| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 11/10/2005 | US20050250397 Molding compounds for use in induction heating applications and heating elements molded from these compounds |
| 11/10/2005 | US20050249891 Sealant material for plastic liquid crystal display cells including two-component epoxy resin composition |
| 11/10/2005 | US20050249879 Packaging coating containing 1,3,5-triazine carbamate crosslinker |
| 11/10/2005 | US20050247402 Adhesive film |
| 11/10/2005 | DE10321297B4 Flammwidrige duroplastische Massen, ein Verfahren zu ihrer Herstellung und ihre Verwendung A flame-retardant thermoset composition, a process for their preparation and their use |
| 11/09/2005 | EP1593716A2 Powder coating compositions |
| 11/09/2005 | EP1593703A1 Silicon compound containing epoxy group and thermosetting resin composition |
| 11/09/2005 | EP1592746A2 Halogen free ignition resistant thermoplastic resin compositions |
| 11/09/2005 | EP1314197B1 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 11/09/2005 | CN1226346C Resin composition for insulation and laminated body using said composition |
| 11/08/2005 | US6962957 Epoxy resin composition for semiconductor encapsulation, process for producing the same, and semiconductor device |
| 11/08/2005 | US6962948 siloxane epoxy-based coating compositions for use on metals, plastics, wood, and glass; cationically curable in air by heat or by electron beam radiation; adhesion, flexibility, weatherability, and corrosion resistance |
| 11/03/2005 | US20050245644 Continuous organic-inorganic composite of an epoxy resin and nanosized high thermal conductivity fillers attached to the host resin epoxy groups surface by covalent grafts; reduces phonon scattering and increases phonon transport while maintaining dielectric strength and voltage endurance |
| 11/03/2005 | US20050245643 combination of nonfluorinated aromatic epoxy resins (bisphenol a, bisphenol f type), an alicyclic epoxy resin having cyclohexene oxide or cyclopentene oxide structure in its molecule, a photoinitiator with iodinium or sulfonium cations and B(tetrafluorobenzene)4 or SbF6 anions, silica, Mg/OH/2 filler |
| 11/03/2005 | US20050244649 Protective encapsulating material, free from dust attraction and exhibits low elasticity, crack resistance, adhesion properties |
| 11/03/2005 | US20050241756 Adhesive material and structures formed therewith |
| 11/02/2005 | EP1591465A1 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
| 11/02/2005 | EP1590416A1 Method for gluing fpcb's |
| 11/02/2005 | EP1590403A1 Thermosetting, themoexpansible composition with a high degree of expansion |
| 11/02/2005 | EP1280842B1 Aqueous two-component cross-linkable composition |
| 11/02/2005 | EP1268665B1 Flame retardant phosphorus element-containing epoxy resin compositions |
| 11/02/2005 | CN1690119A Thermoset resin composition and multi-layer printed circuit board used thereof |
| 11/02/2005 | CN1690118A Epoxy resin composition, ultraviolet rays-curable can-coating composition and its uses |
| 11/01/2005 | US6960878 Light emitting diode, optical semiconductor element and epoxy resin composition suitable for optical semiconductor element and production methods therefor |
| 10/27/2005 | WO2005100650A1 Flame-retardant polyester artificial hair |
| 10/27/2005 | WO2005100500A1 Adhesive tape |
| 10/27/2005 | WO2005100476A1 Light-diffusing resin composition |
| 10/27/2005 | WO2005100472A1 Photo-radical-curable resin composition containing epoxy resin |
| 10/27/2005 | WO2005100434A1 Halogen containing epoxy compositions and their preparation |
| 10/27/2005 | WO2005100432A1 A thermosetting resin composition and its article |
| 10/27/2005 | WO2005100020A2 Primer-less abrasion coating for organic glass articles |
| 10/27/2005 | US20050239975 Halogen free ignition resistant thermoplastic resin compositions |
| 10/27/2005 | US20050239923 Water-soluble paint composition and paint |
| 10/27/2005 | US20050239922 Curable compositions having a reduced enthalpy output |
| 10/27/2005 | US20050238898 Compliant overprint varnishes |
| 10/27/2005 | US20050238882 Primer-less abrasion coating for organic glass articles |
| 10/26/2005 | EP1589063A1 Carbon fiber-reinforced resin composite materials |
| 10/26/2005 | EP1587871A1 Preformed compositions in shaped form |
| 10/26/2005 | EP1587865A1 Flame-retardant for engineering thermoplastic applications |
| 10/26/2005 | CN1687229A Method for preparing composition of epoxy resin for packaging semiconductor |
| 10/26/2005 | CN1687228A Epxoy resin film for technique of melting and dipping resin film and preparation method thereof |
| 10/26/2005 | CN1687227A Filler for canal cast of human body and method of preparation |
| 10/26/2005 | CN1224753C Method and composition for cutting dry fabric |
| 10/20/2005 | WO2005097893A1 Amphiphilic block copolymer-toughened thermoset resins |
| 10/20/2005 | WO2005097892A1 Epoxy resin composition for the encapsulation of semiconductors and semiconductor devices |
| 10/20/2005 | US20050234216 aminated polyols from alkylene glycol adducts; increased working time; curing agents for epoxy resins; preparing polyureas from the diamines and diisocyanates; composite blades for wind-driven turbines |
