| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
|---|
| 09/28/2005 | EP1580235A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
| 09/28/2005 | EP1578851A1 Heat activated epoxy adhesive and use in a structural foam insert |
| 09/28/2005 | EP1578838A1 Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 09/28/2005 | EP1176159B1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same |
| 09/28/2005 | CN1675330A Epoxy compositions having improved shelf life and articles containing the same |
| 09/28/2005 | CN1675328A 粘接性薄膜 Adhesive film |
| 09/28/2005 | CN1673595A High-pressure glass fibre reinforced plastic pipe and producing technology thereof |
| 09/28/2005 | CN1673269A Thermosetting resin composition and use thereof |
| 09/27/2005 | US6949619 Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition |
| 09/27/2005 | US6949602 Room temperature vulcanization, quick setting glues, bonding two surfaces with a curable blends comprising acrylic-based monomer, epoxy based monomer or epoxy resin, and a chemically reactive bifunctional monomer |
| 09/27/2005 | US6949592 Aqueous blends comprising epoxy resin binders, curing catalyst for hardening, boron trifluoride complex, use as varnish for electrical coiling item protective coatings, including tertiary amines, imidazoles for corrosion resist |
| 09/27/2005 | US6948714 Gasket and method for producing a gasket |
| 09/27/2005 | CA2355047C Hardener for epoxy resin and epoxy resin composition |
| 09/22/2005 | WO2005088700A1 Dicing/die boding sheet |
| 09/22/2005 | WO2005087834A1 Epoxy resin composition and semiconductor device |
| 09/22/2005 | WO2005087833A1 Epoxy resin composition and semiconductor device |
| 09/22/2005 | WO2005087472A1 Heat-curable molding material pellet having multilayer structure |
| 09/22/2005 | US20050209401 Toughened epoxy adhesive composition |
| 09/22/2005 | US20050209400 1,3,5,7-tetramethylcyclotetrasiloxane and triallyl isocyanurate, a hydrosilylation catalyst, a silane coupling agent and/or an epoxy group-containing compound, and a silanol condensation catalyst |
| 09/22/2005 | US20050209371 Combining an amine and an epoxy material in the presence of a reactive diluent of a methacrylate; making an aqueous dispersion of the composition; polymerizing the reactive diluent to provide the coating |
| 09/22/2005 | US20050208307 Phenolic resins; polysiloxanes; improved solder heat resistance productivity; lightweight |
| 09/21/2005 | EP1204701B1 Cured coatings having improved scratch resistance and coated substrates |
| 09/21/2005 | EP0983320B1 Curable sealant composition |
| 09/21/2005 | CN1671747A Preparation of acrylic polymer sol for coating |
| 09/21/2005 | CN1670076A Optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| 09/21/2005 | CN1220261C 电子元件 Electronic component |
| 09/21/2005 | CN1219824C Aromatic polycarbonate resin composition and moldings |
| 09/21/2005 | CN1219822C Thermosetting resin composition and prepreg, laminate for circuit board and printed circuit board each made therewith |
| 09/21/2005 | CN1219803C Moulding composition for producing bipolar plates |
| 09/20/2005 | US6946421 Latent catalyst |
| 09/20/2005 | US6946198 A semiconductor device is bonded to a wiring board, using a liquid binder containing epoxy resins and a hydrolyzed silantriol coupling agents, a curing agent, and conductive metallic powder; low viscosity |
| 09/15/2005 | WO2005085335A1 Prepreg, metal-clad laminate and printed circuit board using same |
| 09/15/2005 | WO2005085334A1 Polymer composite formed article, printed wiring board using the formed article and method for producing them |
| 09/15/2005 | WO2005085316A1 Encapsulation epoxy resin material and electronic component |
| 09/15/2005 | WO2005048866A3 Dual cure reaction products of self-photoinitiating multifunctional acrylates with cycloaliphatic epoxy compounds |
| 09/15/2005 | US20050203231 Polymer ceramic slip and method of manufacturing ceramic green bodies there therefrom |
| 09/15/2005 | US20050203217 Stabilizers for polymerizable biocompatible materials |
| 09/15/2005 | US20050202257 Organo-functional polysiloxanes |
| 09/14/2005 | EP1574537A1 Epoxy adhesive composition |
| 09/14/2005 | EP1141071B1 High strength epoxy adhesive and uses thereof |
| 09/14/2005 | EP1129143B1 Powder coating compositions |
| 09/14/2005 | CN1668716A Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 09/14/2005 | CN1668695A Flame-retardant polybutylene terephthalate resin composition and moldings |
| 09/14/2005 | CN1667041A Process for preparing four-leg zinc-oxide crystal whisker reinforced epoxy composite materials |
| 09/14/2005 | CN1667040A Method for surface modification of carbon nanotube and its dispersion method in epoxy resin |
| 09/13/2005 | US6943219 Comprising an epoxy resin and a vinyl polymer which has a main chain produced by living radical polymerization and has a reactive functional group at a main chain terminus; flexiblity, hardness |
| 09/13/2005 | US6942922 Cationic paint composition |
| 09/09/2005 | WO2005083002A1 Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material |
| 09/09/2005 | WO2005082982A1 Epoxy resin composition for carbon-fiber-reinforced composite material, prepreg, integrated molding, sheet of fiber-reinforced composite material and cabinet for electrical/electronic equipment |
| 09/09/2005 | WO2005042630A3 Two component curable compositions |
| 09/09/2005 | WO2005030894A3 Adhesive compositions |
| 09/09/2005 | CA2557572A1 Epoxy resin composition for fiber-reinforced composite material, prepreg and fiber-reinforced composite material |
