| Patents for C08L 63 - Compositions of epoxy resins; Compositions of derivatives of epoxy resins (24,588) |
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| 02/01/2006 | CN1239664C Resin composition for sealing semiconductor, semiconductor device, semiconductor chip and semiconductor mounting structural body |
| 02/01/2006 | CN1239611C Flame-retardant polyester resin composition, molded article thereof, and method of molding the same |
| 02/01/2006 | CN1239609C Resin composition and its use and production process thereof |
| 02/01/2006 | CN1239608C Epoxy resin special material of compressed natural gas cylinder |
| 02/01/2006 | CN1239607C Thermal-setting resin composition and semiconcutor apparatus using same |
| 02/01/2006 | CN1239567C Crystalline epoxy, its producing method and solidifiable composition containing the same |
| 02/01/2006 | CN1239560C Potential curing agent for epoxy resin solidified epoxy resin composition |
| 02/01/2006 | CN1239558C Process for preparing nano-particle modified epoxy resin |
| 01/31/2006 | US6992166 Semiconductor dielectric |
| 01/31/2006 | US6992151 Environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications |
| 01/26/2006 | WO2006008984A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 01/26/2006 | CA2578687A1 Epoxy resin, epoxy resin composition, and cured product thereof |
| 01/25/2006 | EP1278801B1 Formulation for strippable adhesive and coating films |
| 01/25/2006 | EP1230302B1 Polymer blends containing modified polyesters |
| 01/25/2006 | EP1209211B1 Adhesive, adhesive member, circuit substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/25/2006 | EP1165692B1 Polyester molding composition |
| 01/25/2006 | CN1726242A Thermally hardenable epoxy resin composition having an improved impact resistance at low temperatures |
| 01/25/2006 | CN1724591A Organic silicon fibre retardant containing phosphorus and epoxy radical and its preparation method |
| 01/25/2006 | CN1724582A Method of preparing conductive polypyrrole film on epoxy resin surface |
| 01/25/2006 | CN1238422C Halogen-free flame-retarding epoxy resin composition containing phosphor and nitrogen , and preimpregnated material and laminate containing same |
| 01/25/2006 | CN1238421C Epoxy resin composition for packaging semiconductor and semiconductor device thereof |
| 01/25/2006 | CN1238410C Method for improving blister-resistant property of molded polyurea and method of making it |
| 01/24/2006 | US6989412 Epoxy molding compounds containing phosphor and process for preparing such compositions |
| 01/24/2006 | US6989411 Epoxy dispersions for use in coatings |
| 01/24/2006 | US6989173 Patching resins for insulating tapes |
| 01/19/2006 | WO2006007385A1 Structured resin systems with high thermal conductivity fillers |
| 01/19/2006 | WO2006006593A1 Epoxy resin molding material for sealing and electronic component device |
| 01/19/2006 | WO2006006592A1 Epoxy resin molding material for sealing and electronic component device |
| 01/19/2006 | WO2006005723A1 Amine compositions |
| 01/19/2006 | US20060014873 Encapsulating epoxy resin composition, and electronic parts device using the same |
| 01/19/2006 | US20060011301 Method for repairing loose molded-in bushings |
| 01/19/2006 | DE102004031190A1 Hitzeaktivierbares Klebeband für die Verklebung von elektronischen Bauteilen und Leiterbahnen Heat-activated adhesive tape for bonding electronic components and conductor tracks |
| 01/18/2006 | CN1723244A Photopolymerizable composition based on an epoxyvinylester resin and a urethane acrylate resin and use thereof for making dental prosthesis preforms and/or models |
| 01/18/2006 | CN1723243A Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler |
| 01/18/2006 | CN1723228A Water-based epoxy grout |
| 01/18/2006 | CN1723227A Castor oil/epoxidized soybean oil based elastomeric compositions |
| 01/18/2006 | CN1721476A Resin composition, and use and method for preparing the same |
| 01/18/2006 | CN1721475A Halogen-free epoxy resin and process for preparing same |
| 01/18/2006 | CN1237085C Carboxylated photosensitive resin, alkali-developable photocurable/heat-curable composition containing the same, and cured article obtained therefrom |
| 01/17/2006 | US6987161 Epoxy hardeners for low temperature curing |
| 01/12/2006 | US20060009593 Polyaddition compound and cationic electrodeposition paint which contains polyaddition compound |
| 01/12/2006 | US20060009591 Powder coating compositions containing anhydride end-caped crystalline polyesters |
| 01/12/2006 | US20060009580 Fast crystallizing polyester compositions |
| 01/12/2006 | US20060009547 Process for preparation of alicyclic diepoxy compound, curable epoxy resin compositions, epoxy resin compositions for the encapsulation of electronic components, stabilizers for electrical insulating oils, and casting epoxy resin compositions for electrical insulation |
| 01/12/2006 | US20060008664 Flame-retardant molded article and fabric product |
| 01/12/2006 | US20060008632 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 01/12/2006 | DE102004029174A1 Body (molded body of plastic e.g. a plate, a basin, garden pond and container) comprises a foil (plastic- or rubber foil) arranged on a side of the body with a coupling agent layer arranged on a foil |
