| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 02/17/2005 | WO2005014564A1 Epoxy-capped polythioethers |
| 02/17/2005 | WO2005014278A1 A metal-polyamide/polyethylene-metal laminate |
| 02/17/2005 | US20050038279 Proces for the preparation of 9, 10-dihydro-9-oxa-10-organylphosphaphenanthrene-10-oxide and derivatives of the same substituted on the phenyl groups |
| 02/17/2005 | US20050038170 Moldings containing polyarylene ether sulfones, fillers, and additives |
| 02/17/2005 | US20050037207 Improved heat/crack resistance |
| 02/17/2005 | CA2532198A1 A metal-polyamide/polyethylene-metal laminate |
| 02/17/2005 | CA2531039A1 Method for production of objects from thermosetting resins |
| 02/16/2005 | CN1582318A Flame-retardant heat-resistant resin composition and adhesive film comprising the same |
| 02/16/2005 | CN1582308A Solidified composition excellent in optical characteristics |
| 02/16/2005 | CN1580120A Flame-retarded epoxy resin composition and phosphorous compound |
| 02/16/2005 | CN1580108A Phosphorous compound |
| 02/16/2005 | CN1189517C 热固性树脂组合物 The thermosetting resin composition |
| 02/15/2005 | CA2305075C Improved animal chew |
| 02/10/2005 | WO2005012386A1 Epoxy resin composition for sealing and electronic part device |
| 02/10/2005 | WO2004108826A3 Curable flame retardant epoxy resin compositions |
| 02/10/2005 | WO2004104098A3 Stabilized flame retardant additives and their use |
| 02/10/2005 | WO2004087826A3 Method and apparatus for bonding and debonding adhesive interface surfaces |
| 02/10/2005 | US20050032987 Liquid polymers miscible with nonfunctional aromatic end group |
| 02/10/2005 | US20050032938 Epoxy compositions |
| 02/10/2005 | US20050032935 Heat-curable resin composition |
| 02/09/2005 | EP1505121A1 Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product |
| 02/09/2005 | EP1505118A1 PTC compositions based on PVDF and their applications for self-regulated heating systems |
| 02/09/2005 | EP1505090A1 Reactive diluent composition and curable resin composition |
| 02/09/2005 | EP1504892A1 A metal-polyamide/polyethylene-metal laminate |
| 02/09/2005 | EP1504073A1 Heat-curable epoxy resin composition |
| 02/09/2005 | EP1504051A1 Organo-functional polysiloxanes |
| 02/09/2005 | CN1576315A Phenol resin composition and phenol resin copper-clad laminate |
| 02/09/2005 | CN1576295A Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 02/09/2005 | CN1188453C Composition containing styrene-butadiene block copolymer and application thereof |
| 02/08/2005 | US6852767 Active energy beam curable composition having predetermined acid value or amine value and ink containing the same |
| 02/08/2005 | US6852415 Having at least one aminoglycidyl group in the molecule, a curative, and a fluorosurfactant; insulating materials in the production of measuring transducers, bushings, circuit breakers, dry-type transformers, and electrical machinery |
| 02/08/2005 | US6852354 Polymer/substrate and polymer/polymer interfaces and methods of modeling and forming same |
| 02/08/2005 | US6852255 Adjusting a moderate pH range of polysaccharide to activate; cross- linking with poly-functional epoxy compound and producing different shapes of the product |
| 02/08/2005 | CA2128515C Vibration damping constructions using acrylate-containing damping materials |
| 02/03/2005 | WO2005010115A1 Coating compositions comprising epoxy resins and aminofunctional silicone resins |
| 02/03/2005 | WO2005000968A3 Asphalt-epoxy resin compositions |
| 02/03/2005 | US20050025987 Powder coating compositions |
| 02/03/2005 | US20050023665 Curable encapsulant compositions |
| 02/03/2005 | US20050022929 Multi-phase structural adhesives |
| 02/03/2005 | DE10328525A1 Screen printing lacquer for producing ceramic transfer design for decorating ceramics, porcelain and glass contains cationically polymerizable monomer and cationic polymerization initiator |
| 02/02/2005 | EP1502922A1 Curable encapsulant compositions |
| 02/02/2005 | EP1501909A1 Wavelength-converting reactive resinous compound and light-emitting diode component |
| 02/02/2005 | EP1501896A1 Epoxy modified organopolysiloxane resin based compositions useful for protective coatings |
| 02/02/2005 | EP1432488A4 Preparation of oligomeric cyclocarbonates and their use in ionisocyanate or hybrid nonisocyanate polyurethanes |
| 02/02/2005 | CN1572835A Rubber composition for roller and ionic conductive rubber roller using the composition |
| 02/02/2005 | CN1572813A Epoxide adducts and their salts as dispersants |
| 02/02/2005 | CN1187761C Self diagnostic intelligent structure of fiber reinforced resin base composite material and method for self diagnosis |
| 02/02/2005 | CN1187594C Image method for measuring engineering embedding material |
| 02/02/2005 | CN1187389C Die-attaching paste and semiconductor device |
| 02/01/2005 | US6849687 A molding materials comprising a gloss reducing agent, is an addition-condensation copolymer of an epoxidized grafted rubber and a polyether with terminal amines; melt blending |
| 01/27/2005 | WO2005007766A1 Adhesive epoxy composition and process for applying it |