| 09/08/2005 | US20050197429 Hydrolysis resistant polyester compositions and related articles and methods |
| 09/08/2005 | US20050197425 a mixture of a phenolic resins bonded with the vinyl benzyl ether groups, a solvent soluble polyimide resin and a thermosetting catalyst, having a low dielectric constant, a low thermal expansion coefficient and an excellent peel strength at a low surface roughness |
| 09/07/2005 | EP1570000A1 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 09/07/2005 | CN1665881A Photo-induced cation curable epoxy resin composition |
| 09/07/2005 | CN1665041A Light emitting diode and method for manufacturing the same |
| 09/07/2005 | CN1664000A Thermosetting resin compositions, resin films and film articles |
| 09/07/2005 | CN1218420C Highly conductive molding compounds and fuel cell bipolar plates comprising these compounds |
| 09/07/2005 | CN1217991C Sealing material for plastic liquid crystal display cells |
| 09/07/2005 | CN1217985C Rubber composition based on carbon black having silica fixed to its surface and on diene polymer functionalized with alkoxysilane |
| 09/07/2005 | CN1217972C Epoxy resin composition for semi-conductor packaging and semi-conductor device using the composition |
| 09/06/2005 | US6939431 A curable blends comprising epoxy resin, acid anhydride, phenolic resin curing agent, and fine particles for use in liquid crystal displays, electroluminescence displays, plasma displays, charge coupled devices and semiconductors |
| 09/06/2005 | US6939430 Method of bonding, a bonded structure and a use of Xylan |
| 09/01/2005 | WO2005080502A1 Liquid epoxy resin composition for underfill and semiconductor device encapsulated with the composition |
| 09/01/2005 | WO2005080493A1 Crosslinking of carboxylated nitrile polymers using compounds with at least two epoxy groups |
| 09/01/2005 | WO2005080492A1 Curable plasticizer composition |
| 09/01/2005 | WO2005080466A1 Thermosetting resin composition and use thereof |
| 09/01/2005 | WO2005080326A1 Toughened vinyl ester resins |
| 09/01/2005 | WO2005080270A1 Fine basic silica powder, process for producing the same and resin composition |
| 09/01/2005 | WO2005069734A3 A liquid thermosetting ink |
| 09/01/2005 | US20050191498 a mixture of a chlorinated polyolefin, an epoxy group-containing compound and a silane coupling agent, having durability and bonding strength, used for bonding moldings with automobile windows |
| 09/01/2005 | US20050191490 Polymeric nanocomposites |
| 09/01/2005 | US20050189067 Process for the production of electrical steel sheet cores |
| 09/01/2005 | DE102004008232A1 Hardened epoxide and nano rubber powder complex material, useful to manufacture sport products e.g. racquets, hockey stick, comprises: nano-rubber powder, strengthening fiber, hardening medium, additive and epoxide |
| 09/01/2005 | DE102004006522A1 Elastic two-component flock adhesives, useful for the production of substrates flocked with flock fibers, comprises silyl phased polyether, solvent-free epoxy resin, optionally thixotroping agent, bases and accelerators |
| 08/31/2005 | EP1568733A1 Porous inorganic filler particles having an organopolysiloxane coating for use in curable casting compositions |
| 08/31/2005 | EP1568724A1 Process for the production of electrical steel sheet cores |
| 08/31/2005 | EP1568723A1 Photo- and thermo-setting resin composition and printed wiring boards made by using the same |
| 08/31/2005 | EP1567589A1 Hardener composition for epoxy resins |
| 08/31/2005 | CN1662607A Epoxy modified organopolysiloxane resin based compositions useful for protective coatings |
| 08/31/2005 | CN1662601A Epoxy resin composition |
| 08/31/2005 | CN1662581A Amino-functional polysiloxanes and their use in coatings |
| 08/31/2005 | CN1661475A Photocuring resinoid compsn. and printed circuit board using same |
| 08/31/2005 | CN1217233C Photocurable and thermosetting resin composition |
| 08/31/2005 | CN1216933C Epoxy-resin system, which are resistant to ageing, moulding materials and components produced therefrom and use thereof |
| 08/30/2005 | US6936676 heating and stirring an alkoxysilane having epoxy group , an alkoxysilane having amino group and a ketone to produce a silicone compound having epoxy group, a ketimine group, and a alkoxysilane group, used as curing agent for epoxy or polysiloxane |
| 08/25/2005 | WO2005078034A1 Conductive adhesive |
| 08/25/2005 | WO2005078012A2 Fire retardant compositions using siloxanes |
| 08/25/2005 | US20050187371 Latent curing agent for epoxy resin, and curable epoxy resin composition |
| 08/25/2005 | US20050186434 coating aromatic cyanates on circuit substrates, then curing with light and heat to form insulation layer with improved surface smoothness and excellent dielectric properties |
| 08/25/2005 | DE19928580B4 Flachdichtung und Verfahren zum Herstellen einer Flachdichtung Flat gasket and method of making a flat gasket |
| 08/24/2005 | EP1566395A1 Flame-retardant epoxy resin composition and cured object obtained therefrom |
| 08/24/2005 | EP1565520A1 Curable epoxy compositions, methods and articles made therefrom |
| 08/24/2005 | EP1470181B1 Improved interface adhesive |
| 08/24/2005 | EP1470177A4 Adhesive of epoxy compound, aliphatic amine and tertiary amine |
| 08/24/2005 | EP1189966B1 Epoxy resin hardener compositions |
| 08/24/2005 | CN1659217A Halogen free ignition resistant thermoplastic resin compositions |
| 08/24/2005 | CN1657566A Fibre reinforced vinyl ester resin base pultrusion composite |
| 08/24/2005 | CN1216100C 环氧树脂组合物及半导体装置 Epoxy resin composition and a semiconductor device |