| Patents for C08G 59 - Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by reaction of epoxy polycondensates with monofunctional low-molecular-weight compounds; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups (30,286) |
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| 12/08/2004 | CN1179244C Photopolymerizable thermosetting resin composition |
| 12/08/2004 | CN1179005C Polyester with acid functional group and epoxy functional group |
| 12/02/2004 | WO2004104101A1 Electric conductor provided with an adherent layer and method for the production of said electric conductor |
| 12/02/2004 | WO2004104098A2 Stabilized flame retardant additives and their use |
| 12/02/2004 | WO2004104097A1 Epoxy resin composition |
| 12/02/2004 | WO2004104066A1 Particulate coating having improved chip resistance, uv durability, and color stability |
| 12/02/2004 | US20040242867 Photoinitiators; basic catalyst; absorption of light |
| 12/02/2004 | US20040242839 Waterproofing, heat resistance, radiation transparent; encapsulating electronics |
| 12/02/2004 | US20040242836 4-aminodiphenylamine with a second aromatic amine, an anhydride or boron trifluoride piperazine; Vacuum Assisted Resin Transfer Molding Resins; low viscosity processing, low temperature gelation/vitrification, high mechanical properties; aircraft |
| 12/02/2004 | US20040242835 High solid coatings; adhesives |
| 12/02/2004 | US20040242834 Blends; heat resistance; semiconductor sealing; reacting phenol with dicyclopentadiene in presence ofacid catalyst |
| 12/02/2004 | US20040242829 Applying to substrate; low temperature curing; solvent resistance, bonding strength to copper substrate, durability |
| 12/02/2004 | US20040242818 Mixture of cationic polymer, sulfonium acid generator and odor reducer |
| 12/02/2004 | US20040242806 Curable resin composition |
| 12/02/2004 | DE10321536A1 Aminoalkohol-basierte Tenside mit geringer Oberflächenspannung und deren Verwendung Aminoalcohol-based surfactants with low surface tension and their use |
| 12/01/2004 | EP1481999A2 Thermally-conductive epoxy resin molded article and method of producing the same |
| 12/01/2004 | EP1481973A1 Heterocycle-bearing onium salts |
| 12/01/2004 | EP1481420A1 B-stageable underfill encapsulant and method for its application |
| 12/01/2004 | EP1481419A1 Underfill encapsulant for wafer packaging and method for its application |
| 12/01/2004 | EP1481019A1 Process for preparing chain extended thermoplastic guanidinium polymers |
| 12/01/2004 | EP1480968A1 Thioxanthone derivatives, and their use as cationic photoinitiators |
| 12/01/2004 | EP1259566B1 Thermosetting resin composition |
| 12/01/2004 | CN1551910A Adhesive for gas barrier laminates and laminated films |
| 12/01/2004 | CN1551320A Anisotropic conductive adhesive, assembling method,electrooptical device module and electronic device |
| 12/01/2004 | CN1550895A Negative type photosensitive resin composition containing a phenol-biphenylene resin |
| 12/01/2004 | CN1178287C Reworkable thermosetting resin composition |
| 12/01/2004 | CN1177895C Toughened thermosetting resin and its preparation method |
| 12/01/2004 | CN1177881C Modified epoxy resin, epoxy resin composition and cured product thereof |
| 11/30/2004 | US6824858 Photocurable/thermosetting composition for forming matte film |
| 11/30/2004 | CA2127378C Autocrosslinkable polyacrylate resin, nonaqueous coating and process for the preparation of a multicoat finish |
| 11/25/2004 | WO2004101643A1 Epoxy resin, method for producing same and epoxy resin composition |
| 11/25/2004 | WO2004085510B1 Reactive hot melt adhesive formulation for joining stamped metal and plastic parts |
