| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 05/10/2005 | US6890991 Thermoplastic resin containing mixed powder of polytetrafluoroethylene having specified particle diameter and graft polymer of polyorganosiloxane rubber and polyalkyl (meth)acrylate rubber with vinyl monomer having epoxy group |
| 05/10/2005 | US6890678 Separator for fuel cell |
| 05/10/2005 | US6889719 Plastic pipe and manufacturing method therefor |
| 05/10/2005 | CA2278018C High-melting polyamide resin compositions and molded articles thereof |
| 05/06/2005 | WO2005040278A1 Polytrimethylene terephthalate reinforced resin composition |
| 05/06/2005 | WO2005040277A1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 05/06/2005 | WO2005040055A1 Uv hardening glass printing ink and uv hardening glass printing lacquer and method for printing a glass substrate |
| 05/06/2005 | WO2005021646A3 Low odor binders curable at room temperature |
| 05/06/2005 | CA2540552A1 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 05/05/2005 | US20050096432 Two-pack type adhesive |
| 05/05/2005 | US20050096403 Method of making polyurea containing automobile body parts |
| 05/05/2005 | US20050095435 Crosslinking using brominated bisphenol a,or diglycidyl ether thereof; laminate for electronics, printed circuits |
| 05/05/2005 | US20050095434 Halogen-free flame retarders; mixture of polymaleimide with epoxy , phenolic resin |
| 05/04/2005 | EP1528090A1 Epoxy resin powder coating material |
| 05/04/2005 | EP1527134A1 Thermoplastic composition having low gloss appearance |
| 05/04/2005 | EP1451011A4 Autodeposition compositions |
| 05/04/2005 | EP1155084B9 Sound deadening and structural reinforcement compositions and methods of using the same |
| 05/04/2005 | CN1200040C Active organic-inorganic nano calcium carbonate mixture and its prepn process |
| 05/04/2005 | CN1200039C Fragrant furan resin and its preparing process |
| 05/03/2005 | US6888257 Useful for integrated circuit packages enabling conducting heat generated by the die |
| 05/03/2005 | US6887967 Polyimide resin produced by reacting a prepolymer with an isocyanate group at the end obtained by reacting a polyisocyanate compound with a polyol compound having a linear hydrocarbon structure with an anhydride |
| 05/03/2005 | US6887951 Solvent based epoxy-phenoxy solution and lacquers or inks formed therefrom |
| 05/03/2005 | US6887914 Structural hot melt material and methods |
| 05/03/2005 | US6887737 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom |
| 05/03/2005 | US6887574 Curable flame retardant epoxy compositions |
| 04/28/2005 | WO2005037888A1 Epoxy resin composition and semiconductor device |
| 04/28/2005 | US20050090627 highly reactive, epoxy-functional powder coating compositions which can be cured at very low temperatures and are suitable in particular for producing plastics and high-gloss or matt, light-stable and weather-stable powder coatings |
| 04/28/2005 | US20050090626 Adhesive compositions |
| 04/27/2005 | EP1525227A2 Nanocomposite, method for production and use thereof |
| 04/27/2005 | EP1470194A4 Elastomer-modified epoxy siloxane compositions |
| 04/27/2005 | EP1138704B1 Curable compositions |
| 04/27/2005 | CN1610103A Electric insulated resin pulp used for chip carrying and packaging |
| 04/27/2005 | CN1609142A Synthesis process of dielectric material for high speed transmission |
| 04/27/2005 | CN1198896C Non-continuous place of cladding and method for sealing discontinuous place |
| 04/27/2005 | CN1198875C Printing circuit board constituted by assembling process |
| 04/27/2005 | CN1198863C Energy ray solidification type resin composition |
| 04/26/2005 | US6884854 A thermally curable formulation containing an epoxy resin, a copolymer having glass transition temp. of -30 degree C. or lower and epoxy reactive group or reaction product with epoxy resin, a hardner, and a polyamide or polyimde or mixture |
| 04/22/2005 | CA2485629A1 Low-temperature-curing epoxy-functional powder coating compositions |
| 04/21/2005 | WO2005035669A2 Surface treated silicas |
| 04/21/2005 | WO2005035654A1 Resin composition for protective film |
| 04/21/2005 | US20050085568 Epoxy resin composition and semiconductor device |
| 04/21/2005 | US20050085564 Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls |
| 04/21/2005 | US20050082691 Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 04/21/2005 | US20050082338 Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 04/21/2005 | CA2541496A1 Resin composition for protective film |
| 04/20/2005 | EP1524306A1 Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 04/20/2005 | EP1524285A1 Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 04/20/2005 | EP1523530A1 Superprimer |
| 04/20/2005 | EP1523524A1 Novel coating compositions for high temperature pipes |
| 04/20/2005 | EP1019247B1 Sealant composition, article including same, and method of using same |
| 04/20/2005 | CN1608109A Powdered epoxy composition |
| 04/20/2005 | CN1608092A Adhesive of expoxy compound, aliphatic amine and tertiary amine |
| 04/20/2005 | CN1607662A Method and structure for self healing cracks in underfill material between an i/c chip and a substrate bonded together with solder balls |
| 04/20/2005 | CN1607218A Curable encapsulant compositions |
