Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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09/15/2004 | EP1457510A1 Acid catalyzed copolymerization of water, tetrahydrofuran and multifunctional epoxides and uses thereof |
09/15/2004 | EP1456321A1 Multi-phase structural adhesives |
09/15/2004 | EP1456286A1 Expandable epoxy resin-based systems modified with thermoplastic polymers |
09/15/2004 | EP1153057B1 Self-dispersible hardenable epoxide resins |
09/15/2004 | EP0850973B1 Phenolic hydroxyl-containing modified resin, curable composition thereof, epoxidation product of said modified resin, and curable composition thereof |
09/15/2004 | CN1166738C Flame-retardant resin composition and semiconductive sealing material made of same |
09/14/2004 | US6790901 Epoxy resin, which has excellent strength and also has excellent heat resistance and water resistance, and the rubber latex, which is flexible, a glass fiber and a rubber product can be obtained having greatly increased durability, |
09/14/2004 | US6790887 Aromatic polycarbonate resin composition |
09/14/2004 | CA2270208C Copolymer of styrene and maleic anhydride comprising an epoxy resin composition and a co-cross-linking agent |
09/14/2004 | CA2084166C Polyetherdiamines containing imidazolidones |
09/10/2004 | WO2004076558A1 Curable composition |
09/10/2004 | WO2004076522A1 Curable resin composition |
09/09/2004 | US20040176550 Adhesive for flexible packings |
09/09/2004 | US20040176541 Chlorine free and reduced chlorine content polymer and resin compositons for adhesion to plastics |
09/09/2004 | US20040176526 polyimide resin and a thermosetting resin; can be bonded and cured at a comparatively low temperature, is soluble in a solvent and has excellent heat resistance and adhesion |
09/09/2004 | US20040176511 realizing excellent fluidity and flame retardancy as well as prevention of flame dropping when burned |
09/09/2004 | US20040176502 Mannich based adducts as water based epoxy curing agents with fast cure capabilities for green concrete application |
09/08/2004 | EP1454935A1 Mannich-based adducts as water based epoxy curing agents with fast cure capabilities for green concrete application |
09/08/2004 | EP1094087B1 Epoxy resin composition, epoxy resin composition for fiber-reinforced composite, and fiber-reinforced composite containing the same |
09/08/2004 | CN1527869A Ultraviolet activatable adhesive film |
09/07/2004 | US6787614 Thermosetting resin composition and process for producing the same |
09/07/2004 | US6787606 Electrochromic device with composition of epoxy resin, toughener and latent curative |
09/07/2004 | US6787605 Composition of polyphenylene ether, polystyrene and curable epoxy |
09/07/2004 | US6787591 Synergistic stabilizer compositions for themoplastic polymers in prolonged contact with water |
09/07/2004 | US6787579 Two-component (epoxy/amine) structural foam-in-place material |
09/07/2004 | CA2102484C Polyphenylene ether/polyepoxide resin system for electrical laminates |
09/02/2004 | WO2004074359A2 Flame retardant molding compositions containing group iva metal oxides |
09/02/2004 | US20040170774 Radiation curable powder containing unsaturated polyester and vinyl end capped epoxy resin; low temperature melting; metal and heat sensitive material coating; flowability, solvent resistance, flexibility, film hardness |
09/02/2004 | US20040169163 Mixture containing oxidizer and polymerization inhibitor |
09/01/2004 | EP1452566A1 Thermosetting resin composition, process for producing the same, and suspension-form mixture |
09/01/2004 | EP1452535A1 Basic silane coupling agent-organic carboxylic acid salt composition, process for preparing the salt composition and epoxy resin compositions containing the same |
09/01/2004 | EP1451011A1 Autodeposition compositions |
09/01/2004 | CN1525997A Expoxy functionalized ethylene copolymer asphalt reaction products |
09/01/2004 | CN1525557A Light sensitive element packaging material combination and using method thereof |
08/31/2004 | US6784555 Die attach adhesives for semiconductor applications utilizing a polymeric base material with inorganic insulator particles of various sizes |
08/31/2004 | US6784260 Powder coating of thermosetting resin(s), polyphenylene ether(s) and curing agent(s) |
08/31/2004 | US6784248 Thermosetting compositions containing alternating copolymers of isobutylene type monomers |
08/31/2004 | US6784247 Powder coating compositions having improved mar and acid resistance |
08/31/2004 | US6783859 Waterproofing; protective coatings for semiconductor |
08/26/2004 | WO2004072179A1 Halogen free ignition resistant thermoplastic resin compositions |
08/26/2004 | WO2004072173A1 Rubber composition, crosslinkable rubber compositions, and crosslinked articles |
08/26/2004 | WO2004072170A2 Halogen free ignition resistant thermoplastic resin compositions |
08/26/2004 | WO2004072150A1 Silicon compound containing epoxy group and thermosetting resin composition |
08/26/2004 | WO2004072145A1 Improvements in or relating to thermosetting resin compositions |
08/26/2004 | US20040167253 Adhesion promoter for plastisols |
