| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
|---|
| 01/12/2005 | CN1184258C Reinforced toughened polypropylene material preparing method |
| 01/11/2005 | US6841888 Polyepoxide and glass particle filler; light transmittance, variable coefficient of thermal expansion; refractive index |
| 01/11/2005 | US6841252 Laminate and process for producing a laminate of this type |
| 01/11/2005 | US6841251 Sprayable coating composition having vibration and harsh noise reduction or absorption properties |
| 01/06/2005 | WO2005000968A2 Asphalt-epoxy resin compositions |
| 01/06/2005 | US20050004339 Phosphorus-containing flame-retardant hardeners, epoxy resins, advanced epoxy resins and cured epoxy resins |
| 01/06/2005 | US20050004309 Aqueous polymer dispersion; emulsion polymers consisting of unsaturated acid and epoxide ; curing; alkanolamine hardening |
| 01/06/2005 | US20050004288 Resin composition, composition for solder resist, and cured article obtained therefrom |
| 01/06/2005 | US20050004278 Flame-retardant thermoset compositions, their use and process for their preparation |
| 01/06/2005 | US20050004271 High pressure and temperature curable; ductility, thermostability; sports equipment |
| 01/06/2005 | US20050004270 Comprising polyepoxide, anhydride hardener, 1-substituted imidazole catalyst, at least one diol and filler; thermoset materials; electrical applications; low cost |
| 01/06/2005 | US20050003202 N-substituted arylamino-phenol-formaldehyde condensates |
| 01/06/2005 | US20050003199 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 01/05/2005 | EP1493780A1 Conductive composition, conductive film, and process for the formation of the film |
| 01/05/2005 | EP1493766A1 Heat-curable resin composition and use thereof |
| 01/05/2005 | EP1290088B1 Thermoset materials with improved impact resistance |
| 01/05/2005 | EP0890594B1 One-pack cold moisture curable resin compositions |
| 01/05/2005 | CN1560931A Luminous optical element with semiconductor main body |
| 01/05/2005 | CN1560129A High molecule electrolyte film by basic polyethenyl alcohol mixed with poly-epoxy chloro propane and application thereof |
| 01/04/2005 | US6838536 Reactive and gel-free compositions for making hybrid composites |
| 01/04/2005 | US6838529 For parts of automobile, electric and electronic appliances; resistant to hydrolytic degradation and which, when melted, gives little gas emission and undergoes little viscosity change |
| 01/04/2005 | US6838170 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/04/2005 | US6838037 Blending polylactones in solvents, then heating and cooling, or evaporating the solvents to form blends used as films, fibers or nonwoven fabrics |
| 12/30/2004 | US20040266980 epoxy resin and a curing agent of cyclohexanetricarboxylic acid and/or an anhydride; adhesives, shaped articles, protective films of color filters, sealants for photoelectric transducers, blue LED and white LED; excellent curability without accelerators; colorless, transparent, heat resistant |
| 12/30/2004 | US20040266972 Adhesive of expoxy compound, aliphatic amine and tertiary amine |
| 12/30/2004 | US20040266899 Suitable for the production of thermosetting laminated bodies with a tacky surface; laminated bodies can be produced and handled in a simple manner and are suitable for stiffening and reinforcing flat structural components, in particular vehicle body structural components, such as vehicle body frames |
| 12/30/2004 | US20040265596 Epoxy resin composition for semiconductor sealing and semiconductor device |
| 12/29/2004 | WO2004113066A1 A metal-cured polyethylene-metal laminate |
| 12/29/2004 | WO2004098796B1 Acrylic resin coating composition for metal surface |
| 12/29/2004 | EP1491566A1 Curable epoxy resin composition, and process for the production of shaped articles therefrom |
| 12/29/2004 | EP1491328A1 A metal-cured polyethylene-metal laminate |
| 12/29/2004 | CN1558997A Photocurable form-in-place gasket for electronic applications |
| 12/29/2004 | CN1558922A Phenolic resin, epoxy resin, processes for production thereof and epoxy resin composition |
| 12/29/2004 | CN1558921A Curable compositions for display devices |
| 12/29/2004 | CN1558455A Light-emitting semiconductor body |
| 12/29/2004 | CN1558454A Wavelength-converting casting composition and white light-emitting semiconductor component |
| 12/29/2004 | CN1557852A Process for preparing nano-particle modified epoxy resin |
| 12/29/2004 | CA2529944A1 A metal-cured polyethylene-metal laminate |
| 12/28/2004 | US6835785 Polyphenylene ether oligomer compound, derivatives thereof and use thereof |
| 12/23/2004 | WO2004111733A1 Photocurable resin composition |
| 12/22/2004 | EP1368401B1 Liquid epoxy resin emulsions, method for the production and use thereof |
| 12/22/2004 | EP1334161B1 Structural hot melt material and methods |
| 12/22/2004 | EP0784655B1 Aqueous coating composition |
| 12/22/2004 | CN1556842A Color-changing material composition and color-changing membranes made by using the same |
| 12/22/2004 | CN1556155A Solid phase intercalation preparation method of nano montmorillonite and its prepared nano montmorillonite base material |
| 12/22/2004 | CN1556148A Waste and old asphalt modifiar |
| 12/16/2004 | WO2004109816A2 Encapsulant for opto-electronic devices and method for making it |
| 12/16/2004 | WO2004108826A2 Curable flame retardant epoxy resin compositions |
| 12/16/2004 | WO2004108825A1 Process for producing modified epoxy resin |
| 12/16/2004 | WO2004108790A1 Curing resin composition, sealing material for liquid crystal display device and liquid crystal display device |