| 11/25/2004 | US20040236061 Ketimine reaction product of a ketone and a mixture of polyoxypropylenediamines of molecular weights 200-500 and 1000-3000, especially carried out in the presence of a tertiary amine sulfonate such as triethylamine p-toluenesulfonate; storage stable one-component curable epoxy resin; improved adhesion |
| 11/25/2004 | US20040236037 Particulate coatings having improved chip resistance, UV durability, and color stability |
| 11/25/2004 | US20040234773 Epoxy resin |
| 11/25/2004 | US20040234763 Anisotropically conductive adhesive, mounting method, electro-optical device module, and electronic device |
| 11/25/2004 | US20040232563 Adhesive tape |
| 11/24/2004 | EP1479706A1 Epoxy resin curing agents and epoxy resin compositions |
| 11/24/2004 | EP1478678A1 Prepolymers for native epoxide resins and method for producing said prepolymers |
| 11/24/2004 | EP1478674A1 Low-corrosive epoxy resins and production method therefor |
| 11/24/2004 | EP1420744A4 Amine compounds and curable compositions derived therefrom |
| 11/24/2004 | EP0847417B1 Compositions containing 1,3,5-triazine carbamates and epoxy compounds |
| 11/24/2004 | CN1549837A Low viscosity curing agents compositions in epoxy resin systems for low temperature cure applications |
| 11/24/2004 | CN1548463A Epoxy resin polymer, its prepn and liquid crystal regioselective-layer material therewith |
| 11/24/2004 | CN1176890C Use of bisphenol in preparing polycarbonic ester and opoxy resin |
| 11/23/2004 | US6822341 Latent catalysts for molding compounds |
| 11/23/2004 | US6822055 Compounding epoxidation product of carboxylic acid ester using crosslinking agent; molding, curing; free radical polymerization |
| 11/23/2004 | US6821657 Preheating a mixture of an epoxy resin, and organosilicon compound and water prior to adding a curing agent is effective to obtain a thermosetting resin composition which has a low viscosity at a room temperature |
| 11/23/2004 | CA2340919C Thermosetting compositions containing epoxy-functional polymers prepared using atom transfer radical polymerization |
| 11/23/2004 | CA2127881C Epoxy resin composition and applications, particularly in composite structures |
| 11/18/2004 | WO2004099313A1 Flame-retardant molding compositions |
| 11/18/2004 | WO2004099312A1 Epoxy resin compositions containing mannich bases, suitable for high-temperature applications |
| 11/18/2004 | WO2004099311A1 Mannich bases and method for the production of mannich bases |
| 11/18/2004 | WO2004099294A1 Use of diazepine derivatives as latent hardening components |
| 11/18/2004 | WO2004099286A1 Cationically photopolymerizable resin composition and optical disk surface protection material |
| 11/18/2004 | WO2004099284A1 Anaerobic curing composition |
| 11/18/2004 | US20040230000 Epoxy resins, phenolic resins, a synthetic rubber (acrylonitrile-butadiene), and microcapsules having a thermoplastic resin shell; improved bonding strength and storage stability; microelectronics; pressure sensitive adhesives |
| 11/18/2004 | US20040229982 Stabilized flame retardant additives and their use |
| 11/18/2004 | US20040229768 Low surface tension surfactants based on amino alcohol and their use |
| 11/18/2004 | US20040229029 Porous wet friction material utilizing a compliant epoxide resin binder system |
| 11/18/2004 | US20040227255 Liquid epoxy resin composition and flip chip semiconductor device |
| 11/18/2004 | DE19638630B4 UV- und thermisch härtbare Gießharzformulierung und ihre Verwendung zum Unterfüllprozeß bei elektrischen und elektronischen Bauelementen UV and thermally curable casting resin formulation and their use for Unterfüllprozeß in electrical and electronic components |
| 11/18/2004 | DE102004015663A1 Verwendung von Diazepin-Derivaten als latente Härterkomponente Use of diazepine derivatives as latent hardener component |
| 11/17/2004 | EP1477473A1 Aminoalcohol based surfactants with reduced surface tension and the use thereof |
