| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 03/30/2005 | CN1601380A 干燥薄膜光阻剂 Dry film photoresist |
| 03/30/2005 | CN1600810A Curable epoxy resin composition, and process for the production of shaped articles therefrom |
| 03/30/2005 | CN1600809A Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 03/24/2005 | WO2004109816A3 Encapsulant for opto-electronic devices and method for making it |
| 03/24/2005 | US20050065296 Adhesive composition and adhesive film |
| 03/24/2005 | US20050065294 Electrically insulative powder coatings and compositions and methods for making them |
| 03/24/2005 | US20050065243 Aqueous material for a system to protect against corrosion |
| 03/24/2005 | US20050065241 Sealing epoxy resin; reducing sdielectrics: toughness |
| 03/24/2005 | US20050064201 Resin composition for encapsulating semiconductor device |
| 03/24/2005 | US20050064200 Polycarbodiimides; for electronic parts and lamination treatments; improved storage stability, adhesive strength, and high elastic modulus at high temperatures; for adhesion of copper foil onto glass fiber reinforced epoxy resin substrate |
| 03/24/2005 | US20050061429 Comprises oxetane compounds, cyclic epoxy compound, and catalytic photoinitiator; actinic radiation curable |
| 03/23/2005 | EP1517367A2 Resin composition for encapsulating semiconductor device |
| 03/23/2005 | EP1516891A1 A binder composition for lamination and an adhesive film using the same |
| 03/23/2005 | EP1516030A1 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 03/23/2005 | CN1599770A Heat-curable resin composition |
| 03/23/2005 | CN1598970A Electrically insulative powder coatings and compositions and methods for making them |
| 03/23/2005 | CN1597775A Preparation technology for composite of epoxy resin nano silicon dioxide |
| 03/23/2005 | CN1597774A Preparation process for composite of rare earth modified carbon-fibre / epoxy resin |
| 03/23/2005 | CN1597773A Preparation process of high-strength high-toughness nano calcium carbonate and epoxy composite material |
| 03/23/2005 | CN1597768A Process for producing resin composition, modifier for polyester resin, and process for producing modified polyester resin |
| 03/23/2005 | CN1194038C Epoxy resin composition, laminated material and metal lamina laminate |
| 03/22/2005 | CA2320545C Energy ray curing resin composition |
| 03/17/2005 | WO2005024939A1 SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS |
| 03/17/2005 | WO2005024938A1 Solvent-modified resin compositions and methods of use thereof |
| 03/17/2005 | US20050058787 Filling structure |
| 03/17/2005 | US20050058772 applying epoxy resins containing metal intercalated aluminosilicates or clays and diluents, to damaged mica dielectrics, then curing to form uniform patches for maintenance |
| 03/17/2005 | DE10338116A1 Verfahren zur Herstellung von 9,10-Dihydro-9-oxa-10-organyl-phosphaphenanthren-10-oxid und an den Phenylgruppen substituierten Derivaten desselben Process for the preparation of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-organyl-oxide and on the phenyl groups substituted derivatives thereof |
| 03/17/2005 | CA2537828A1 Solvent-modified resin system containing filler that has high tg, transparency and good reliability in wafer level underfill applications |
| 03/17/2005 | CA2537827A1 Solvent-modified resin compositions and methods of use thereof |
| 03/16/2005 | EP1513890A1 Halogen free ignition resistant thermoplastic resin compositions |
| 03/16/2005 | EP1434831B1 Stabilized coating compositions |
| 03/16/2005 | EP1287063B1 Epoxy-resin systems, which are resistant to ageing, moulding materials and components produced therefrom and the use thereof |
| 03/16/2005 | EP1257606B1 Powdered thermosetting composition for coatings |
| 03/16/2005 | CN1594428A Nano SiO2 polyester composite materials and industrial yarn preparation process |
| 03/16/2005 | CN1594427A Process for preparing water soluble epoxy resin grouting agent |
| 03/16/2005 | CN1594426A Heat-curable resin composition and use thereof |
| 03/16/2005 | CN1594425A Epoxy resin complex with long chemical storage stability and temperature thixotropy |
| 03/16/2005 | CN1594402A Method for preparing polymer/laminated silicate nano composite materials |
| 03/15/2005 | US6867282 Photocurable and thermosetting resin composition |
| 03/15/2005 | US6866376 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink |
| 03/15/2005 | CA2279516C Epoxy-polysiloxane polymer composition |
| 03/10/2005 | WO2005021647A1 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
| 03/10/2005 | WO2005021646A2 Low odor binders curable at room temperature |
| 03/10/2005 | WO2004113066B1 A metal-cured polyethylene-metal laminate |
| 03/10/2005 | US20050054776 superior thermal-stress-reducing effects; adhesive for printed circuit manufacture; cured film obtained from a modified polyamideimide resin, a thermosetting resin and an organic phosphorus-based compound |
| 03/10/2005 | US20050054756 Curable resins and curable resin compositions containing the same |
| 03/10/2005 | CA2537688A1 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
| 03/09/2005 | EP1512722A1 Processes for preparing tougheners for thermoset compositions |
| 03/09/2005 | EP1512690A1 Process for the preparation of 9,10-dihydro-9-oxa-10-organyl-phosphaphenanthren-10-oxide and derivatives thereof |
| 03/09/2005 | EP1425330B1 Network polymers comprising epoxy-terminated esters |
