| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 08/24/2005 | CN1216096C Polyiner/laminate inorganic nano composite material and its milling shearing preparation method |
| 08/23/2005 | US6933332 Powdered epoxy composition |
| 08/23/2005 | US6933050 Epoxy resin compositions containing phosphorus, flame retardant resin sheet using said epoxy resin containing phosphorus, resin clad metal foil, prepreg and laminated board, multi layer board |
| 08/23/2005 | CA2462006A1 Curable plasticizer composition |
| 08/23/2005 | CA2458752A1 Crosslinking of carboxylated nitrile polymers using compounds with at least two epoxy groups |
| 08/18/2005 | WO2005076376A2 Adhesive sheet for light-emitting diode device and light-emitting diode device |
| 08/18/2005 | US20050181215 Epoxy resin, setting agents containing a novolak-type phenol resin and a benzooxazine compound, and a siloxane-modified polyamide-imide resin; low dielectric constant; excellent peel strength |
| 08/18/2005 | US20050181214 Epoxy monomer with hardening, curing and encaqpsulation to makearticles and semiconductors |
| 08/18/2005 | US20050179011 silane film that can be used in a wide range of environments, on metals of engineering interest; comprises: at least one bis-silane; a water soluble or dispersible polymer; nanoparticles; and a water soluble solvent; substantially chromate-free and comprising little to no VOCs |
| 08/18/2005 | US20050178501 Process for producing a multi-layer printer wiring board |
| 08/17/2005 | EP1564257A1 Thermosetting resin composition |
| 08/17/2005 | EP1564256A1 Thermosetting resin composition |
| 08/17/2005 | EP1507830A4 Compliant overprint varnishes |
| 08/17/2005 | EP1458794B1 Heat-curable resin composition |
| 08/17/2005 | EP1138711B1 Method of hardening epoxy resins |
| 08/17/2005 | CN1656170A Process for making a thermoplastic composition comprising dynamic cross-linking |
| 08/17/2005 | CN1656169A Surface improver for reinforced composite compositions |
| 08/17/2005 | CN1654540A High temperature resistant epoxy resin composite with lasting storage stability and temperature thixotropy |
| 08/17/2005 | CN1654539A Thermosetting resin compositions and film articles |
| 08/17/2005 | CN1654538A Epoxy resin composition and method for producing epoxy resin composition and semiconductor device obtained thereby |
| 08/17/2005 | CN1654531A Blend film and its preparation method and use |
| 08/17/2005 | CN1654511A Cross-linked modification method of polymer phase in magnetic-force- electric coupling effect |
| 08/17/2005 | CN1654504A Halogen-free phosphorus-free flame-retardant epoxy resin semi-cured composition and flame-retardant epoxy resin composition |
| 08/17/2005 | CN1215109C Flame retardant epoxy molding compositions |
| 08/16/2005 | US6930399 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 08/11/2005 | WO2005073314A1 Reactive thermosetting system with long storage life |
| 08/11/2005 | US20050176854 Contains aluminum borate whisker being dispersed uniformly therein, is excellent in mechanical strength, and is suppressed with respect to the anisotropy of a mechanical property |
| 08/10/2005 | EP1560868A1 Powder coating compositions containing anhydride end-caped crystalline polyesters |
| 08/10/2005 | EP1560858A1 Adhesion promoters for glass-containing systems |
| 08/10/2005 | EP1358291B1 Method for adhering substrates using light activatable adhesive film |
| 08/10/2005 | CN1653157A Wavelength-converting reactive resinous compound and light-emitting diode component |
| 08/10/2005 | CN1651510A Thermo setting resin composition and its setting coating film |
| 08/04/2005 | WO2005071034A1 Thixotropic reactive composition |
| 08/04/2005 | WO2005070990A1 An epoxy resin curing agent containing elemental phosphorus and the method for preparing the same |
| 08/04/2005 | WO2005069734A2 A liquid thermosetting ink |
| 08/04/2005 | WO2005069733A2 Reactive fine particles |
| 08/04/2005 | US20050171303 comprising a thermoplastic matrix polymer having functional groups reactive with epoxide groups; impact-modifier |
| 08/04/2005 | US20050171301 Reworkable thermosetting resin compositions |
| 08/04/2005 | US20050171256 comprising a polyester based on a polyhydric alcohol and a polybasic carboxylic acid and an additive of at least one tertiary compound, such as tertiary amine or phosphine; as a tribo-chargeability enhancer |
| 08/04/2005 | US20050170187 siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass; cationically curable in air by heat or by electron beam radiation; adhesion, flexibility, weatherability, and corrosion resistance |
| 08/04/2005 | US20050170077 Adhesion method |
| 08/04/2005 | US20050167639 Electronic material composition, electronic product and method of using electronic material composition |
| 08/03/2005 | EP1559735A1 Sealing material for liquid crystal and liquid crystal display cell using same |
| 08/03/2005 | EP1558678A1 Toughened epoxy / polyanhydride no- flow underfill encapsulant composition |
| 08/03/2005 | EP1558653A2 Fiber dispersant-containing systems |
| 08/03/2005 | EP1366130B1 Adhesives and adhesive compositions containing thioether groups |
| 08/03/2005 | EP1341847B1 Thermally conductive casting compound |
| 08/03/2005 | CN1649978A Sealing method |
| 08/03/2005 | CN1649964A Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product |
| 08/03/2005 | CN1649949A Hydrolysis resistant polyester elastomer compositions and related articles and methods |
| 08/03/2005 | CN1649936A Adhesive resin and film adhesives made by using the same |
| 08/03/2005 | CN1213442C Anisotropically conductive paste |