| 11/17/2004 | EP1476181A2 Polyalkylene polymer compounds and uses thereof |
| 11/17/2004 | EP1377621B1 Silicone liquid crystals, vesicles, and gels |
| 11/17/2004 | EP1368408B1 Oxalkylation products produced from epoxides and amines and their use in pigment preparations |
| 11/17/2004 | EP1119592B1 Powder clear varnish and aqueous powder clear varnish slurry |
| 11/17/2004 | CN1546548A High purity low molecule biphenol A epoxy resin synthetic process |
| 11/16/2004 | US6819004 Encapsulated with epoxy resin; fluid flow |
| 11/16/2004 | US6818727 Highly purified epoxy resin |
| 11/16/2004 | US6818702 Thermosetting resin composition and flexible circuit overcoating material comprising the same |
| 11/16/2004 | US6818318 Underfill sealant of epoxy resins, adhesion promotor and curative of N-containing compound and transition metal complex |
| 11/16/2004 | US6818307 Comprises polyphosphazene compound as hardening promoter; for production of dielectrics/printed circuit boards; prepregs |
| 11/14/2004 | CA2460614A1 Low surface tension surfactants based on amino alcohol and their use |
| 11/11/2004 | WO2004096885A1 Resin composition for prepreg |
| 11/11/2004 | WO2004096878A1 Curing resin composition |
| 11/11/2004 | WO2004015002A8 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices |
| 11/11/2004 | WO2003102047A9 Demulsifiers |
| 11/11/2004 | US20040225080 Phosphine oxide hydroxyaryl mixtures with novolac resins for co-curing epoxy resins |
| 11/11/2004 | US20040225025 A curable formulation for displays containing(i) an epoxy resin; and(ii) a hydroxy-functional compound; resistance to yellowing |
| 11/11/2004 | US20040224163 the epoxy resin having molecular chains that contain an azomethine group ( CH=N ); applying a magnetic field to the epoxy resin composition to orient the molecular chains of the epoxy resin in a specific direction then curing the epoxy resin |
| 11/11/2004 | US20040224157 Multi-layered macromolecules and methods for their use |
| 11/10/2004 | EP1475422A1 Solution type coatings |
| 11/10/2004 | EP1475412A1 Epoxy compositions containing a Mannich base suitable for high temperature applications |
| 11/10/2004 | EP1475411A1 Mannich bases and Preparation of Mannich bases |
| 11/10/2004 | EP1475398A1 Indole resins, epoxy resins and resin compositions containing the same |
| 11/10/2004 | EP1314197A4 High reliability non-conductive adhesives for non-solder flip chip bondings and flip chip bonding method using the same |
| 11/10/2004 | EP1203029B1 Process for the continuous production of gel free polymers, and powder and liquid coating applications containing gel free polymers |
| 11/10/2004 | EP1115770B1 Adhesive system to form reversible glued joints |
| 11/10/2004 | EP0927726B1 Photocatalytic composition |
| 11/10/2004 | CN1545729A 胶粘带 Adhesive tape |
| 11/10/2004 | CN1545528A Deodorizing agent for sulfur- or nitrogen-containing initiators |
| 11/10/2004 | CN1544502A Method for producing epoxy resin using bisphenol A and chloroepoxy propane |
| 11/10/2004 | CN1544501A Method for removing inorganic chloride from epoxy resin |
| 11/10/2004 | CN1175037C Phenol curing agent for epoxy resin and epoxy resin composition using said curing agent |
| 11/04/2004 | WO2004094500A1 Powdered epoxy composition |
| 11/04/2004 | WO2004078853A3 Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
| 11/04/2004 | US20040220380 After being cured, will provide glass transition temperatures, low refractive indices, light transmission, and scratch resistance, and can be used in transparent layers and as substitutes for glass, for packaging an image sensor, encapsulating |
| 11/04/2004 | US20040219451 Heat resistance; impact strength; blend of phenolic resin, novolaks and epoxy compound; forming photoresist pattern |