| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 12/01/2004 | EP1259566B1 Thermosetting resin composition |
| 12/01/2004 | EP0883632A4 Higher modulus compositions incorporating particulate rubber |
| 12/01/2004 | CN1551910A Adhesive for gas barrier laminates and laminated films |
| 12/01/2004 | CN1551320A Anisotropic conductive adhesive, assembling method,electrooptical device module and electronic device |
| 12/01/2004 | CN1178287C Reworkable thermosetting resin composition |
| 12/01/2004 | CN1177896C Synthetic resin composition having resistance to thermal deterioration and molded articles |
| 12/01/2004 | CN1177895C Toughened thermosetting resin and its preparation method |
| 11/30/2004 | US6825277 High-frequency welding of non-polar thermoplastic rubbers |
| 11/25/2004 | WO2004101701A1 Adhesive resin composition and adhesive agent in film form, and semiconductor device using the same |
| 11/25/2004 | WO2004101349A2 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 11/25/2004 | WO2004085510B1 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 11/25/2004 | US20040236061 Ketimine reaction product of a ketone and a mixture of polyoxypropylenediamines of molecular weights 200-500 and 1000-3000, especially carried out in the presence of a tertiary amine sulfonate such as triethylamine p-toluenesulfonate; storage stable one-component curable epoxy resin; improved adhesion |
| 11/25/2004 | US20040234773 Epoxy resin |
| 11/25/2004 | US20040234763 Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device |
| 11/25/2004 | US20040232532 Epoxy resin composition and semiconductor device using thereof |
| 11/25/2004 | DE202004013037U1 Particulate natural stone product for use in the construction industry has particles bonded together by a polyurethane or epoxide resin |
| 11/25/2004 | CA2524783A1 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 11/24/2004 | EP1479710A1 Production of polymer compounds between polyester and diamine, a polymer compound and a structure including thereof |
| 11/24/2004 | EP1478710A1 Sealing method |
| 11/24/2004 | EP1478695A1 Silicone resin composition, curable resin composition, and cured resin |
| 11/24/2004 | CN1548470A Resin composition with high dielectric constant and its usage |
| 11/24/2004 | CN1176994C Non-aqueous solvent-free process for making UV curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 11/23/2004 | US6821657 Preheating a mixture of an epoxy resin, and organosilicon compound and water prior to adding a curing agent is effective to obtain a thermosetting resin composition which has a low viscosity at a room temperature |
| 11/23/2004 | CA2166307C Polyamide-based powder composition for the coating of metal substrates |
| 11/18/2004 | WO2004099283A1 Method for production of prepolymers made from polysulphides and polyepoxides |
| 11/18/2004 | WO2004098796A1 Acrylic resin coating composition for metal surface |
| 11/18/2004 | WO2004072170A3 Halogen free ignition resistant thermoplastic resin compositions |
| 11/18/2004 | US20040229982 Stabilized flame retardant additives and their use |
| 11/18/2004 | US20040227255 Liquid epoxy resin composition and flip chip semiconductor device |
| 11/18/2004 | DE19638630B4 UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen UV and thermally curable casting resin formulation and their use for Unterfüllprozeß in electrical and electronic components |
| 11/17/2004 | EP1477521A2 Flame retardant duroplastic masses, the use thereof and a process for producing the same |
| 11/17/2004 | EP1377621B1 Silicone liquid crystals, vesicles, and gels |
| 11/17/2004 | CN1546566A Molding compound for sheet tantalum capacitor |
| 11/17/2004 | CN1176146C Process for preparing dynamic cured epoxy resin/polypropylene blend |
| 11/16/2004 | US6819004 Encapsulated with epoxy resin; fluid flow |
| 11/16/2004 | US6818702 Thermosetting resin composition and flexible circuit overcoating material comprising the same |
| 11/16/2004 | US6818369 Forming electrostatic latent images; mixture of binder and coloring agent |
| 11/16/2004 | US6818307 Comprises polyphosphazene compound as hardening promoter; for production of dielectrics/printed circuit boards; prepregs |
| 11/16/2004 | US6818293 Stabilized polyester fibers and films |
| 11/16/2004 | US6817114 Styrene-butadiene block copolymer coupled with epoxidised vegetable oils used for shoe soles |
| 11/11/2004 | WO2004096911A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device |
| 11/11/2004 | WO2004096885A1 Resin composition for prepreg |
| 11/11/2004 | US20040225063 Hybrid materials employing PPE/polystyrene/curable epoxy mixtures |
| 11/11/2004 | US20040225027 comprises semi-crystalline polyester containing end methacryloyl groups; improved chemical resistance and flexibility; for varnishes/paints |
| 11/11/2004 | US20040225025 A curable formulation for displays containing(i) an epoxy resin; and(ii) a hydroxy-functional compound; resistance to yellowing |
| 11/11/2004 | US20040224163 the epoxy resin having molecular chains that contain an azomethine group ( CH=N ); applying a magnetic field to the epoxy resin composition to orient the molecular chains of the epoxy resin in a specific direction then curing the epoxy resin |
| 11/11/2004 | US20040221953 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 11/10/2004 | EP1475398A1 Indole resins, epoxy resins and resin compositions containing the same |
| 11/10/2004 | EP1474489A1 Coating composition for protecting dazzling effect |
| 11/10/2004 | EP1474479A2 Powder coating compositions having improved mar and acid resistance |
