| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 12/22/2005 | WO2005121241A1 Aqueous dispersion, composition and coating agent for paper |
| 12/22/2005 | WO2005121200A1 Highly-charged stable dental composition which may be cross-linked/polymerised by cationic reaction |
| 12/22/2005 | WO2005055118A3 Polymer ceramic slip and method of manufacturing ceramic green bodies therefrom |
| 12/22/2005 | US20050282975 Silicone epoxy formulations |
| 12/22/2005 | US20050282960 Epoxy ebonite compositions |
| 12/22/2005 | US20050282937 Electrochemical compatibilizer and hydrophobic wetting agent for fiber reinforced vinyl esters and related thermosets |
| 12/22/2005 | US20050282936 Cationic electrodeposition coating composition |
| 12/21/2005 | EP1607460A2 Moisture setting composition and adhesive composition |
| 12/21/2005 | EP1607439A1 Rubber composition, crosslinkable rubber compositions, and crosslinked articles |
| 12/21/2005 | EP1606347A1 Acetoacetylated polyvinyl polymers and curable coating compositions made therefrom |
| 12/21/2005 | EP1325053B1 Die-attaching paste and semiconductor device |
| 12/21/2005 | EP1263841B1 S-b-s compositions |
| 12/21/2005 | EP1025141B1 Epoxy resin mixture, composites produced therefrom and the use thereof |
| 12/21/2005 | CN1711300A Sealing material for liquid crystal and liquid crystal display cell using same |
| 12/21/2005 | CN1233047C Light emitting diode and mfg. method thereof |
| 12/21/2005 | CN1232515C Reworkable composition of oxirane (S) or thiirane (S)-containing resin and curing agent |
| 12/15/2005 | WO2005118604A1 Phosphorus-containing compounds useful for making halogen-free, ignition-resistant polymers |
| 12/15/2005 | WO2005118276A2 Low heat release and low smoke reinforcing fiber/epoxy composites |
| 12/15/2005 | US20050276926 mixing an epoxy resin, an iron particulate and one or more additives, activating the iron particles to form a polarized magnetic field, A second mixture of an epoxy hardener, a ceramic, an amorphous fumed silica is made to combine with epoxy resin |
| 12/15/2005 | CA2561582A1 Low heat release and low smoke reinforcing fiber/epoxy composites |
| 12/14/2005 | EP1605005A1 Curable resin composition |
| 12/14/2005 | EP1603962A1 Improvements in or relating to thermosetting resin compositions |
| 12/14/2005 | EP1499668B1 Hydrolysis resistant polyester elastomer compositions and related articles and methods |
| 12/14/2005 | EP1167451B1 Curable resin composition |
| 12/14/2005 | CN1706886A Epoxy-resin systems, which are resistant to aging, moulding materials, components produced therefrom and the use thereof |
| 12/14/2005 | CN1231539C Low temperature bonding adhesive composition |
| 12/13/2005 | US6974847 powder coating with zinc, zinc oxide, titanium oxide, and epoxy resins; underwater running gear: propellers, rudders, struts, shafting, bow thrusters, boat hulls (fiberglass or metallic) |
| 12/13/2005 | US6974846 Hydrolysis resistant polyester compositions and related articles and methods |
| 12/13/2005 | US6974608 Cellulose ester film, cellulose ester dope, protective film of polarizing plate and polarizing plate |
| 12/08/2005 | WO2005116104A1 Semiconductor sealing resin composition and semiconductor device |
| 12/08/2005 | WO2005116103A1 Radiation curable liquid resin composition for optical three-dimensional molding and optical molded article obtained by photocuring same |
| 12/08/2005 | US20050272896 Resin composition for sealing light emitting device |
| 12/08/2005 | US20050272882 Polymer and epoxy resin compositions |
| 12/08/2005 | US20050272871 dynamically-cured ethylene-ethylidenenorbornene-propylene rubber with phenolic resin, a polypropylene thermoplastic resin, stannous chloride, zinc oxide heat stability agent; tensile strength retention |