| 12/16/2004 | US20040254337 Contacting a polyether polyol with an epoxy resin (diglycidylether of diphenylolpropane) in the presence of hydrogen fluoride; reduces discoloring because of absence of amine containing curing agents; prepared in low temperature and in limited amount of water |
| 12/16/2004 | US20040254329 Hardenable cyanate compositions |
| 12/16/2004 | DE10321297A1 Flammwidrige duroplastische Massen Flame retardant thermoset composition |
| 12/16/2004 | DE10320543A1 Verfahren zur Herstellung von Präpolymeren auf der Basis von Polysulfiden und Polyepoxiden Process for the preparation of prepolymers based on polysulfides and polyepoxides |
| 12/16/2004 | CA2789741A1 Process for producing modified epoxy resin |
| 12/16/2004 | CA2526512A1 Paste form heat-blowing injection composition and method for injecting and soundproofing closed section of automobile body member |
| 12/16/2004 | CA2526461A1 Process for producing modified epoxy resin |
| 12/15/2004 | EP1486533A1 Polyester resin compositions for profile extrusion and profiles made therefrom |
| 12/15/2004 | EP1486524A1 Epoxide adducts and their salts as dispersing agents |
| 12/15/2004 | EP1486521A1 Curable resins and curable resin compositions containing the same |
| 12/15/2004 | EP1485437A1 Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby |
| 12/15/2004 | EP1485252A1 Epoxy adhesive having improved impact resistance |
| 12/15/2004 | CN1555563A Conductive materials with electrical stability for use in electronics devices |
| 12/15/2004 | CN1554701A Epoxy resin special material of compressed nazural gas cylinder |
| 12/15/2004 | CN1180047C Treating agent for imparting hydrophilicity and high corrosion resistance, hydrophilizing fluid, and method of hydrophilizing |
| 12/15/2004 | CN1180024C Polyester composition and connector |
| 12/15/2004 | CN1180023C Interface treating agent of unsaturated polyester mortar as concrete repairing material |
| 12/15/2004 | CN1180022C Hard transparent epoxy resin resin-base composite material and its synthesis process |
| 12/15/2004 | CN1180010C Stone-like slab with 3D colour pattern composed of uniform particles |
| 12/14/2004 | US6831145 Used in manufacture of electronic, construction, appliance, and aerospace products; coating, adhesive, or gasket |
| 12/14/2004 | US6831129 Printed circuits; fireproofing, waterproofing, bonding strength |
| 12/14/2004 | US6831116 Polymeric modifying agents |
| 12/14/2004 | US6830825 Epoxy resin composition and semiconductor device |
| 12/09/2004 | WO2004106434A1 Resin composition |
| 12/09/2004 | WO2004074359A3 Flame retardant molding compositions containing group iva metal oxides |
| 12/09/2004 | US20040249075 Powder coating compositions having improved mar and acid resistance |
| 12/09/2004 | US20040249072 Used for the production of mouldings; mouldings may, in particular, be produced by injection moulding |
| 12/09/2004 | US20040249060 Curable epoxy resin, hardeners, accelerators with fillers and flexibility agents with colors for potting and crosslinking of polysiloxanes, crosslinking |
| 12/09/2004 | US20040248337 Encapsulant for opto-electronic devices and method for making it |
| 12/09/2004 | US20040248038 Curable composition excellent in optical characteristics |
| 12/09/2004 | US20040247881 Curable flame retardant epoxy resin compositions |
| 12/09/2004 | US20040245114 Thermosetting compositions containing alternating copolymers of isobutylene type monomers |
| 12/08/2004 | EP1484347A1 Resin composition and optical elements |
| 12/08/2004 | EP1483315A1 Continuous filament mat binder system |
| 12/08/2004 | EP1483310A1 Accelerators for cationic photopolymerization |
| 12/08/2004 | EP1303567B1 Volume-modified casting compounds based on polymeric matrix resins |
| 12/07/2004 | US6827980 Solid extrusion coating compositions for metal substrates, a method of extrusion coating a metal substrate, and a metal article are disclosed. The extrusion coating composition is a thermoplastic material and comprises: (a) a polyester having |
| 12/07/2004 | CA2184915C Single-package, duroplastic hardenable coating compound |
| 12/02/2004 | WO2004104125A1 Method of adhering members and an assembly formed thereby |
| 12/02/2004 | WO2004104101A1 Electric conductor provided with an adherent layer and method for the production of said electric conductor |
| 12/02/2004 | WO2004104100A1 Fast crystallizing polyester compositions |
| 12/02/2004 | WO2004104098A2 Stabilized flame retardant additives and their use |
| 12/02/2004 | WO2004104097A1 Epoxy resin composition |
| 12/02/2004 | US20040242834 Blends; heat resistance; semiconductor sealing; reacting phenol with dicyclopentadiene in presence ofacid catalyst |
| 12/02/2004 | US20040242806 Curable resin composition |
| 12/02/2004 | US20040242777 copolymer of isobutylene, diisobutylene, dipentene, or isoprenol with an acceptor monomer comprising acrylic or other functional group monomers, but free of transition metals, Lewis acids, and maleate or fumarate-monomers; crosslinks to clear coat; electrodeposited |
| 12/02/2004 | CA2523546A1 Fast crystallizing polyester compositions |
| 12/01/2004 | EP1482330A1 Fine particle dispersion composition, optical component, optical film laminate, polarization splitting device, and method for manufacturing the optical component |
| 12/01/2004 | EP1481999A2 Thermally-conductive epoxy resin molded article and method of producing the same |
| 12/01/2004 | EP1481420A1 B-stageable underfill encapsulant and method for its application |