| 03/09/2005 | CN1192059C Polymer blends, its use and moulded product made thereof |
| 03/09/2005 | CN1192041C Polymer and epoxy resin compositions |
| 03/08/2005 | US6864318 Thermoplastic compositions comprising a crosslinked phase |
| 03/08/2005 | US6864317 Curable compositions |
| 03/08/2005 | US6863701 Accelerators for cationic photopolymerizations |
| 03/08/2005 | CA2158859C Increasing the molecular weight of polyesters and premix useful for this process |
| 03/03/2005 | WO2005019297A1 Curable compositions of acyl epoxides, cycloaliphatic epoxides, and aryl polyols, and network polymers therefrom |
| 03/03/2005 | US20050049364 Melt kneading mixture of epoxy midified polyolefin, epoxy resins |
| 03/03/2005 | US20050049361 Processes for preparing tougheners for thermoset compositions |
| 03/03/2005 | US20050049352 Solvent-modified resin compositions and methods of use thereof |
| 03/03/2005 | US20050049334 Mixture of polymer, silica filler and solvent; encapsulation of electron chips |
| 03/03/2005 | US20050048700 No-flow underfill material having low coefficient of thermal expansion and good solder ball fluxing performance |
| 03/03/2005 | US20050045295 Low odor binders curable at room temperature |
| 03/03/2005 | US20050045294 Low odor binders curable at room temperature |
| 03/03/2005 | DE10336387A1 Biologisch abbaubare Polyestermischung Biodegradable polyester blend |
| 03/03/2005 | DE10335613A1 Mold-making set, used for treating mold-making model before making mold, e.g. for producing car components, comprises polyester resin, hardener, sealant and release agent |
| 03/03/2005 | DE10326147A1 Epoxid-Addukte und deren Salze als Dispergiermittel Epoxide adducts and their salts as a dispersant |
| 03/03/2005 | CA2537634A1 Nano-filled composite materials with exceptionally high glass transition temperature |
| 03/02/2005 | EP1351759B1 Dispersing agent |
| 03/02/2005 | EP0949286B1 Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
| 03/02/2005 | EP0764180B9 Curable compositions |
| 03/02/2005 | CN1589290A Process for the alkoxylation of organic compounds |
| 03/02/2005 | CN1589289A Process for the polymerisation of epoxy resins |
| 03/02/2005 | CN1191301C Photosensitive resin composite for gap body of liquid crystal display |
| 03/01/2005 | US6861455 Composition for bulkhead of thin display panel |
| 02/24/2005 | WO2005018298A2 Electromagnetic wave absorber |
| 02/24/2005 | WO2005017490A2 Method for preparing and processing a sample for intensive analysis |
| 02/24/2005 | WO2005017057A1 Solventless, non-polluting radiation and thermally curable coatings |
| 02/24/2005 | WO2005017034A1 Biodegradable polyester mixture |
| 02/24/2005 | WO2005016987A1 Curable compositions having a reduced enthalpy output |
| 02/24/2005 | US20050043506 Polyamide materials based on unsaturated carboxylic acids and amines |
| 02/24/2005 | US20050043502 The polyimide contains 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane and the addition-condensation polyamide contains carboxylated polybutadiene with an optional acrylonitrile block; low elasticity, excellent flexibility and heat resistance |
| 02/24/2005 | US20050043446 an extruded reaction product of bisphenol A, diglycidyl ether with bisphenol A, used as packaging coatings for containers such as beverage cans; bonding strength |
| 02/24/2005 | US20050042537 Color-changing material composition and color-changing membranes made by using the same |
| 02/24/2005 | US20050042458 siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass; cationically curable in air by heat or by electron beam radiation; adhesion, flexibility, weatherability, and corrosion resistance |
| 02/23/2005 | EP1508584A1 Adhesive resin and film adhesives made by using the same |
| 02/23/2005 | EP1507830A1 Compliant overprint varnishes |
| 02/23/2005 | EP1507829A1 Fire retardant resin composition, method of its production, shaped articles comprising the same, and silica |
| 02/23/2005 | EP1507828A1 Process for making a thermoplastic composition comprising dynamic cross-linking |
| 02/23/2005 | CN1585792A Network polymers comprising epoxy-terminated esters |
| 02/23/2005 | CN1583933A Anti-skid materials, preparing method and use thereof |
| 02/23/2005 | CN1583876A Redix composition |
| 02/23/2005 | CN1583875A Epithio-epoxy composite resin and preparing process thereof |
| 02/23/2005 | CN1583874A Method for improving antigen oxygen peeling of aircraft by adding nanometer partical material |
| 02/23/2005 | CN1583873A High temperature cracking additive for package material at bottom of repairable reversed-installing chips |
| 02/23/2005 | CN1190801C Aeolotropic conductive adhering film |
| 02/22/2005 | US6858304 Made by copolymerizing diisopropenylbenzene with a mixture of phenol and 2-isopropenylphenol; copolymers with high glass transition temperature, low dielectric constant, low moisture absorption, low coefficient of expansion |
| 02/22/2005 | US6858260 Irradiation crosslinking a mixture of an epoxy compound, polyol like a polyetherpolyol or a polyesterpolyol, and a photoinitiator and applying the exposed composition onto a substrate thereby forming a coating upon the substrate. |
| 02/17/2005 | WO2005014745A1 Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming |
| 02/17/2005 | WO2005014699A1 Method for production of objects from thermosetting resins |