| 01/27/2005 | WO2005007742A1 Resin composition for printed wiring board, prepreg, laminate and printed wiring board using the same |
| 01/27/2005 | WO2005007724A1 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 01/27/2005 | US20050020800 Oligomeric, hydroxy-terminated phosphonates |
| 01/27/2005 | US20050020747 Method of making a finished product |
| 01/27/2005 | US20050020735 Protective coatings; wetting agents; pastes |
| 01/27/2005 | US20050020703 Foaming composition formed with steps and crosslinking with amines |
| 01/27/2005 | US20050019582 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards |
| 01/26/2005 | EP1500690A1 Composition having sealing and sound dampening properties and methods related thereto |
| 01/26/2005 | EP1499677A1 Hydrolysis resistant polyester compositions and related articles and methods |
| 01/26/2005 | EP1499668A1 Hydrolysis resistant polyester elastomer compositions and related articles and methods |
| 01/26/2005 | EP1153986B1 Molded resin and process for producing the same |
| 01/26/2005 | CN1572128A Photoimageable dielectric material for circuit protection |
| 01/26/2005 | CN1571805A Hardenable cyanate compositions |
| 01/26/2005 | CN1186389C In-situ and inclusion polymerization process of preparing composite particle/epoxy resin nano material |
| 01/26/2005 | CN1186388C Semiconductor packing epoxy resin composition and its making process and semiconductor device |
| 01/26/2005 | CN1186387C Method for preparing epoxy resin composition for sealing optoelectronic semiconductor elements |
| 01/26/2005 | CN1186370C Water absorption composition and its use |
| 01/20/2005 | WO2005006826A1 Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them |
| 01/20/2005 | WO2004101349A3 Activatable material for sealing, baffling or reinforcing and method of forming same |
| 01/20/2005 | US20050014928 Reacting a epoxy resin with aniline compound |
| 01/20/2005 | US20050014910 Blend of epoxy resin anf (di- or tri) thio toughener |
| 01/20/2005 | US20050014908 Adhesive for gas barrier laminates and laminated films |
| 01/20/2005 | US20050012244 Method for preparing and processing a sample for intensive analysis |
| 01/20/2005 | DE10329228A1 Wear-resistant polymer composite for production of plain bearings, gear wheels and seals, contains polymer matrix, filler such as graphite and-or glass fibres, and nano-scale particles, e.g. titanium dioxide |
| 01/19/2005 | EP1498442A2 Method for the preparation of a polyester block copolymer, a polyester block copolymer composition and method for the preparation thereof |
| 01/19/2005 | EP1497369A1 Surface improver for reinforced composite compositions |
| 01/19/2005 | EP1497079A1 Coated abrasive article |
| 01/19/2005 | CN1568350A Flame-retardant polyethylene terephthalate resin composition |
| 01/19/2005 | CN1567608A Wavelength-converting casting composition and white light-emitting semiconductor component |
| 01/19/2005 | CN1566208A Epoxy resin/nano rubber micropowder hybrid composites and use thereof |
| 01/19/2005 | CN1185275C Acid catalysis polymerization of epoxy resin aqueous emulsion and its application |
| 01/18/2005 | US6844379 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders |
| 01/18/2005 | US6844072 Low gloss powdered paints and varnishes; flowable, flexible; weather resistance; isophthalic acid containing amorphous polyester binder, semicrystalline polyester, glycidyl functionalized acrylic copolymer and curing agent |
| 01/13/2005 | WO2005003208A1 Epoxy resin composition |
| 01/13/2005 | US20050010003 Reacting a mercaptan with epoxide; using free radical catalyst |
| 01/13/2005 | US20050009975 Mixture of epoxy resin, curing agrent, ceramic powder and polarity adjuster; printed circuit and capacitor embedded in printed circuit |
| 01/13/2005 | US20050008964 Composition for forming anti-reflective coating for use in lithography |
| 01/13/2005 | US20050008882 Phenol resin composition and phenol resin copper-clad laminate |
| 01/13/2005 | US20050008868 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg |
| 01/13/2005 | US20050008866 High toughness vinylester and/or epoxy resin-based material, its process of manufacture, composite material comprising it and uses thereof |
| 01/12/2005 | EP1496094A2 An adhesive sheet based on a siloxane-modified polyamideimide resin composition, and a CSP board and a semiconductor device produced by using the sheet |
| 01/12/2005 | EP1496078A1 Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 01/12/2005 | EP1461387A4 Prepreg and composition of epoxy resin(s), sma copolymers(s) and bis-maleimide triazine resin(s) |
| 01/12/2005 | EP1138731B1 Coating composition |
| 01/12/2005 | CN1564968A Composition for forming antireflection film for lithography |
| 01/12/2005 | CN1563184A Colored cementing agent in use for road and preparation method |
| 01/12/2005 | CN1563152A Polymer type phosphatic fire retardant, preparation method and usage |
| 01/12/2005 | CN1184261C Reversible epoxy resin gel and its curing agent |
| 01/12/2005 | CN1184260C Noncrystalline cyclic polyolefin/epoxidized diene block copolymer composition and sheet |