| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 06/15/2005 | CN1626577A Resin composition, prepreg and laminate using the composition |
| 06/15/2005 | CN1206277C Preparation method of rare earth modified fanglun fiber/epoxy composite material |
| 06/15/2005 | CN1206276C Coherent insert |
| 06/15/2005 | CN1206223C Flame-retarding nitrogenous epoxy resin and its composition |
| 06/14/2005 | US6906152 Rubber compositions |
| 06/14/2005 | US6906120 Poly(arylene ether) adhesive compositions |
| 06/14/2005 | US6905768 Epoxy resin composition and electronic part |
| 06/14/2005 | US6905757 Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminate |
| 06/09/2005 | WO2005052054A1 Organic fibre based on an epoxy resin and a rheology-controlling agent and corresponding dry goods |
| 06/09/2005 | US20050123768 Hardeners |
| 06/09/2005 | US20050120671 Water-based epoxy grout |
| 06/09/2005 | DE102004022108A1 Homogen durchfärbte, bewitterungsstabile Zusammensetzungen auf Basis schlagzähmodifizierter Polyalkylenterephthalat/Polycarbonat Blends Homogeneously colored, weather-resistant compositions based on impact-modified polyalkylene terephthalate / polycarbonate blends |
| 06/08/2005 | EP1538182A1 Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby |
| 06/08/2005 | EP1274770B1 High strength polymers and aerospace sealants therefrom |
| 06/08/2005 | CN1625582A Barrier layer made of a curable resin containing polymeric polyol |
| 06/08/2005 | CN1624045A Paste composition, and protective film and semiconductor device both obtained with the same |
| 06/08/2005 | CN1624044A Polyol phosphorous acid esters fire resistant epoxy |
| 06/08/2005 | CN1205265C Filled epoxy resin system having high mechanical strength values |
| 06/08/2005 | CN1205264C Epoxy resins and stable aqueous dispersions thereof |
| 06/07/2005 | US6903144 Non-aqueous solvent-free process for making UV curable adhesive and sealants from expodized monohydroxylated diene polymers |
| 06/07/2005 | US6902689 Epoxy, epoxy system, and method of forming a conductive adhesive connection |
| 06/02/2005 | WO2005049734A1 Oligomers and polymers containing hydrolysates and/or condensates of epoxide groups and silane groups, method for their production and use thereof |
| 06/02/2005 | WO2005049729A1 Weather-resistant compositions based on polyalkylene terephthalate/polycarbonate blends with modified impact resistance and moulded-in colour |
| 06/02/2005 | WO2005048866A2 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds |
| 06/02/2005 | WO2005017490A3 Method for preparing and processing a sample for intensive analysis |
| 06/02/2005 | US20050119381 Thermosetting resin composition and laminates and circuit board substrates made by using the same |
| 06/02/2005 | US20050119371 Bio-based epoxy, their nanocomposites and methods for making those |
| 06/02/2005 | US20050118430 Resin composition and optical element |
| 06/02/2005 | US20050116203 Conductive composition, conductive film, and process for the formation of the film |
| 06/02/2005 | CA2545998A1 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds |
| 06/01/2005 | EP0836627B2 Polymer material, process for its production and use thereof |
| 06/01/2005 | CN1622963A Oligomeric chain extenders for processing, post-processing and recycling of condensation polymers, synthesis, compositions and applications |
| 06/01/2005 | CN1622230A High temperature resistant rare earth magnet composition and magnet |
| 06/01/2005 | CN1621482A Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 06/01/2005 | CN1621481A Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 06/01/2005 | CN1621444A Thermosetting resin composition, presoaking materials and laminated sheet for printed circuit using same |
| 06/01/2005 | CN1621443A Flame retardant epoxy resin and its composition |
| 06/01/2005 | CN1204194C Free radical polymerized resin composite |
| 06/01/2005 | CN1204170C Preparation method of nano particles with high refractive index and polymer nano composite film material |
| 05/31/2005 | US6900279 gelled copolymer comprising one or more residues of a first polymerizable ethylenically unsaturated monomer containing a pendant amide, ester or carboxylic acid group; multi-layer composite coatings |
| 05/31/2005 | US6900269 Halogen-free resin composition |
| 05/31/2005 | US6899917 Coating electrical coils; mixture of epoxy and phenolic resin |
| 05/26/2005 | WO2005047393A1 Reactive hot melt adhesive |
| 05/26/2005 | WO2005047390A1 Coating/pretreatment composition and methods of using the same |
| 05/26/2005 | WO2005047379A1 Unsaturated polyester resin or vinyl ester resin compositions having reduced gel-time drift tendency |
| 05/26/2005 | WO2005047370A2 Bio-based epoxy, their nanocomposites and methods for making those |
| 05/26/2005 | WO2005047347A1 Polyacrylic hydrazide and crosslinking or curing agent for resin |
| 05/26/2005 | US20050113536 A curable epoxy resin free of aromatic units comprising a curing agent selected from the polyamines, polyamides, anhydrides, and titanium oxide reflector particles; use as binders in binding scintillator elements in detectors |
| 05/26/2005 | US20050113534 Stabilized polycarbonate polyester composition |
| 05/26/2005 | US20050113493 polyalkylene terephthalate, aromatic polycarbonate, a graft polymer based on polybutadiene a graft polymer based on acrylate , a UV stabilizer and a coloring agent is suitable for making a variety of finished and semi finished products suitable for uses in the exterior of motor vehicles |
| 05/26/2005 | US20050113488 Treated with a polysiloxane and then an organosilane compound with at least one long-chain hydrocarbon group; rheology modifier in epoxy polymer materials, but can also be used in polyurethanes, polyesters, silicones, and hydrocarbon oils |
| 05/26/2005 | US20050112391 Extrusion coating compositions and method |