| 12/08/2005 | DE102004024439A1 Härtbare Zusammensetzungen auf Basis von Epoxidharzen und 3(4)-(Aminomethyl)-cyclohexan-propanamin und 1,4(5)-Cyclooctandimethanamin Curable compositions based on epoxy resins and 3 (4) - (aminomethyl) -cyclohexane-propanamine and 1.4 (5) -Cyclooctandimethanamin |
| 12/08/2005 | DE102004023071A1 Pumpbare Tricyclodecandimethylol enthaltende Zusammensetzung Pumpable tricyclodecanedimethylol containing composition |
| 12/07/2005 | EP1602689A1 Highly elastic epoxy resin composition |
| 12/07/2005 | EP1601706A1 Polymeric epoxy resin composition |
| 12/07/2005 | EP1328570B1 Crosslinked polyamide |
| 12/07/2005 | CN1705723A Aqueous non-ionically stabilised epoxy resins |
| 12/07/2005 | CN1705697A Powder coating compositions containing anhydride end-caped crystalline polyesters |
| 12/07/2005 | CN1705110A Semiconductor encapsulating epoxy resin composition and semiconductor device |
| 12/06/2005 | CA2134491C Heatset security ink |
| 12/01/2005 | WO2005113689A1 Filler material, especially for filling cavities, especially of structural elements, method of production and structural element |
| 12/01/2005 | WO2005113677A1 Comb-like polyetheralkanolamines in inks |
| 12/01/2005 | WO2005113676A1 Polyetheralkanolamine dispersants |
| 12/01/2005 | WO2005113652A2 Self-adhesive prepreg |
| 12/01/2005 | WO2005078012A3 Fire retardant compositions using siloxanes |
| 12/01/2005 | US20050267266 Hybrid materials employing PPE/polystyrene/curable epoxy mixtures |
| 12/01/2005 | US20050267237 Resin composition for encapsulating semiconductor chip and semiconductor device therewith |
| 12/01/2005 | US20050267236 Mixtures of polyepoxides, phenolic resin curing agent, zinc molybdate, polysiloxanes, polyethersiloxane copolymers and fillers, used as flameproofing casings for electronics; minimizing electrical failure such as defective insulation due to a migration phenomenon |
| 12/01/2005 | CA2567536A1 Filler material, especially for filling cavities, especially of structural elements, method of production and structural element |
| 12/01/2005 | CA2566447A1 Self-adhesive prepreg |
| 11/30/2005 | CN1703474A Liquid-repellent, alkali-resistant coating composition and coating suitable for pattern forming |
| 11/30/2005 | CN1703438A Epoxy resin composition for sealing optical semiconductor |
| 11/30/2005 | CN1229889C 锂电池 Lithium Battery |
| 11/30/2005 | CN1229839C Composite material used for mfg. isolation sheet of thin layer display panel |
| 11/30/2005 | CN1229436C Volume-modified casting compound based on polymeric matrix resins |
| 11/29/2005 | US6969739 Rubber composition |
| 11/29/2005 | CA2332341C Manufacture of void-free laminates and use thereof |
| 11/29/2005 | CA2142047C Curable resin composition, coating composition and process for forming a cured film |
| 11/24/2005 | WO2005112091A1 Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device |
| 11/24/2005 | WO2005111168A1 Adhesive agent composition and adhesive film for electronic component |
| 11/24/2005 | WO2005111161A1 Metal packaging coating containing 1,3,5-triazine carbamate crosslinker |
| 11/24/2005 | WO2005111135A1 Thermohardenable epoxy resin-based compositions, 3(4)-(aminomethyl)-cyclohexane-propanamine and 1,4(5)-cyclooctane dimethanamine |
| 11/24/2005 | WO2005111087A1 Maleimide-terminated rubber and curable composition containing the same |
| 11/24/2005 | US20050261456 Partial block polyimide-polysiloxane copolymer, making method , and resin composition comprising the copolymer |
| 11/24/2005 | US20050261397 Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same |
