin composition
08/18/2004CN1162468C Nano composite material of epoxy resin/clay for copper foil base plate
08/18/2004CN1162395C Synthesis of anacardian amine as epoxy resin curing agent
08/18/2004CN1162366C Curable two-component mortar composition and its use
08/17/2004US6777473 Polyolefins functionalized by carboxylic acid groups, their esters, their anhydrides or their metal salts
08/17/2004US6777461 Polymeric composition for friction elements
08/17/2004US6777027 Coating powders for smooth, low gloss finishes, and powder coatings formed therefrom
08/12/2004WO2004068506A1 Conductive paste
08/12/2004WO2004067665A1 Method for gluing fpcb’s
08/12/2004WO2004067635A1 Preformed compositions in shaped form
08/12/2004WO2004067631A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate
08/12/2004WO2004067600A1 Electronic material composition, electronic product and method of using electronic material composition
08/12/2004US20040158008 Bonding silicon chip to substrate; mixture of epoxy resin and bismaleimide resin
08/12/2004US20040157060 Sprayable coating composition having vibration and harsh noise reduction or absorption properties
08/12/2004US20040155364 Reworkable thermosetting resin compositions
08/12/2004US20040155334 Epoxy resin composition and semiconductor device
08/12/2004DE102004004612A1 Harzfilm und mehrlagige Leiterplatte unter Verwendung desselben Of the same resin film and multilayer printed circuit board using
08/11/2004EP1368402B1 Polymerizable preparations on the basis of silicon compounds comprising aliphatic and cycloaliphatic epoxide groups
08/11/2004EP0954553B1 Latent catalysts for epoxy curing systems
08/11/2004EP0931817B1 Water-repellent, oil-repellent resin composition
08/11/2004EP0764180B1 Curable compositions
08/11/2004CN1520448A Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same
08/11/2004CN1519273A Polymer and epoxy resin compsns
08/10/2004US6774501 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein
08/10/2004US6774188 Crosslinkable compositions of functionalized polyolefin powders
08/10/2004US6774163 Flame retardants for polymers comprising a mixture of two different aryl phosphates, their preparation and their use
08/10/2004US6774160 Curable epoxy resin compositions and the cured residues thereof