| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 10/27/2004 | EP1470175A1 Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications |
| 10/27/2004 | EP1412445A4 Polysilazane-modified polyamine hardeners for epoxy resins |
| 10/27/2004 | EP1153984B1 Resin composition, molded article therefrom, and utilization thereof |
| 10/27/2004 | CN1539879A Epoxy resin compsn. and its application |
| 10/27/2004 | CN1172996C Water surface treatment agent for metal material and furface treated metal plate |
| 10/26/2004 | US6808819 Polyimide resin, epoxy resin-curing catalyst, and an epoxy resin |
| 10/26/2004 | US6808798 Semiconductor chips are mounted on a heat conductive resin substrate which polybenzazole fibers are oriented in a thick direction and/or in a direction of a surface of a resin substrate. |
| 10/26/2004 | US6808774 Fabricated tape assembly |
| 10/26/2004 | CA2264779C Coated abrasive article and method of making same |
| 10/26/2004 | CA2163000C Vibration damping constructions using thermally polymerized epoxides |
| 10/21/2004 | WO2004090621A1 Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 10/21/2004 | WO2003093366A8 Hydrolysis resistant polyester compositions and related articles and methods |
| 10/21/2004 | US20040210047 such as epoxymethallyl glycerol monomers; for use as epoxies, adhesives, coatings and composites; thermosets |
| 10/21/2004 | US20040210011 Modified polyoxyalkylene polyamine |
| 10/21/2004 | US20040209305 Epoxide polymer surfaces |
| 10/21/2004 | CA2521707A1 Phenol-blocked polyurethane prepolymers |
| 10/21/2004 | CA2521615A1 Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 10/20/2004 | EP1268644B1 Synergistic stabilizer compositions for thermoplastic polymers in prolonged contact with water |
| 10/20/2004 | EP1155053B1 Corrosion resistant structural foam |
| 10/20/2004 | CN1538978A Resin composition, composition for solder resist, and cured article obtained therefrom |
| 10/19/2004 | US6805958 Epoxy resin composition, and adhesive film and prepreg using the composition, and multilayer printed-wiring board using them, and process for manufacturing the same |
| 10/19/2004 | US6805439 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink |
| 10/19/2004 | CA2140633C Highlighting surface defects in metal surfaces |
| 10/14/2004 | WO2004087826A2 Method and apparatus for bonding and debonding adhesive interface surfaces |
| 10/14/2004 | WO2004087811A1 Flame retardant epoxy resin compositions, prepregs and metal-clad laminates |
| 10/14/2004 | WO2004087780A1 Thermosetting composition, coating composition, process for the application thereof, and articles coated therewith |
| 10/14/2004 | US20040204538 Self-priming coil coating composition and method |
| 10/14/2004 | US20040204515 Chemical resistant epoxy composition |
| 10/13/2004 | EP1274796B1 Coherent insert |
| 10/13/2004 | CN1537144A High strength bioresorbables containing poly-glycolic acid |
| 10/13/2004 | CN1537137A Flame retardant molding compositions |
| 10/13/2004 | CN1536021A Toughened epoxy resin composition and its preparation method |
| 10/13/2004 | CN1536020A Epoxy resin composition and its preparation method |
| 10/13/2004 | CN1170885C Thermosetting resin composition |
| 10/12/2004 | US6803426 Heat and chemical resistance; weatherproofing |
| 10/12/2004 | US6803413 Aqueous film forming solution |
| 10/12/2004 | US6803399 An amine functional silicone compound or an organic amine group modified polysiloxanes; for use on skin, hair, cosmetics |
| 10/12/2004 | US6803004 High throughput process for reactive extrusion of epoxy resin |
| 10/12/2004 | US6802446 Conductive adhesive material with metallurgically-bonded conductive particles |
| 10/07/2004 | WO2004085535A1 Acetoacetylated polyvinyl polymers and curable coating compositions made therefrom |
| 10/07/2004 | WO2004085511A1 Resin composition for sealing semiconductor and semiconductor device using the same |
| 10/07/2004 | WO2004085510A1 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 10/07/2004 | US20040198925 Curable epoxy resin composition |
| 10/06/2004 | EP1465210A2 Electroconductive resin, electroconductive resin composition and method of production |
| 10/06/2004 | EP1463773A1 Method of making a finished product |
| 10/06/2004 | CN1535302A Radiaton curable powder coating compositions |
| 10/06/2004 | CN1534074A Epoxy resin composition solid device packed by same and method |
| 10/06/2004 | CN1169902C Binding composition for bonding semiconductor chips |
| 10/06/2004 | CN1169878C Flame-retardant epoxy resin composition and liminate made with same |
| 10/06/2004 | CN1169877C Conductive rubber composition and conductive rubber roller and rubber belt using same |
| 10/06/2004 | CN1169876C Anticorrosion table top and its mfg. method |
| 10/06/2004 | CN1169857C P or Si modified flame resistant epoxy resin |
| 10/05/2004 | US6800804 Epoxy resin composition used for encapsulating semiconductor and semiconductor device using the composition |
