| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 07/14/2005 | US20050152869 Marine anti-bio-fouling coating and a method of applying the coating |
| 07/14/2005 | DE10359349A1 Verfahren zur Herstellung von Acrylatschmelzhaftklebern A process for producing acrylic hotmelt PSAs |
| 07/14/2005 | DE10359348A1 Klebemasse Adhesive |
| 07/14/2005 | DE10357712A1 Härter Hardener |
| 07/14/2005 | DE10357355A1 2 K Klebstoffe für den Fahrzeugbau 2K adhesives for the automotive industry |
| 07/13/2005 | EP1553450A1 Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
| 07/13/2005 | EP1553138A1 Flame-retardant polybutylene terephthalate resin composition and moldings |
| 07/13/2005 | CN1639852A B-stageable underfill encapsulant and method for its application |
| 07/13/2005 | CN1639263A Elastomer-modified epoxy siloxane compositions |
| 07/13/2005 | CN1639261A Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
| 07/13/2005 | CN1639257A 固化性环氧树脂组合物 Curable epoxy resin composition |
| 07/13/2005 | CN1639236A Continuous filament mat binder system |
| 07/13/2005 | CN1639204A Thermosetting compositions containing alternating copolymers of isobutylene type monomers |
| 07/13/2005 | CN1639174A Oligomeric, hydroxy-terminated phosphonates |
| 07/13/2005 | CN1637107A 改进的粘合剂 Improved adhesive |
| 07/13/2005 | CN1637090A Water paint composition and coated articles |
| 07/13/2005 | CN1637037A Hardeners |
| 07/13/2005 | CN1637026A Processes for preparing tougheners for thermoset compositions |
| 07/13/2005 | CN1636987A Epoxy compound, preparation method thereof, and use thereof |
| 07/13/2005 | CN1210620C Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 07/13/2005 | CN1210441C Water-based treating agent for metal surface and metal material treated by the same |
| 07/13/2005 | CN1210349C Siloxanes compsn. for treating woolen material |
| 07/13/2005 | CN1210325C Liquid epoxy resin emulsions, method for production and use thereof |
| 07/12/2005 | US6916889 Epoxy resin compositions, solid state devices encapsulated therewith and method |
| 07/12/2005 | US6916874 Coating compositions having epoxy functional stabilizer |
| 07/12/2005 | US6916873 Mixture of epoxy resin, curing agent and filler |
| 07/12/2005 | US6916539 Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof |
| 07/12/2005 | US6916505 Water-soluble polyamine adducts |
| 07/07/2005 | WO2005062369A1 Combinations of resin compositions and methods of use thereof |
| 07/07/2005 | WO2005061620A1 Method and system for making high performance epoxies, and high performance epoxies obtained therewith |
| 07/07/2005 | WO2005061473A1 Epoxy compounds and cured epoxy resins obtained by curing the compounds |
| 07/07/2005 | US20050148752 Amino-functional polysiloxanes and their use in coatings |
| 07/07/2005 | US20050148740 Curing agents comprising the reaction products of carboxylic acid, triethylenetetraamine and/or polyamines used for curing epoxy resins |
| 07/07/2005 | US20050148696 High thermal conductive halogen-free phosphorus-free retardant resin composition for printed circuit board materials |
| 07/07/2005 | US20050148695 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders |
| 07/06/2005 | EP1550704A1 Improved adhesive |
| 07/06/2005 | EP1550698A2 Polyimide based adhesive compositions useful in flexible circuit applications, and compositions and methods relating thereto |
| 07/06/2005 | EP1550678A1 Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 07/06/2005 | CN1636043A Polymeric compositions |
| 07/05/2005 | US6914103 Powder coating composition, method for the curing thereof, and articles derived therefrom |
| 07/05/2005 | US6913798 Sealing material for plastic liquid crystal display cells including two-component epoxy resin composition |
| 07/05/2005 | US6913792 Hybrid materials employing PPE/polystyrene/curable epoxy mixtures |
| 06/30/2005 | WO2005059655A2 A process for the fabrication of optical microstructures |
| 06/30/2005 | WO2005059052A1 Method for producing acrylic fusible adhesives |
| 06/30/2005 | WO2005059000A1 Curable composition |
| 06/30/2005 | US20050143534 relatively low lamination temperature; low modulus polyimidosiloxane polymer, a thermosetting substantially-non-halogenated epoxy (optionally including an epoxy catalyst), a plasticizer, an insoluble halogen-free flame-retardant filler, and optionally an adhesion promoter |
| 06/30/2005 | US20050143533 Thermosetting moulding composition |
| 06/30/2005 | US20050143524 Blend of ethylenically unsaturated anhydride-vinyl compound copolymer and ethylenically unsaturated anhydride-elastomer; stabilization with block copolymer to prevent phase separation; electrical laminates |
| 06/30/2005 | US20050143496 Adhesives for car body assembly |
| 06/30/2005 | US20050142479 Comprises epoxy compound and cationic photoinitiator; changes color as cures |