| 08/03/2005 | CN1213101C Artistic sculpture shaping mud |
| 08/03/2005 | CN1213090C One-pack moisture-curable epoxy resin composition |
| 08/02/2005 | US6924328 Thermoplastic dispersion and a stabilizer including the reaction product of an epoxy resin and an multifunctional acid(having 2 or more carboxyl group), wherein the stabilizer has at least two oxirane functional groups/molecule |
| 08/02/2005 | US6924008 Curable resin composition, a method for the preparation thereof, and a coated article thereof |
| 07/28/2005 | WO2005068546A1 Halogen-free flame-retardant resin composition and prepreg and laminate using the same |
| 07/28/2005 | US20050165196 Adhesive resin and film adhesive made by using the same |
| 07/28/2005 | US20050165169 Adhesive |
| 07/28/2005 | US20050165135 Liquid thermosetting ink |
| 07/28/2005 | US20050165134 reduces environmental pollution problems and does not have any defect of appearance caused by hydrogen gas; polyisocyanate curing agent including partially blocked isocyanate functional groups is prepared |
| 07/28/2005 | US20050165127 Epoxide; aromatic or cycloaliphatic acrylate; reactive hydroxyl-containing material; cationic photoinitiator; and free radical photoinitiator; stereolithography |
| 07/28/2005 | US20050163971 Fine particle dispersion composition, optical component, optical film laminate, polarization splitting device, and method for manufacturing the optical component |
| 07/27/2005 | EP1557880A1 Resin composition for encapsulating semiconductor |
| 07/27/2005 | EP1557455A1 Thixotropic reactive composition |
| 07/27/2005 | EP1557453A2 Adhesive material and use therefor |
| 07/27/2005 | EP1556450A1 Aqueous non-ionically stabilised epoxy resins |
| 07/27/2005 | CN1646658A Two-pack type adhesive |
| 07/27/2005 | CN1646633A Conductive composition, conductive film, and process for the formation of the film |
| 07/27/2005 | CN1646589A Resin composition and optical elements |
| 07/26/2005 | US6921782 Adhesive and electric device |
| 07/26/2005 | US6921577 Water-based metal surface treatment agent |
| 07/21/2005 | WO2005054148A9 Piezoelectric device and method of manufacturing same |
| 07/21/2005 | WO2005047370A8 Bio-based epoxy, their nanocomposites and methods for making those |
| 07/21/2005 | US20050159538 Acetoacetylated polyvinyl polymers and curable coating compositions made therefrom |
| 07/21/2005 | US20050159531 Blend of glycidyl methacrylate modified acrylic polymer and ethylene-vinyl acetate copolymer; peroxides ( dicumyl peroxide) curing agent; filler and zinc acrylate or zinc methacrylate coagent; automobiles; high degree of adhesion despite exposure to volatile hydrocarbon fuel |
| 07/21/2005 | US20050159516 intramolecular compound having a phenol, an amine, formldehyde, dihydrobenzoxadine ring, epoxy resin, novolak or resol phenol resin, polyphosphate fire retardant, inorganic filler; heat resistance, high glass transition temperature; good copper peeling strength; no toxic carcinogen upon combustion |
| 07/21/2005 | US20050159511 bisphenol-A diglycidyl ether, bisphenol-F diglycidyl ether, or bisphenol-A/F diglycidyl ether as liquid epoxy resins; epoxy adduct of a dicarboxylic acid and a diglycidyl ether; a urea derivative (reaction product of diphenylmethane diisocyanate/p, p*-/ and butylamine) as thixotropic agent; curing agent |
| 07/21/2005 | US20050158557 Resin composition for encapsulating semiconductor |
| 07/21/2005 | US20050158552 Poly(arylene ether) adhesive compositions |
| 07/21/2005 | US20050156362 Contacting a ceramic powder with a first polymer and surfactant to form a slip mixture, injecting mixture into a mold to form a green body, sintering the green body to form a sintered polymer-ceramic body |
| 07/20/2005 | EP1387860B1 Moulding composition for producing bipolar plates |
| 07/20/2005 | EP1377631B1 Solid polymethylmethacrylate surface material |
| 07/20/2005 | EP1268457A4 Reworkable composition of oxirane(s) or thiirane(s)-containing resin and curing agent |
| 07/20/2005 | CN1643682A No-flow underfill encapsulant |
| 07/20/2005 | CN1643093A Coating composition less susceptible to surface defects |
| 07/20/2005 | CN1643024A Thermosetting resin composition and adhesive films |
| 07/20/2005 | CN1643023A No flow underfill composition |
| 07/20/2005 | CN1642400A Electric wave absorber and manufacturing method of the same |
| 07/20/2005 | CN1640933A Method for preparing polymer/carbon nano composite material |
| 07/20/2005 | CN1640931A Volatileness-free polymer electrolyte composition, its preparation method and use |
| 07/20/2005 | CN1211440C Powder coating compositions |
| 07/19/2005 | US6919385 Energy-ray curing resin composition |
| 07/19/2005 | US6918984 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 07/14/2005 | WO2005063880A1 Epoxy resin mortar composition and a method of coating the same on concrete surface |
| 07/14/2005 | WO2005063843A1 Curing silicone composition and cured product thereof |
| 07/14/2005 | WO2005062801A2 Epoxy adhesive composition method of preparing using |
| 07/14/2005 | WO2005035669A3 Surface treated silicas |
| 07/14/2005 | US20050154170 Combination of polysiloxane, epoxy resin, and low molecular weight polyoxyalkylene polyamine hardener that reacts with epoxy groups in the resin to form polymers containing hydroxyl groups, which are able to react with the silanol groups of hydrolyzed polysiloxane to form a fully cured polymer network |
| 07/14/2005 | US20050154152 Mixing an epoxy resin, a phenol resin, and a hardening accelerator, under a reduced pressure and under a heating condition and then mixing |