| 10/05/2004 | US6800373 Comprises at least one silicone resin, at least one epoxy resin, at least one anhydride curing agent, at least one siloxane surfactant, and at least one ancillary curing catalyst |
| 10/05/2004 | US6800371 Curable composition comprising mixture of epoxy resin, catalyst and epoxy reactive thioether-containing compound; resulting adhesives are water and/or solvent resistant and bond to plastics such as polycarbonates, metals, silicon |
| 10/05/2004 | US6800157 Chain extender, a catalyst, a reactive epoxy resin, and a polymeric toughner forms a thermally curable structural adhesive |
| 10/05/2004 | CA2111718C Photosensitive compositions |
| 09/30/2004 | WO2004039851A3 Fiber dispersant-containing systems |
| 09/30/2004 | US20040192873 Reacting a polyamine with a ketone ; polyketimes; shelf life; storage stability |
| 09/30/2004 | US20040192859 Elastomeric material compositions obtained from castor oil and epoxidized soybean oil |
| 09/30/2004 | US20040192810 Liquid epoxy resin composition and semiconductor device |
| 09/30/2004 | US20040192803 Reacting epoxy compound with carbon dioxide in presence of catalyst; low temperature, low pressure ; turbine mixing device; star oligomer |
| 09/30/2004 | US20040191523 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 09/30/2004 | US20040188676 Epoxy resin composition and semiconductor apparatus |
| 09/30/2004 | US20040188660 Mixture of polymer and carbon fibers in polar solvent; film forming |
| 09/30/2004 | DE29724849U1 Lichtabstrahlendes optisches Bauelement mit einer wellenlängenkonvertierenden Vergußmasse Light emitting device having an optical wavelength-converting casting composition |
| 09/29/2004 | EP1462496A2 Coating composition and method for application thereof |
| 09/29/2004 | EP1461387A1 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
| 09/29/2004 | EP1461370A1 Organic compositions |
| 09/29/2004 | EP1287069A4 Sound deadening and structural reinforcement compositions and methods of using the same |
| 09/29/2004 | EP1242525B1 Blister-resistant molded polyurea polymer and method of making a blister-resistant molded polyurea polymer |
| 09/29/2004 | EP1162225B1 Hardener for epoxy resin and epoxy resin composition |
| 09/29/2004 | EP0933401B1 Synthetic resin composition having resistance to thermal deterioration and molded articles |
| 09/29/2004 | CN1168771C Crosslinkable compositions of functionalised polyolefine powder |
| 09/28/2004 | US6798487 Liquid crystal cell substrate including resin substrate, gas barrier layer, crosslinked resin layer and polarizing layer |
| 09/28/2004 | US6797821 Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins |
| 09/28/2004 | US6797750 Flame-retardant epoxy resin composition, molded article thereof, and electronic part |
| 09/23/2004 | WO2004081078A1 Resin composition for sealing semiconductor and semiconductor device using the same |
| 09/23/2004 | WO2004081077A1 Thermosetting epoxy resin composition |
| 09/23/2004 | WO2004081070A1 Coloring resin composition, color filter, and liquid-crystal display |
| 09/23/2004 | US20040186217 Acetoacetylated polyvinyl polymers and curable coating compositions made therefrom |
| 09/23/2004 | US20040186202 Dental coatings and cements; low shrinkage, high reactivity, oral stability, low viscosity, storable; processability, easy handling |
| 09/23/2004 | US20040183215 Free from an adverse influence on neighboring electronic circuits even if a nonaqueous electrolyte leaks from electronic devices |
| 09/22/2004 | EP1460478A1 Dry film photoresist |
| 09/22/2004 | EP1458812A1 Powdered epoxy composition |
| 09/22/2004 | EP1458794A1 Heat-curable resin composition |
| 09/22/2004 | EP1458579A2 Method of making models |
| 09/22/2004 | EP1366102B1 Hydroxyl-group-containing polyether amine adducts |
| 09/22/2004 | EP1141126B1 Epoxy resins and stable aqueous dispersions thereof |
| 09/22/2004 | CN1167763C Adhesive tape for electronic component |
| 09/22/2004 | CN1167745C 聚酯酰亚胺改性环氧树脂 Polyester-imide-modified epoxy resin |
| 09/21/2004 | US6794038 Latent hardener, manufacturing method for latent hardener, and adhesive |
| 09/21/2004 | US6794034 Resin composition, molding material, and molded object |
| 09/16/2004 | WO2004078843A1 Highly elastic epoxy resin composition |
| 09/16/2004 | WO2004024811A3 Nanocomposite, method for production and use thereof |
| 09/16/2004 | US20040181013 Impact resistant epoxide resin compositions |
| 09/16/2004 | US20040180981 Network polymers comprising epoxy-terminated esters |
| 09/16/2004 | US20040178423 Adhesive film for underfill and semiconductor device using the same |
| 09/16/2004 | DE102004006312A1 Verfahren zur Herstellung einer isolierenden Harzzusammensetzung, eine isolierende Harzzusammensetzung, eine mehrschichtige Leiterplatte und ein Verfahren für deren Herstellung A method for manufacturing an insulating resin composition, an insulating resin composition, a multilayer printed wiring board and a method for their preparation |
| 09/15/2004 | EP1457513A1 Chlorine free and reduced chlorine content polymer and resin compositions for adhesion to plastics |