| 06/30/2005 | US20050142355 Electrostatographic imaging, gloss, durability, release of toner images without the need for a release agent such as an oil |
| 06/30/2005 | US20050142297 Coating compositions and method of forming coating film |
| 06/30/2005 | DE10353507A1 Hydrolysate und/oder Kondensate von Epoxid- und Silangruppen enthaltenden Oligomeren und Polymeren, Verfahren zu ihrer Herstellung und ihre Verwendung Hydrolyzates and / or condensates of epoxy and silane groups containing oligomers and polymers, processes for their preparation and their use |
| 06/30/2005 | CA2549189A1 A process for the fabrication of optical microstructures |
| 06/29/2005 | EP1548082A1 Adhesive composition and glass plate with thermoplastic elastomer molding |
| 06/29/2005 | EP1548043A1 Epoxy resin composition for sealing optical semiconductor |
| 06/29/2005 | EP1546275A1 Method of adhesion of conductive materials, laminate, and adhesive composition |
| 06/29/2005 | EP1546227A2 Polyether polyamine agents and mixtures therefor |
| 06/29/2005 | EP1546211A1 Preparation of acrylic polymer sol for coating |
| 06/29/2005 | EP1545872A1 Method of producing laminates, and laminates |
| 06/29/2005 | EP1352008B1 Epoxy resin composition for semiconductor encapsulation |
| 06/29/2005 | CN1633468A Polyester resin compositions for profile extrusion and profiles made therefrom |
| 06/29/2005 | CN1631972A High heat conduction, halogen free, phosphorus free and flame retardant resin composition for printed circuit board |
| 06/28/2005 | US6911109 Room temperature curable epoxy resin/(meth)acrylate component, a epoxy resin hardener, a transition metal complex as catalyst |
| 06/23/2005 | WO2005056699A1 A marine anti-bio-fouling coating and a method of applying the coating |
| 06/23/2005 | WO2005056686A1 Radiation curing conductive composition |
| 06/23/2005 | WO2005056683A1 Thermosetting resin composition, material for substrate and film for substrate |
| 06/23/2005 | WO2005056676A1 Epoxy resin molding material for sealing and electronic component |
| 06/23/2005 | WO2005056675A1 Dual-stage wafer applied underfills |
| 06/23/2005 | WO2005056626A1 Ester resin composition and molded article thereof |
| 06/23/2005 | WO2005007724A8 Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the same |
| 06/23/2005 | US20050137357 Epoxy adhesive composition method of preparing and using |
| 06/23/2005 | US20050137293 a high glass transition temp. epoxy resin system, ferroelectric ceramic particles having two particle size distributions, one of them pertaining to a nano level, a flexibilizer; a macromolecular dispersant and additives |
| 06/23/2005 | US20050137292 Adhesive composition |
| 06/23/2005 | US20050133152 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 06/22/2005 | EP1544274A1 adhesive |
| 06/22/2005 | CN1630695A Coating composition for protecting dazzling effect |
| 06/22/2005 | CN1630673A Indole resins epoxy resins and resin compositions containing the same |
| 06/22/2005 | CN1630581A Autodeposition compositions |
| 06/22/2005 | CN1629243A Heat-resistant and impact-resistant acrylic/epoxy adhesive |
| 06/22/2005 | CN1629242A Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 06/22/2005 | CN1629240A 丙烯酸粘合剂片材 Acrylic adhesive sheet |
| 06/22/2005 | CN1207319C Semiconductor device and its manufacture |
| 06/21/2005 | US6908953 Polymerizable compositions based on epoxides |
| 06/16/2005 | WO2005055119A2 Composite piezoelectric apparatus and method |
| 06/16/2005 | WO2005055118A2 Polymer ceramic slip and method of manufacturing ceramic green bodies therefrom |
| 06/16/2005 | WO2005054331A1 Epoxy resin composition and semiconductor device using the same |
| 06/16/2005 | WO2005054148A2 Piezoelectric device and method of manufacturing same |
| 06/16/2005 | US20050131167 Indole resins epoxy resins and resin compositions containing the same |
| 06/16/2005 | US20050131166 reacting polyphenylene ether (PPE) with an epoxy resin that has low bromine content in a non-polar solvent in the presence of a catalyst in a reactor; PPE needs not to be cleaved into small molecules and instead mixes and react directly reducing reaction time |
| 06/16/2005 | US20050131106 Combinations of resin compositions and methods of use thereof |
| 06/16/2005 | US20050129957 Encapsulating light emitting semiconductor |
| 06/16/2005 | US20050129936 Acrylic hot melt pressure sensitive adhesive |
| 06/16/2005 | US20050129895 Adhesive film and prepreg |
| 06/15/2005 | EP1541610A1 Two-component adhesive for use in vehicle manufacturing |
| 06/15/2005 | EP1541609A2 Curing agent |
| 06/15/2005 | EP1539871A1 Epoxy resin composition |
| 06/15/2005 | EP1539833A1 Reactive and gel-free compositions for making hybrid composites |
| 06/15/2005 | EP1272582A4 Rubber-metal composites |
| 06/15/2005 | CN1626578A Steel-plate-reinforcement resin composition, steel plate reinforcing sheet, and reinforcing method of steel plate |