| 05/26/2005 | CA2543624A1 Polyacrylic hydrazide and crosslinking or curing agent for resin |
| 05/25/2005 | EP1533328A1 Curable compositions |
| 05/25/2005 | EP1532219A1 Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming |
| 05/25/2005 | DE10349394A1 UV-härtendes Bindemittel für Farben oder Lacke zur Bedruckung von Glas und Verfahren zur Bedruckung von Glassubstraten UV-curable binders for paints or varnishes for printing on glass and method for printing on glass substrates |
| 05/25/2005 | DE10348965A1 Epoxidgruppenhaltige Pulverlackzusammensetzungen, die bei niedrigen Temperaturen aushärten Epoxy group-containing powder coating compositions which cure at low temperatures |
| 05/25/2005 | CN1618845A Method for producing molding compound resin tablet and method for manufacturing white light emitting diode by using the production method |
| 05/25/2005 | CN1203150C Photocurable resin composition for sealing material and method of sealing |
| 05/25/2005 | CN1203146C Aqueous system solidifying resin composition and method for forming film or multilayer film using said composition |
| 05/25/2005 | CN1203104C Epoxy resin composition for semiconductor encapsulation |
| 05/24/2005 | US6896967 Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 05/19/2005 | WO2005044920A1 Curable silicone composition and cured product thereof |
| 05/19/2005 | WO2005018298A3 Electromagnetic wave absorber |
| 05/19/2005 | US20050107580 Epoxy polymer precursors and epoxy polymers resistant to damage by high-energy radiation |
| 05/19/2005 | US20050104244 Method for producing molding compound resin tablet for wavelength conversion, and method for manufacturing white light emitting diode by using the production method |
| 05/19/2005 | US20050103422 Steel-plate-reinforcement resin composition, steel plate reinforcing sheet, and reinforcing method of steel plate |
| 05/19/2005 | DE10392286T5 Beschichtungszusammensetzung und Verfahren zur Bildung eines Beschichtungsfilms The coating composition and method for forming a coating film |
| 05/19/2005 | DE10342616A1 Mixture of epoxy resin and a polymer with epoxide groups made by radical polymerisation, e.g. butyl acrylate-glycidyl methacrylate copolymer, used as adhesive, especially as a structural adhesive for metal, wood or plastics |
| 05/18/2005 | EP1531040A2 Method of reinforcing a steel plate with a resin rubber composition |
| 05/18/2005 | EP1530617A1 Epoxy compositions having improved shelf life and articles containing the same |
| 05/18/2005 | CN1617902A Method of making a finished product |
| 05/18/2005 | CN1617899A Radiation curable resin composition for making colored three dimensional objects |
| 05/18/2005 | CN1616579A Resin composition for encapsulating semiconductor device |
| 05/18/2005 | CN1616549A Energy-ray curing resin composition |
| 05/18/2005 | CN1616547A Resin composition, prepreg and laminate using the composition |
| 05/18/2005 | CN1616546A Strengthening carbon fiber composite material and method for repairing defective pipeline |
| 05/18/2005 | CN1202174C Resin composition, molded article therefrom, and utilization thereof |
| 05/18/2005 | CN1202154C Glycidyl ether group-contg. partial alkoxysilane condensate, silane-modified resin, compsns. of these, and processes for producing these |
| 05/17/2005 | US6894123 Wash primers in automotive and refinish coatings |
| 05/17/2005 | US6894113 Radiation transparent; block polymers |
| 05/17/2005 | US6894112 Thermally stable polyester molding materials |
| 05/17/2005 | US6894091 Of epoxy resin, phenolic resin curing agent, a molybdenum compound, and an inorganic filler, where given weight percent nitrogen atoms are contained in the the epoxy resin and/or phenolic resin; cures to flame retardant, heat resistance |
| 05/17/2005 | US6893784 Carboxyl group-containing photosensitive resin, alkali-developable, photocurable and thermosetting composition containing the same, and cured products thereof |
| 05/17/2005 | US6893736 Thermosetting resin compositions useful as underfill sealants |
| 05/12/2005 | WO2005042630A2 Two component curable compositions |
| 05/12/2005 | US20050101748 low viscosity at room temperature which can be sustained with good stability for long periods, is easy to handle, produces a cured product with excellent heat resistance and superior mechanical characteristics such as compression and tensile characteristics and impact resistance; aircraft components |
| 05/12/2005 | US20050101747 Processes for preparing thermoset compositions and tougheners |
| 05/12/2005 | US20050101734 Acrylic adhesive sheet |
| 05/12/2005 | US20050101709 mixture of epoxy resins, curing agent and flame retarders used as seals for light emitting diodes; reliability and transparency within a broad temperature range |
| 05/12/2005 | US20050101699 Process for making encapsulant for opto-electronic devices |
| 05/12/2005 | US20050101123 Via-filling material and process for fabricating semiconductor integrated circuit using the material |
| 05/12/2005 | US20050100738 Resin composition, prepreg and laminate using the composition |
| 05/11/2005 | EP1529807A2 Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 05/11/2005 | EP1474489A4 Coating composition for protecting dazzling effect |
| 05/11/2005 | CN1614447A Fine particle dispersion composition, optical component, optical film laminate, polarization splitting element |
| 05/11/2005 | CN1613911A Epoxy composition for light semiconductor packing |
| 05/11/2005 | CN1613910A Epoxy composition for light semiconductor packing |
| 05/11/2005 | CN1200970C Modified dimaleimide resin and its preparation method and application in cladding copper plate |
| 05/10/2005 | US6890997 Form powder coatings with a low gloss; free radical curable epoxy resins, or a curable unsaturated polyester, with a wax and free radical photoinitiator and crystalline crosslinking resin; specified particle size |