| 10/20/2005 | US20050233023 Method of making models |
| 10/20/2005 | US20050230776 Low temperature texturing layer to enhance adhesion of subsequent layers |
| 10/20/2005 | CA2558819A1 Amphiphilic block copolymer-toughened thermoset resins |
| 10/19/2005 | EP1586615A1 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 10/19/2005 | EP1359174B1 Flame-retardant epoxy resin composition, and prepregs and fiber-reinforced composite materials made by using the composition |
| 10/19/2005 | CN1684995A Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
| 10/19/2005 | CN1683456A Powder coating compositions |
| 10/19/2005 | CN1223639C Coating composition |
| 10/18/2005 | US6956086 Water dispersible epoxy resins |
| 10/18/2005 | US6955848 Curable composition and multilayered circuit substrate |
| 10/18/2005 | CA2186228C Method of making liquid crystal composite |
| 10/13/2005 | WO2005096100A1 Radiation-sensitive composition, laminate, process for producing the sane and electronic part |
| 10/13/2005 | WO2005095517A1 Thermosetting resin composition and multilayered printed wiring board comprising the same |
| 10/13/2005 | WO2005095485A1 Hardenable composition |
| 10/13/2005 | WO2005095484A1 Epoxy adhesive composition |
| 10/13/2005 | US20050228130 Thermoplastic composition providing a low gloss, textured surface, and method |
| 10/13/2005 | US20050228080 Improved tribological properties, namely reduction of friction and wear |
| 10/13/2005 | US20050228079 Thermosetting resin composition and adhesive films |
| 10/13/2005 | US20050224821 Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same |
| 10/13/2005 | DE102005013863A1 Härtbare Zusammensetzung The curable composition |
| 10/13/2005 | CA2561385A1 Hardenable composition |
| 10/13/2005 | CA2553251A1 Epoxy adhesive composition |
| 10/12/2005 | EP1584657A1 Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body |
| 10/12/2005 | EP1584639A1 Curable resin composition and products of curing thereof |
| 10/12/2005 | EP1583788A1 Phosphorus-modified epoxy resin |
| 10/12/2005 | EP1276812B1 Non-aqueous solvent-free process for making uv curable adhesives and sealants from epoxidized monohydroxylated diene polymers |
| 10/12/2005 | EP1265969B1 Use of xylan to improve bond strength |
| 10/12/2005 | CN1681900A Method of adhesion of conductive materials, laminate, and adhesive composition |
| 10/12/2005 | CN1681649A Method of producing laminates, and laminates |
| 10/12/2005 | CN1222508C Process for preparation of condensed sulfamide |
| 10/12/2005 | CN1222392C Fluxing under fill compositions |
| 10/11/2005 | US6953816 A polymeric film with sufficient elongation and strength consists of a vinyl acetate homo or copolymer or partially hydrolyzed vinyl acetate polymer and an aqueous solution of sap, fruit liquid, honey, and saccharide |
| 10/06/2005 | WO2005094152A1 Coated ferrite formed article and method for producing coated ferrite formed article |
| 10/06/2005 | WO2005092982A1 Modifier for polyester resin and process for producing molded article with the same |
| 10/06/2005 | WO2005092981A1 Composition curable by both free-radical photocuring and cationic photocuring |
| 10/06/2005 | WO2005092980A1 Epoxy resin composition for sealing photosemiconductor element and photosemiconductor device |
| 10/06/2005 | WO2005092944A1 Comb-shaped epoxy resins and process for the production thereof |
| 10/06/2005 | US20050222298 light emitting diode; curable silicone with pendant epoxy groups, a hydroxyl-containing compound or silicone, anhydride curing agent, ancillary curing catalyst; radiation transparent, UV stability, clear; packaging |
| 10/06/2005 | US20050221094 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 10/06/2005 | CA2561169A1 Composition curable by radical photo curing and cationic photo curing in combination |
| 10/05/2005 | EP1582546A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 10/05/2005 | EP1581577A1 Castor oil/epoxidized soybean oil based elastomeric compositions |
| 10/05/2005 | EP1581573A1 Water-based epoxy grout |
| 10/05/2005 | CN1678706A Adhesive composition and glass plate with thermoplastic elastomer molding |
| 10/05/2005 | CN1678682A Thermoplastic composition having low gloss appearance |
| 10/05/2005 | CN1678654A Polyether polyamine agents and mixtures therefor |
| 10/05/2005 | CN1678642A Reactive and gel-free compositions for making hybrid composites |
| 10/05/2005 | CN1676565A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 10/05/2005 | CN1221611C Light solidified and heat solidified resin composition and method for producing printed circuit board |
| 10/05/2005 | CN1221610C Paste composition, and protective film and semiconductor device both obtained with the same |
| 10/05/2005 | CN1221582C Liquid curable resin composition |
| 10/04/2005 | US6951907 Composition of epoxy resin, secondary amine-functional adhesion promotor and curative of nitrogen-compound and transition metal complex |
| 09/29/2005 | US20050215670 Coating composition and article coated therewith |
| 09/29/2005 | US20050215667 Curable composition |