08/26/2004 | US20040166326 Polyphenol resin, method for producing the same, epoxy resin composition and use thereof |
08/26/2004 | CA2515393A1 Rubber composition, crosslinkable rubber compositions, and crosslinked articles |
08/26/2004 | CA2513654A1 Halogen free ignition resistant thermoplastic resin compositions |
08/26/2004 | CA2513207A1 Silicon compound containing epoxy group and thermosetting resin composition |
08/25/2004 | EP1449895A2 Fire-resistant paint and coated material thereof |
08/25/2004 | EP1449871A2 Thermoplastic polyester-based flame-retardant resin composition and molded products thereof |
08/25/2004 | EP1448733A2 Thermally curable binding agents |
08/25/2004 | EP1448711A1 Thermosetting moulding composition |
08/25/2004 | EP1448663A1 Process for the alkoxylation of organic compounds |
08/25/2004 | EP1448654A1 Radiation curable resin composition for making colored three dimensional objects |
08/25/2004 | EP1448653A1 Process for the polymerisation of epoxy resins |
08/25/2004 | CN1523950A Harzfilm und mehrlagige leiterplatte unter verwendung desselben |
08/25/2004 | CN1523074A Room temperature printable adhesive paste |
08/25/2004 | CN1523058A Method for preparing an insulating resin composition, insulating resin composition, multilayer wiring board and process for producing the same |
08/25/2004 | CN1523057A Resin composition and rheostat |
08/24/2004 | US6780943 Composition of barbituric acid-modified BMI and PPE chain-broken in phenol resin |
08/24/2004 | US6780674 Liquid epoxy resin composition and semiconductor device |
08/24/2004 | US6780549 Photopolymerizable unsaturated compound, a compound containing an epoxy group, a photopolymerization initiator or sensitizer, and a silica sol filler with a diameter of between 5 nm-0.5 mu m |
08/24/2004 | US6780511 N-substituted arylamino-phenol-formaldehyde condensates |
08/24/2004 | US6780502 Crosslinked elastic polymer in a photo- or thermally-polymerizable resin |
08/19/2004 | WO2004070080A1 Flat rolled magnetic steel sheet or strip having its surface coated for bonding |
08/19/2004 | US20040161612 Mixture of novolak epoxy resin, modified acrylonitrile-butadiene rubber, cresol-formaldehyde resin, phosphorus compound and filler |
08/19/2004 | US20040161545 Adhesion method |
08/18/2004 | EP1447421A1 Room temperature printable adhesive paste |
08/18/2004 | EP1447420A1 Curable resin composition |
08/18/2004 | EP1446452A1 Modified epoxy resins |
08/18/2004 | EP1035148B1 Aqueous solution of water-soluble epoxy resin, solid obtained therefrom, and processes for producing these |
08/18/2004 | EP0749996B1 Epoxy resin composition |
08/18/2004 | CN1521210A 环氧树脂组合物 The epoxy resin composition |
08/18/2004 | CN1162468C Nano composite material of epoxy resin/clay for copper foil base plate |
08/18/2004 | CN1162395C Synthesis of anacardian amine as epoxy resin curing agent |
08/18/2004 | CN1162366C Curable two-component mortar composition and its use |
08/17/2004 | US6777473 Polyolefins functionalized by carboxylic acid groups, their esters, their anhydrides or their metal salts |
08/17/2004 | US6777461 Polymeric composition for friction elements |
08/17/2004 | US6777027 Coating powders for smooth, low gloss finishes, and powder coatings formed therefrom |
08/12/2004 | WO2004068506A1 Conductive paste |
08/12/2004 | WO2004067665A1 Method for gluing fpcb’s |
08/12/2004 | WO2004067635A1 Preformed compositions in shaped form |
08/12/2004 | WO2004067631A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
08/12/2004 | WO2004067600A1 Electronic material composition, electronic product and method of using electronic material composition |
08/12/2004 | US20040158008 Bonding silicon chip to substrate; mixture of epoxy resin and bismaleimide resin |
08/12/2004 | US20040157060 Sprayable coating composition having vibration and harsh noise reduction or absorption properties |
08/12/2004 | US20040155364 Reworkable thermosetting resin compositions |
08/12/2004 | US20040155334 Epoxy resin composition and semiconductor device |
08/12/2004 | DE102004004612A1 Harzfilm und mehrlagige Leiterplatte unter Verwendung desselben Of the same resin film and multilayer printed circuit board using |
08/11/2004 | EP1368402B1 Polymerizable preparations on the basis of silicon compounds comprising aliphatic and cycloaliphatic epoxide groups |
08/11/2004 | EP0954553B1 Latent catalysts for epoxy curing systems |
08/11/2004 | EP0931817B1 Water-repellent, oil-repellent resin composition |
08/11/2004 | EP0764180B1 Curable compositions |
08/11/2004 | CN1520448A Anisotropic conductive adhesives having enhanced viscosity and bondng methods and integrated circuit packages using same |
08/11/2004 | CN1519273A Polymer and epoxy resin compsns |
08/10/2004 | US6774501 Resin-sealed semiconductor device, and die bonding material and sealing material for use therein |
08/10/2004 | US6774188 Crosslinkable compositions of functionalized polyolefin powders |
08/10/2004 | US6774163 Flame retardants for polymers comprising a mixture of two different aryl phosphates, their preparation and their use |
08/10/2004 | US6774160 Curable epoxy resin compositions and the cured residues thereof |