| 01/11/2006 | EP1614713A1 Flame-retarded epoxy resin composition, prepregs containing the same, laminated sheets and printed wiring boards |
| 01/11/2006 | EP1613707A1 Radiation-cured substances |
| 01/11/2006 | EP1346101B1 Method for preparing fabric for cutting |
| 01/11/2006 | EP1297048B1 Low moisture absorption epoxy resin systems |
| 01/11/2006 | CN1718664A Preparation method of sealing packing material for in vivo embedding microelectronic device |
| 01/11/2006 | CN1718632A Hollow microbead reinforced epoxy resin composite material and its preparation method |
| 01/11/2006 | CN1236003C Adhesive and electrical device |
| 01/11/2006 | CN1235971C Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 01/11/2006 | CN1235933C Process for the production of polyester block copolymers, polyester block copolymer compositions and the preparation thereof |
| 01/11/2006 | CN1235931C Powder coatings or adhesives employing silanes or silane treated fillers |
| 01/10/2006 | US6984694 Epoxy-functional (meth)acrylic esters and styrenic and/or (meth)acrylic monomers to provide improve properties, e.g., molecular weight, viscosity, of virgin, recycled, and reprocessed condensation polymers, e.g., polyesters; food containers |
| 01/10/2006 | US6984674 Curable, weldable coating compositions |
| 01/05/2006 | US20060004140 Sealing material for liquid crystal and liquid crystal display cell using same |
| 01/05/2006 | US20060004127 Viscous chemical anchoring adhesive |
| 01/05/2006 | US20060003166 epoxy resin, polyamine curing agent which is a mixture of a polyamine compound or epoxy-amine adduct, and a (meth)acrylic acid copolymer free of epoxy or amine-reactive groups, and neutralized with a base; use in vehicle painting; fast curing, thickness, sag resistance |
| 01/05/2006 | US20060003165 Flame-retardant epoxy resin composition and cured product obtained therefrom |
| 01/04/2006 | EP1612811A1 Resin composition for forming a thermistor body, and thermistor |
| 01/04/2006 | EP1612597A1 Liquid crystal sealing agent and liquid crystalline display cell using the same |
| 01/04/2006 | EP1612251A1 Heat-activatable adhesive tape for bonding electronic components and printed circuit boards |
| 01/04/2006 | EP1312646B1 Aromatic polycarbonate resin composition and moldings |
| 01/04/2006 | CN1717451A Hardener composition for epoxy resins |
| 01/04/2006 | CN1717430A Flame-retardant epoxy resin composition and cured product obtained therefrom |
| 01/04/2006 | CN1717428A Photocurable and thermosetting resin composition and printed circuit boards made by using the same |
| 01/04/2006 | CN1715355A Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 01/04/2006 | CN1715329A Resin composition for forming a thermistor body, and thermistor |
| 01/04/2006 | CN1235066C Light diffusion film having controlled scattering characteristics and optical element and liquid crystal display comprising it |
| 01/04/2006 | CN1234767C Flow induced vibration model material of hydraulic gate |
| 01/04/2006 | CN1234706C Oxygen nitride heterocyclic compounds and preparation thereof |
| 12/29/2005 | WO2005124851A1 Resin paste for die bonding and its use |
| 12/29/2005 | WO2005123835A1 Highly concentrated, aqueous oligoester and polyester formulations |
| 12/29/2005 | WO2005123825A2 High thermal conductivity materials with grafted surface functional groups |
| 12/29/2005 | WO2005123803A1 Cationically photopolymerizable composition and optoelectronic component using same |
| 12/29/2005 | WO2005123802A1 Curing agents for epoxy resins |
| 12/29/2005 | WO2005123801A1 Polyaminoamide-monoepoxy adducts |
| 12/29/2005 | WO2005123271A2 Method of producing an epoxy composition |
| 12/29/2005 | US20050288457 Co-curable compositions |
| 12/29/2005 | US20050288455 Curable epoxy resin composition |
| 12/29/2005 | US20050288437 Heat-activable adhesive tape for bonding electronic components and conductor tracks |
| 12/29/2005 | US20050288396 Epoxy resin compositions |
| 12/29/2005 | US20050287328 Method of producing laminates, and laminates |
| 12/29/2005 | US20050287302 Aqueous non-ionically stabilized epoxy resins |
| 12/29/2005 | DE102004029310A1 Hochkonzentrierte, wässrige Formulierungen von Oligo-und Polyestern Highly concentrated aqueous formulation of oligo- and polyesters |
| 12/29/2005 | CA2570359A1 Method of producing an epoxy composition |
| 12/28/2005 | EP1608717A2 Method and apparatus for bonding and debonding adhesive interface surfaces |
| 12/28/2005 | EP1123348B1 Impact-resistant epoxide resin compositions |
| 12/28/2005 | CN1712460A Cationic electrodeposition coating composition |
| 12/28/2005 | CN1712448A Production of polyether modified epoxy resin multipolymer containing azacycl |
| 12/28/2005 | CN1233736C Toughened epoxy resin composition and its preparation method |
| 12/28/2005 | CN1233735C Epoxy resin composition and its preparation method |
| 12/28/2005 | CN1233708C Polymer cladding layer material of isocyarate crosslinked epoxy resin for integrated optical device |
| 12/28/2005 | CN1233679C Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 12/27/2005 | US6979712 comprises novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, phenolic resin, phenolic hydroxyl group-containing phosphorus compound, and filler |
| 12/22/2005 | WO2005121254A1 Thermoplastic resin composition and molded articles |