| 11/24/2005 | DE4324322B4 Flexibilisierte, lichtinitiiert härtende Epoxidharzmassen, ihre Herstellung und Verwendung More flexible, light-curing epoxy resin compositions initiated, their preparation and use |
| 11/23/2005 | EP1598403A2 Electrodeposition paint |
| 11/23/2005 | EP1598398A1 Curable composition |
| 11/23/2005 | EP1598393A1 Filler based on polymer coated particles, for filling of cavities, particularly of structural elements, preparation thereof and structural element |
| 11/23/2005 | EP1225202B1 Flame-retardant polyester resin composition, molded article thereof, and method of molding the same |
| 11/23/2005 | CN1699495A Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same |
| 11/23/2005 | CN1699472A Reinforced sheet composition for vehicle metal plate |
| 11/23/2005 | CN1228383C Paste for connecting circuit, anisotropic conductive paste and applications thereof |
| 11/17/2005 | WO2005108513A1 Radiation curable low gloss powder coating compositions |
| 11/17/2005 | WO2005108488A1 Epoxy resin composition for copper clad laminate |
| 11/17/2005 | WO2005108487A1 Methods for improving the flux compatibility of underfill formulations |
| 11/17/2005 | WO2005108483A1 Electronic component device |
| 11/17/2005 | WO2005108459A1 Liquid epoxy resin composition |
| 11/17/2005 | US20050256236 Pumpable composition comprising tricyclodecanedimethylol |
| 11/17/2005 | US20050256230 Storage life, capable of thermocompression bonding at a low temperature and ensuring excellent adhesive strength |
| 11/17/2005 | US20050256229 Electrodeposition paint |
| 11/17/2005 | US20050255409 Photo-curable resin composition, method of patterning the same, and ink jet head and method of fabricating the same |
| 11/17/2005 | US20050255322 a mixture of bismaleimide terminated acrylonitrile-butadiene rubbers, epoxy resins and curing agents, used to form prepregs exhibiting excellent toughness and long term stability, by impregnating with reinforcement fibers; |
| 11/17/2005 | US20050255270 Flame retardancy although it is halogen-free, with good bonding strength, soldering heat resistance and coefficient of thermal expansion; novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, a triazine ring-containing cresol novolak, phenolic phosphorus compound, filler |
| 11/17/2005 | US20050253286 Epoxy resin composition for semiconductor encapsulation, semiconductor device using the same, and process for producing semiconductor device |
| 11/16/2005 | EP1595919A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 11/16/2005 | EP1595874A1 Pumpable composition comprising Tricyclodecandimethylol |
| 11/16/2005 | EP1337585B1 Silicone-modified single-component sealing compound |
| 11/16/2005 | EP1294807B1 Thickenable vinyl ester resin compositions |
| 11/16/2005 | CN1696193A Epoxy resin in polyvinyl acetal group |
| 11/16/2005 | CN1696169A Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
| 11/16/2005 | CN1227283C Method for making biodegradable polyhydroxyalkanoate copolymers having improved crystallization properties |
| 11/15/2005 | US6964813 Ultraviolet curable resin composition and photo solder resist including the same |
| 11/15/2005 | CA2298605C Curable compositions based on functional polysiloxanes |
| 11/10/2005 | WO2005105919A1 Resin composition for sealing and semiconductor device sealed with resin |
| 11/10/2005 | WO2005104744A2 Method for forming structures using an encapsulated adhesive material |
| 11/10/2005 | US20050250916 Maleic anhydride-styrene copolymer and polytriazine, decabromodiphenylethane; high performance prepreg, laminate and composite material; low dielectric loss and low dielectric constant |