| 11/10/2004 | EP1474454A1 Thermosetting compositions containing alternating copolymers of isobutylene type monomers |
| 11/10/2004 | EP1314197A4 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 11/10/2004 | EP1278796B1 Polymeric composition for packaging a semiconductor electronic device and packaging obtained therefrom |
| 11/10/2004 | CN1175715C 多层印刷线路板 Multilayer printed circuit boards |
| 11/10/2004 | CN1175048C Curable polyphenylene ether-thermosetting resin and process |
| 11/10/2004 | CN1175044C Epoxy resin composition and semiconductor device |
| 11/10/2004 | CN1175043C Sealing material composition for liquid crystal |
| 11/10/2004 | CN1175037C Phenol curing agent for epoxy resin and epoxy resin composition using said curing agent |
| 11/09/2004 | US6815474 An epoxy resin ester reacted with an unsaturated monobasic acid and a reactive monomer; a glycol and/or glycol ether; pigment, a monoalkanolamine, a drier and water. |
| 11/04/2004 | WO2004095495A1 Inorganic particle containing composition for plasma display panel, transfer film and process for producing plasma display panel |
| 11/04/2004 | WO2004094500A1 Powdered epoxy composition |
| 11/04/2004 | WO2004094499A1 Thermosetting resin composition, multilayer body using same, and circuit board |
| 11/04/2004 | US20040220380 After being cured, will provide glass transition temperatures, low refractive indices, light transmission, and scratch resistance, and can be used in transparent layers and as substitutes for glass, for packaging an image sensor, encapsulating |
| 11/04/2004 | US20040217489 Containing an epoxy resin, a phenolic resin, an inorganic filler and a curing accelerator as main components, and further containing a silane coupling agent in 0.01 wt; for encapsulating a semiconductor chip; improved flowability |
| 11/04/2004 | DE10317646A1 Strahlungshärtbare Massen Radiation-curable compositions |
| 11/04/2004 | DE10297225T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices |
| 11/04/2004 | DE10297224T5 Plättchenbefestigungsklebstoffe für Halbleiteranwendungen, Verfahren zur Herstellung von Halbleiterbauelementen und nach derartigen Verfahren hergestellte Halbleiterbauelemente Die attach adhesives for semiconductor applications, to processes for the production of semiconductor components and manufactured by such a method, semiconductor devices |
| 11/04/2004 | CA2517602A1 Powdered epoxy composition |
| 11/03/2004 | EP1473325A1 High strength material based on vinylester and/or epoxyde resin, preparation process, composite material and use |
| 11/03/2004 | EP1317499B1 Method for cross-linking polyacrylates |
| 11/03/2004 | EP1144535B1 Autodepositable adhesive |
| 11/03/2004 | EP0990013B1 A method of producing modified polyester moulded articles, and said moulded articles |
| 11/03/2004 | CN1543486A Resin containing dielectric filler for formation of built-in capactor layer of printed wiring board, copper double clad laminate having dielectric layer formed with resin containing dielectric filler |
| 11/03/2004 | CN1542067A Settability resin combination |
| 11/03/2004 | CN1542051A Macromolecule composite for manhole cover |
| 11/03/2004 | CN1174069C Solidifying composition for prestressed concrete steel bar and steel bar |
| 11/03/2004 | CN1174046C Fire resistance resin compositions, presoaking material and laminated products using same |
| 11/03/2004 | CN1174045C Method for production of epoxy resin composite used for optical semiconductor sealing |
| 11/03/2004 | CN1173684C Light-induced cationic curing compositions and their use |
| 11/02/2004 | US6812313 Non-functional aromatic end group-containing polymer |
| 11/02/2004 | US6812302 Polymerizing alkyl acrylate(s) in presence of aromatic initiator to form aromatic group-terminated liquid rubber |
| 11/02/2004 | US6812299 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards |
| 11/02/2004 | US6812065 Anisotropic conductive paste |
| 10/28/2004 | WO2004092289A1 Radiation-cured substances |
| 10/28/2004 | WO2004092265A1 Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards |
| 10/28/2004 | US20040214984 Stabilized polyester fibers and films |
| 10/28/2004 | US20040214959 Production of polymer compounds between polyester and diamine, a polymer compound and a structure including thereof |
| 10/28/2004 | US20040214924 Heat resistance; waterproofing; adhesives; electrical properties |
| 10/28/2004 | US20040214007 Epoxy resin for fiber reinforced composite materials |
| 10/28/2004 | US20040214005 Resin film and multilayer printed wiring board using thereof |
| 10/28/2004 | US20040214003 Curable epoxidized phenolic resins containing biphenylene groups, an inorganic filler, a curing accelerator, a silane coupler, and and a dihydroxyaromatic compound; low viscosity for improved flowability without deterioration of curing; fireproofing; heat resistance (soldering); anticracking agents |
| 10/28/2004 | US20040212111 Epoxy resins; lenses; optical component, (a)spherical lens, a lens array, a prism, a grating or another relief structure for optical applicati |
| 10/27/2004 | EP1471112A1 Transparent composite composition |
| 10/27/2004 | EP1470584A2 No-flow underfill encapsulant |
| 10/27/2004 | EP1470194A1 Elastomer-modified epoxy siloxane compositions |
| 10/27/2004 | EP1470192A1 High strength bioresorbables containing poly-glycolic acid |
| 10/27/2004 | EP1470191A1 Barrier layer made of a curable resin containing polymeric polyol |
| 10/27/2004 | EP1470181A1 Improved interface adhesive |
| 10/27/2004 | EP1470177A1 Adhesive of epoxy compound, aliphatic amine and tertiary amine |
| 10/27/2004 | EP1470176A1 No flow underfill composition |