| 04/20/2005 | CN1197893C Thermosetting resin compositions useful as underfill sealants |
| 04/20/2005 | CN1197891C Aqueous two-component cross-linkable composition |
| 04/19/2005 | US6881813 Mercaptan hardener and a metal salt of a carbon 8-24 carboxylic acid |
| 04/19/2005 | US6881812 Latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are |
| 04/19/2005 | US6881799 Curing agent for epoxy resins and epoxy resin composition |
| 04/19/2005 | US6881768 A tile grout composition and method of using the tile grout composition to grout set tiles are provided. The tile grout composition is a water-based epoxy grout composition which has excellent stain and chemical resistant properties and is |
| 04/19/2005 | US6881293 Process for producing a multi-layer printer wiring board |
| 04/14/2005 | WO2005033203A1 Potting compound, use thereof and components encapsulated in said potting compound |
| 04/14/2005 | WO2005033172A1 Resin formulation, uses thereof, and moulded body produced therefrom |
| 04/14/2005 | WO2005033171A1 Aqueous binding agents for anticorrosive systems |
| 04/14/2005 | US20050080204 Silicone resin composition, curable resin composition, and curable resin |
| 04/14/2005 | US20050080200 For automobiles, electronics; reducting volatile organic compounds when melted; waterproofing |
| 04/13/2005 | EP1414895B1 Flame retardant molding compositions |
| 04/13/2005 | EP0931816B1 Norbornene polymer composition |
| 04/13/2005 | EP0898595B1 Method for extrusion coating using polyester compositions |
| 04/13/2005 | CN1606597A Transparent composite composition |
| 04/13/2005 | CN1605599A Epoxy resin composition with high content filling and method for making same |
| 04/13/2005 | CN1196756C Resin compositions for coatings |
| 04/13/2005 | CN1196748C Resin composition curable with actinic energy ray |
| 04/12/2005 | US6878783 A curable blends comprising a cyclic polymer of epoxy resin, curing agent hexahydro-4-methylphthalic anhydride, boron compound halogen-free catalyst; use for packaging a chip, light emitting diode; resist to heat, oxidation, radiation |
| 04/12/2005 | US6878448 Curability, moldability and mass productivity, reliability |
| 04/07/2005 | WO2005030894A2 Adhesive compositions |
| 04/07/2005 | US20050075474 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 04/07/2005 | US20050075024 Flame retardant epoxy prepregs, laminates, and printed wiring boards of enhanced thermal stability |
| 04/07/2005 | US20050072459 Barrier layer made of a curable resin containing polymeric polyol |
| 04/07/2005 | DE4437730B4 Zusammensetzungen auf der Basis von Polyphenylensulfid mit verbesserter Stoßfestigkeit und Verfahren zu ihrer Herstellung Compositions based on polyphenylene sulphide with improved impact strength and processes for their preparation |
| 04/06/2005 | EP1520867A2 Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
| 04/06/2005 | CN1196028C Stereolithographic composition for preparing polyethylene-like articles |
| 04/06/2005 | CN1195787C Method of manufacturing a replica as well as a replica obtained by carrying out a UV light-initiated cationic polymerization |
| 04/05/2005 | US6875825 Composition of bisphenol or novolak epoxy resin, epoxy resin from monoaromatic backbone and aromatic amine |
| 03/31/2005 | WO2005028583A1 Destructuring agent for an adhesive composition, and glue and primer forming said composition |
| 03/31/2005 | WO2005028545A1 Binder resin for toner, method for producing same, and toner for electrophotography using such resin |
| 03/31/2005 | WO2005028537A1 Photocuring resin composition containing organic polymer having epoxy group and/or oxethane group-containing silicon group at end, and method for producing same |
| 03/31/2005 | WO2005028536A1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition |
| 03/31/2005 | US20050070664 Curing mixture of polyolefin and thermosetting resin; sealing, encapsulating semiconductor |
| 03/31/2005 | US20050070634 Process for applying a streamable epoxy adhesive |
| 03/31/2005 | US20050069715 A curable compound, or adduct, or epoxy resins of anthrahydroquinone and epichlorohydrin; phenolic resin as curing agents; cured product is used for semiconductor encapsulation; solid, low melt viscosity, flame retardance, halogen-free; mechanical strength, heat resistance, moisture resistance |
| 03/31/2005 | US20050069708 contacting the silica particles with a trimethylsilanol terminated polysiloxane; and contacting the silica particles with an organosilane compound |
| 03/31/2005 | US20050067284 Cationic coating composition and coating film-forming method |
| 03/31/2005 | CA2538698A1 Process for producing rubbery polymer particle and process for producing resin composition containing the same |
| 03/30/2005 | EP1519389A1 Electrically insulative powder coatings and compositions and methods for making them |
| 03/30/2005 | EP1518899A2 Photocurable adhesive and bonding process employing same |
| 03/30/2005 | EP1518889A1 Curable reactive resin system |
| 03/30/2005 | EP1086972B1 Hardener for epoxy resin, epoxy resin composition, and process for producing silane-modified phenolic resin |
| 03/30/2005 | EP0843894B1 Encapsulant with fluxing properties and method of use |
| 03/30/2005 | CN1602256A Method of making models |